Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2018Channel Characterization for Chip-scale Wireless Communications within Computing Packages
Timoneda, X.; Cabellos-Aparicio, A.; Manessis, D.; Alarcon, E.; Abadal, S.
Konferenzbeitrag
2018Millimeter-Wave Propagation within a Computer Chip Package
Timoneda, X.; Abadal, S.; Cabellos-Aparicio, A.; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.
Konferenzbeitrag
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Konferenzbeitrag
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Aufsatz in Buch
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Vortrag
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Konferenzbeitrag
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2015Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.
Konferenzbeitrag
2015Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2015Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Zeitschriftenaufsatz
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Konferenzbeitrag
2014A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2014Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer
Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D.
Konferenzbeitrag
2014Embedding of power semiconductors for innovative packages and modules
Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Konferenzbeitrag
2014Next generation high power electronic module based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Konferenzbeitrag
2014Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages
Wong, C.S.; Bennett, N.S.; Manessis, Dionysius; Danilewsky, A.; McNally, P.J.
Zeitschriftenaufsatz
2014Power electronics packages with embedded components - recent trends and developments
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Zeitschriftenaufsatz
2013Development of Embedded Power Electronics Modules for Automotive Applications
Böttcher, Lars; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Konferenzbeitrag
2013Power modules with embedded chips for automotive applications
Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.
Konferenzbeitrag
2013Power modules with embedded components
Ostmann, Andreas; Boettcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Lang, Klaus-Dieter
Konferenzbeitrag
2012Development of embedded power electronics modules
Boettcher, Lars; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2012Embedded power electronics for automotive applications
Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.
Konferenzbeitrag
2012Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2011Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2011Embedding technology for manufacturing of high density SiP
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Konferenzbeitrag
2011Modular microelectronics by system-in-packages with embedded components
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
Konferenzbeitrag
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Konferenzbeitrag
2011Non-destructive X-Ray mapping of strain & warpage of die in packaged chips
Stopford, J.; Henry, A.; Manessis, D.; Bennett, N.; Horan, K.; Allen, D.; Wittge, J.; Boettcher, L.; Cowley, A.; McNally, P.J.
Konferenzbeitrag
2011Realization of power modules by chip embedding technology
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2011System-in-Packages with embedded components for modular systems
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
Konferenzbeitrag
2010Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2010Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.
Konferenzbeitrag
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Konferenzbeitrag
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Konferenzbeitrag, Zeitschriftenaufsatz
2009Advancements in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2009Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages
Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Konferenzbeitrag
2009Chip embedding technology - New technological challenges for a reliable System-in-Package realization
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Konferenzbeitrag
2009Embedded Chip Packages Technology and Applications
Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2009Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2009Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2009Microtechnology platform for cell cell interaction detection
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Konferenzbeitrag
2009Realisation of embedded-chip QFN packages - technological challenges and achievements
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H.
Konferenzbeitrag
2009Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.
Patent
2008Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Lee, J.-S.; Chu, K.-M.; Patzelt, R.; Manessis, D.; Ostmann, A.; Jeon, D.Y.
Zeitschriftenaufsatz
2008Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Konferenzbeitrag
2008Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Konferenzbeitrag
2008Embedding technologies for SiP manufacturing
Manessis, D.; Ostmann, A.
Zeitschriftenaufsatz
2008Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2008Industrial and technical aspects of chip embedding technology
Ostmann, A.; Manessis, D.; Stahr, J.; Beesley, M.; Cauwe, M.; Baets, J. de
Konferenzbeitrag
2008Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R.
Zeitschriftenaufsatz
2008Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2008Realization of system-in-package modules by embedding of chips
Boettcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2008Stacking of ultra-thin film packages
Ko, C.-T.; Shih, Y.-C.; Chang, J.-Y.; Kuo, T.-Y.; Chen, Y.-H.; Ostmann, A.; Manessis, D.
Konferenzbeitrag
2007Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N.
Konferenzbeitrag
2007Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R.
Konferenzbeitrag
2007Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Konferenzbeitrag
2007Lamination process studies for realisation of chip embedding technologies-current applications and technical challenges
Manessis, D.; Ostmann, A.; Yen, S.-F.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Konferenzbeitrag
2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R.
Konferenzbeitrag
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Konferenzbeitrag
2007Realization of large area stretchable electronic systems using lamination processes
Loeher, T.; Manessis, D.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2007Reliability aspects of embedded chips
Ostmann, A.; Manessis, D.; Cauwe, M.; Sommer, J.-P.
Konferenzbeitrag
2007Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Konferenzbeitrag
2006A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Konferenzbeitrag
2006Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
Lee, J.-S.; Chu, K.-M.; Jeon, D.Y.; Patzelt, R.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2006Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2006Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Zeitschriftenaufsatz
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2006Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H.
Konferenzbeitrag
2006Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2006Verfahren zum Herstellen einer Durchkontaktierung zwischen zwei Oberflaechen eines Halbleitersubstrats
Böttcher, L.; Ostmann, A.; Manessis, D.
Patent
2006Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R.
Patent
2006Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R.
Patent
2005Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.
Zeitschriftenaufsatz
2005The development of balling technologies for wafer level devices with pitches down to 400µm pitch
Whitmore, M.; Staddon, M.; Manessis, D.
Konferenzbeitrag
2005Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2005FP5-CSG-IMECAT - Highlight of a EC funded project on lead-free materials and assembly development technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer bumping technology
Pudas, M.; Manessis, D.; Patzelt, R.; Hagberg, J.; Leppävuori, S.; Vähäkangas, J.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2005Highlights of a EC funded project on Lead-free Materials and Assembly Development Technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2005Lead-free flip chip: A comparison between lead-free solder and adhesives
Vandecasteele, B.; Manessis, D.; Vanfleteren, J.; Ostmann, A.; Hagedorn, H.W.; Wiese, J.
Konferenzbeitrag
2005The packaging and assembly of a waferscale system on chip
Veen, C. van; Samber, M. de; Bergveld, H.; Ackerveken, A.; Slob, C.; Manessis, D.; Ostmann, A.; Whitmore, M.
Konferenzbeitrag
2005Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2005Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2005Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications
Gonzalez, M.; Vandevelde, B.; Vanfleteren, J.; Manessis, D.
Konferenzbeitrag
2004The development of a low cost wafer level bumping technique
Whitmore, M.; Staddon, M.; Manessis, D.
Konferenzbeitrag
2004Stencil printing technology for 100m flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.
Zeitschriftenaufsatz
2004Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Zeitschriftenaufsatz
2004Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Konferenzbeitrag
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Konferenzbeitrag
2003Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Konferenzbeitrag
2003Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2003Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2002Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2002Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag