Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M
Konferenzbeitrag
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Konferenzbeitrag
2016Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M.
Zeitschriftenaufsatz
2015Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.
Konferenzbeitrag
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Konferenzbeitrag
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Konferenzbeitrag
2014Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.
Konferenzbeitrag
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Zeitschriftenaufsatz
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Konferenzbeitrag
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Konferenzbeitrag
2010Wälzbeständigkeit von ta-C Dünnschichten unter hohen Hertzschen Beanspruchungen bis zu 3000 MPa
Woydt, M.; Manier, C.-A.; Weihnacht, V.; Brückner, A.
Zeitschriftenaufsatz
2009Slip-rolling resistant thin film ta-C coatings for up to 3.000 MPa of Hertzian contact pressure
Woydt, M.; Manier, C.-A.; Brückner, A.; Weihnacht, V.
Konferenzbeitrag