Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Advanced approach of calculating wire bond pull test correction factors
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.
Aufsatz in Buch
2014Investigating wire bonding pull testing and its calculation basics
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.
Konferenzbeitrag
2014Strain-induced damage of metals under large plastic deformation: Theoretical framework and experiments
Tutyshkin, N.; Müller, W.H.; Wille, R.; Zapara, M.
Zeitschriftenaufsatz
2013Growth and closure of voids in metals at negative stress triaxialities
Zapara, M.; Tutyshkin, N.; Müller, W.H.
Konferenzbeitrag
2013Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D.
Konferenzbeitrag
2012Einfluss der Drahtbondgeometrie auf die plastischen Dehnungen in Heel-Bereich von AlSi1-Standard-Drahtbondverbindungen
Kripfgans, Johannes; Schneider-Ramelow, M.; Schmitz, S.; Müller, W.H.
Zeitschriftenaufsatz
2012Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Sbeiti, Mohamad; Müller, W.H.; Schneider-Ramelow, M.; Geißler, U.; Schmitz, S.
Konferenzbeitrag, Zeitschriftenaufsatz
2011Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts
Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.
Zeitschriftenaufsatz
2010Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B.
Konferenzbeitrag
2010Employing solder joints of concave shape for monitoring electromigration independently of material interfaces
Jaeschke, J.; Müller, W.H.; Nissen, N.; Reichl, H.
Konferenzbeitrag
2010Investigation of the solder joint fatigue life in combined vibration and thermal cycling tests
Eckert, T.; Krüger, M.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010Thermomechanical description of interface formation in aluminum ultrasound (US)-wedge/wedge-wirebond contacts
Müller, W.H.; Sbeiti, M.; Schneider-Ramelow, M.; Geissler, U.
Konferenzbeitrag
2009Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2009Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2009Evaluating the effects of electromigration by using adjustable solder joints of concave shape
Jaeschke, J.; Kleff, J.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2009Modeling Solder Joint Fatigue in Combined Environmental Reliability Tests with Concurrent Vibration and Thermal Cycling
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2009Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints
Eckert, T.; Kornelius, T.; Bochow-Ness, O.; Müller, W.H.; Reichl, H.
Konferenzbeitrag
2009A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments
Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2008Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2008Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2008Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages
Shirangi, H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2006Improved approximations of Fourier coefficients for computing periodic structures with arbitrary stiffness distribution
Kaßbohm, S.; Müller, W.H.; Feßler, R.
Konferenzbeitrag, Zeitschriftenaufsatz
2005Fourier series for computing the response of periodic structures with arbitrary stiffness distribution
Kaßbohm, S.; Müller, W.H.; Feßler, R.
Konferenzbeitrag, Zeitschriftenaufsatz
2000Ecto-alkaline phosphatase activity identified at physiological pH range on intact P19 and HL-60 cells is induced by retinoic acid
Scheibe, R.J.; Kuehl, H.; Krautwald, S.; Meissner, J.D.; Mueller, W.H.
Zeitschriftenaufsatz