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| 2019 | Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Zeitschriftenaufsatz |
| 2019 | High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D. | Konferenzbeitrag |
| 2019 | Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Zeitschriftenaufsatz |
| 2019 | A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2018 | Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Can Bond Wires really be used as Antennas?
Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, M.; Panchenko, I.; Künzelmann, U.; Reif, J.; Geidel, M.; Wolf, M.J.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2018 | Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2018 | Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2018 | Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Differential-Line Characterization Using Mixed-Port Scattering Parameters
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Konferenzbeitrag |
| 2018 | Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Effects of Glob Top on mmWave Bond Wire Antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | High Density Interconnect Processes for Panel Level Packaging
Ostmann, A.; Schein, F.-L.; Dietterle, M.; Kunz, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | High temperature encapsulation for smart power devices
Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Impact of multilayer stack-ups on bond wire antennas at millimetre-wave frequencies
Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M. | Konferenzbeitrag |
| 2018 | Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Zeitschriftenaufsatz |
| 2018 | On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H. | Zeitschriftenaufsatz |
| 2018 | Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M. | Konferenzbeitrag |
| 2018 | Roles and Requirements of Electronic Packaging in 5G
Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M. | Konferenzbeitrag |
| 2018 | SmartSensX. Ein Konzept für vernetzte tragbare Sensoren zur Anwendung in der Softrobotik und Mensch Maschine Interaktion
Hackbart, R.; Kostelnik, J.; Kuschan, Jan; Schmidt, Henning; Krüger, Jörg; Vieroth, R.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D. | Konferenzbeitrag |
| 2018 | A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging
Grams, A.; Curran, B.; Kuttler, S.; Reyes, J.; Wüst, F.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Konferenzbeitrag |
| 2017 | A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Comprehensive AC performance analysis of ceramic capacitors for DC link usage
Klein, K.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Konferenzbeitrag |
| 2017 | Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M. | Konferenzbeitrag |
| 2017 | Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C. | Konferenzbeitrag |
| 2017 | Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R. | Konferenzbeitrag |
| 2017 | Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O. | Zeitschriftenaufsatz |
| 2017 | Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Novel EDA Tools for system planning and 3D layout design of smart items
Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D. | Konferenzbeitrag |
| 2017 | Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Zeitschriftenaufsatz |
| 2017 | Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2017 | Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Konferenzbeitrag |
| 2016 | Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Konferenzbeitrag |
| 2016 | Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, Piotr; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D. | Konferenzbeitrag |
| 2016 | Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A. | Konferenzbeitrag |
| 2016 | Effective method for filter design and semiconductor and inductors loss calculation
Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Zeitschriftenaufsatz |
| 2016 | Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D. | Konferenzbeitrag |
| 2016 | Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D. | Konferenzbeitrag |
| 2016 | Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Evaluation of indicators supporting the sustainable design of electronic systems
Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2016 | Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, Kevin; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2016 | High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2016 | Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2016 | Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D. | Abstract |
| 2016 | Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2016 | Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, Kai; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, Kai; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Konferenzbeitrag |
| 2016 | Obsolescence of electronics - the example of smartphones
Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2016 | On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Konferenzbeitrag |
| 2016 | Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, Charles-Alix; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B. | Dissertation |
| 2016 | Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2016 | Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, Kai; Wegner, M.; Fischer, T.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, Hermann; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2016 | Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2015 | An accurate back to front design methodology for PT based load resonant converters
Yang, Yujia; Radecker, M.; Lang, K.-D.; Fischer, W.-J. | Konferenzbeitrag |
| 2015 | Addressing sustainability and flexibility in manufacturing via smart modular machine tool frames to support sustainable value creation
Peukert, B.; Benecke, S.; Clavell, J.; Neugebauer, S.; Nissen, N.F.; Uhlmann, E.; Lang, K.-D.; Finkbeiner, M. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2015 | Advanced approach of calculating wire bond pull test correction factors
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D. | Aufsatz in Buch |
| 2015 | Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Hochstromkontakte für Smart-Power Mechanics
Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2015 | Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production
Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2015 | Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Development of a microcamera with embedded image processor using panel level packaging
Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S. | Konferenzbeitrag |
| 2015 | Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Zeitschriftenaufsatz |
| 2015 | Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from +30°C up to +180°C
Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Heterogeneous integration of a miniaturized W-band radar module
Becker, Karl-Friedrich; Georgi, L.; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S.; Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2015 | High frequency impedance of Li-ion batteries
Doersam, T.; Schoerle, S.; Spieker, C.; Waldmann, T.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D. | Konferenzbeitrag |
| 2015 | Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O. | Konferenzbeitrag |
| 2015 | Laser melting of metal powders using Nd:yag and compact diode laser for micro particle deposition
Azhdast, M.H.; Lux, O.; Fritsche, H.; Eichler, H.J.; Azdasht, G.; Lüdeke, H.; Glaw, V.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Microstructural evolution of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2015 | Modeling method of stray magnetic couplings in an EMC filter for power electronic devices
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2015 | Nano particle production by laser ablation and metal sputtering on Si-wafer substrate
Azhdast, M.H.; Azdasht, G.; Lüdeke, H.; Lang, K.-D.; Glaw, V. | Konferenzbeitrag |
| 2015 | Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H. | Konferenzbeitrag |
| 2015 | Reducing inductor size in high frequency grid feeding inverters
Hoffmann, S.; Hoene, E.; Zeiter, O.; Lang, K.-D.; Feix, G. | Konferenzbeitrag |
| 2015 | Sea water magnesium fuel cell power supply
Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2015 | A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D. | Konferenzbeitrag |
| 2015 | Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D. | Konferenzbeitrag |
| 2014 | Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Konferenzbeitrag |
| 2014 | Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H. | Zeitschriftenaufsatz |
| 2014 | Approaches for system reliability in consideration of application oriented loads as well as physics-of-failure
Straube, S.; Hahn, D.; Jerchel, K.; Middendorf, A.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Array fiber welding on micro optical glass substrates for chip-to-fiber coupling
Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Automotive high voltage grid simulation. Modelling and simulation high voltage car grids from system prospective
Schörle, S.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, Kai; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Challenges in 3D die stacking
Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | CO2-laser drilling of TGVs for glass interposer applications
Brusberg, L.; Queisser, M.; Neitz, M.; Schröder, H.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer
Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D. | Konferenzbeitrag |
| 2014 | Highly ionized sputter deposition into through silicon vias with aspect ratios up to 15:1
Viehweger, Kay; Weichart, J.; Elghazzali, M.; Reynolds, G.J.; Wolf, M.J.; Lang, K.-D.; Koller, A.; Dill, A. | Konferenzbeitrag |
| 2014 | The influence of liners with Ti, Ta or Ru finish on thin Cu films
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Investigating wire bonding pull testing and its calculation basics
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology
Brusberg, L.; Herbst, C.; Neitz, M.; Schröder, H.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Mechanical properties of individual composite poly(methyl-methacrylate) -multiwalled carbon nanotubes nanofibers
Grabbert, N.; Wang, B.; Avnon, A.; Zhuo, S.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Kaletta, K.; Lang, K.-D.; Ngo, H.-D. | Konferenzbeitrag |
| 2014 | A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2014 | Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Next Generation Substrates - wie elektronische Systeme maskenlos gedruckt werden
Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | On double sided cooling
Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H. | Konferenzbeitrag |
| 2014 | Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Packages for fast switching HV GaN power devices
Klein, K.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Precision jetting of solder paste - a versatile tool for small volume production
Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Predicting magnetic coupling of power inductors
Hoffmann, S.; Hoene, E.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip
Schreier-Alt, T.; Ansorge, F.; Chmiel, G.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools
Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Reliability improvements in electronic systems by combining condition monitoring approaches
Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | System simulation of automotive high voltage grids: Modelling of power converters and connecting cables
Schoerle, S.; Hoene, E.; Hoffmann, S.; Kuczmik, A.; Lang, K.-D. | Konferenzbeitrag |
| 2014 | Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Ostmann, A.
: Lang, K.-D.; Vanfleteren, J.; Nowottnick, M. | Dissertation |
| 2014 | A wide range power cell for modular interleaving supplies
Radecker, M.; Yang, Y.; Nicollini, A.; Le, L.; Lang, K.-D.; Kruse, P.D.; Feistel, K.; Teixeira, L.; Dennstedt, D.; Herfurth, M. | Konferenzbeitrag |
| 2013 | Anwendungen hydrophober Oberflächenmodifikationen in der Mikrosystemtechnik
Georgi, L. von; Kahle, R.; Lang, K.-D.; Bauer, J.; Braun, T.; Becker, K.-F.; Jung, E. | Zeitschriftenaufsatz |
| 2013 | Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C. | Konferenzbeitrag |
| 2013 | Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C. | Konferenzbeitrag |
| 2013 | Approach for reliability of thermal interface materials in battery cell sensors
Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Development of a 40 Watts 5 kV converter using Piezoelectric Transformer for Rheoelectrical damper application
Yang, Y.; Radecker, M.; Guttowski, S.; Lang, K.-D.; Fontana da Silva, B.; Bellinaso, L.V.; Engleitner, R.; Vazquez Carazo, A. | Konferenzbeitrag |
| 2013 | Early-Warning System for Machine Failures. Self-Sufficient Radio Sensor Systems for Wireless Condition Monitoring
Niedermayer, M.; Armbruster, E.; Wirth, R.; Haubold, A.; Benecke, S.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | European R&D trends in wire bonding technologies
Schneider-Ramelow, M.; Göhre, J.-M.; Geißler, U.; Schmitz, S.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | From wafer level to panel level mold embedding
Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Generative Fertigungstechnologien für eine Direktintegration von mikroelektronischen Komponenten und Kontaktstrukturen
Ifland, D.; Ansorge, F.; Baar, C.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2013 | Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Löten ade - elektronische Systeme aus dem Drucker?
Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2013 | Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H. | Konferenzbeitrag |
| 2013 | Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
Lang, K.-D.; Ndip, I.; Guttowksi, S. | Konferenzbeitrag |
| 2013 | A new aluminium alloy for heavy wire bonding in power
Geißler, Ute; Göhre, J.-M.; Thomas, S.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Optical system components for navigation grade fiber optic gyroscopes
Heimann, M.; Liesegang, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Piezoresistive stress sensor for inline monitoring during assembly and packaging of QFN
Schreier-Alt, T.; Chmiel, G.; Ansorge, F.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Power modules with embedded chips for automotive applications
Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Precision jetting of glob top materials - A methodology for process optimization
Becker, K.-F.; Koch, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Sensor integrated microfluidics for compact micro-reactors
Jung, E.; Blechert, M.; Schuldt, V.; Hubl, M.; Georg, L.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Smart power module molding advances: Evaluating high temperature suitability of molding compounds
Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Thermoplastic based system-in-package for RFID application
Kallmayer, C.; Pahl, B.; Grams, A.; Marques, J.; Lang, K.-D.; Suwald, T. | Konferenzbeitrag |
| 2013 | Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | 3D integration - technology and test strategy
Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Copper filling of TSVs for interposer applications
Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C. | Konferenzbeitrag |
| 2012 | Development of rechargeable micro batteries based on micro channel structures
Hahn, Robert; Höppner, K.; Marquardt, K.; Eisenreich, M.; Ferch, M.; Wilke, M.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Eco-reliability as a new approach of multi-criteria optimisation
Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Embedded power electronics for automotive applications
Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Energy efficient network equipment for data centers
Schlosser, A.; Stobbe, L.; Nissen, N.F.; Schappi, B.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Energy harvesting on its way to a reliable and green micro energy source
Benecke, S.; Ruckschloss, J.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Environmentally conscious design of autonomous power supplies for distributed micro-systems
Benecke, S.; Rueckschloss, J.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | From CRT to flat displays - Consequences for collection and recycling
Chancerel, P.; Deubzer, O.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2012 | Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M. | Aufsatz in Buch |
| 2012 | Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Mass flows of selected target materials in LED products
Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Overview of RoHS 2.0 and status of exemptions
Deubzer, O.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Reliability of power semiconductor modules combining active and passive temperature cycling
Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D. | Konferenzbeitrag |
| 2012 | Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2012 | Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Condition monitoring system adapted for photovoltaic power converter
Guenther, J.; Rothe, M.; Hefer, J.; Middendorf, A.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2011 | Eco-Reliability - A Fusion of GreenTech and HighTech
Nissen, N.F.; Wittler, O.; Middendorf, A.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2011 | Electronics condition monitoring for improving sustainability of power electronics
Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards
Nowak, T.; Schacht, R.; Walter, H.; Wunderle, B.; Ras, M.A.; May, D.; Wittler, O.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M. | Konferenzbeitrag |
| 2011 | Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test
Goehre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Low temperature cure of BCB and the influence on the mechanical stress
Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Measurement of Young's modulus and residual stress of thin SiC layers for MEMS high temperature applications
Pabst, O.; Schiffer, M.; Obermeier, E.; Tekin, T.; Lang, K.-D.; Ngo, H.-D. | Konferenzbeitrag |
| 2011 | Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Modeling and optimization of energy harvesting-systems under non-ideal operating temperatures with regard to availability of power-supply and reduction of environmental impacts
Benecke, S.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Modular microelectronics by system-in-packages with embedded components
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects
Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Stress analysis during assembly and packaging
Schreier-Alt, T.; Unterhofer, K.; Ansorge, F.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | System-in-Packages with embedded components for modular systems
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D. | Konferenzbeitrag |
| 2011 | Vergleichende Tests von Mikrobrennstoffzellensystemen
Hahn, R.; Wagner, S.; Lang, K.-D.; Blechert, M. | Konferenzbeitrag |
| 2010 | Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors
Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D. | Konferenzbeitrag |
| 2010 | Application Center Smart System Integration - An example for efficient technology transfer
Pötter, H.; Hampicke, M.; Lang, K.-D. | Konferenzbeitrag |
| 2010 | Condition Monitoring for Maintenance, Repair and ReUse
Middendorf, A.; Günther, J.; Rothe, M.; Nissen, N.; Lang, K.-D. | Abstract |
| 2010 | Degradation of Heavy Wire Bond Interfaces
Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2010 | Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D. | Konferenzbeitrag |
| 2010 | Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D. | Konferenzbeitrag |
| 2010 | Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2010 | Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T. | Konferenzbeitrag |
| 2010 | Future perspectives: From packaging to system integration
Wolf, M.J.; Reichl, H.; Lang, K.-D. | Aufsatz in Buch |
| 2010 | Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 2010 | Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2010 | Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H. | Zeitschriftenaufsatz |
| 2010 | Silicon interposer for heterogeneous integration
Wolf, M.J.; Zoschke, K.; Wieland, R.; Klein, M.; Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 2010 | Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday
: Michel, B.; Lang, K.-D. | Buch |
| 2010 | TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D. | Konferenzbeitrag |
| 2009 | Aktive RFID
Pötter, H.; Hampicke, M.; Nachsel, R.; Hoherz, C.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2009 | FreshScan - Portables optisches Messsystem zur Überwachung des Frischegrades von Fleisch
Thomasius, R.; Kim, J.-U.; Nestler, V.; Reichl, H.; Jordan, G.; Schröder, H.; Lang, K.-D.; Maiwald, M.; Sumpf, B.; Schmidt, H.; Kronfeldt, H.-D.; Hengl, C.; Wulf, J. | Konferenzbeitrag |
| 2009 | Innovations Based on Hetero System Integration
Reichl, H.; Wolf, J.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2009 | Intelligente Sensoren: Trends und Technologien
Pötter, H.; Hampicke, M.; Schmitz, S.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2009 | Mit Komponenten zu miniaturisierten Systemen
Pötter, H.; Hampicke, M.; Lang, K.-D.; Reichl, H. | Aufsatz in Buch |
| 2009 | Moderne Packagingtechnologien - unverzichtbar für eine hochwertige Systemintegration
Pötter, H.; Hampicke, M.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2009 | Non-invasive mobile monitoring of meat quality
Jordan, G.; Thomasius, R.; Schröder, H.; Wulf, J.S.; Schlüter, O.; Sumpf, B.; Maiwald, M.; Schmidt, H.; Kronfeldt, H.-D.; Scheuer, R.; Schwägele, F.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2008 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2007/2008
: Lang, K.-D.; Pötter, H. | Jahresbericht |
| 2008 | Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination
Lang, K.-D.; Goehre, J.; Schneider-Ramelow, M. | Konferenzbeitrag |
| 2008 | Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M. | Zeitschriftenaufsatz |
| 2008 | Trends in der Mikrosystemtechnik
Hampicke, M.; Reichl, H.; Lang, K.-D.; Schmitz, S.; Pötter, H. | Zeitschriftenaufsatz |
| 2008 | Trends und Technologien - "More than Moore" und neue Konzepte der Aufbau- und Verbindungstechnik
Pötter, H.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Reichl, H. | Zeitschriftenaufsatz |
| 2007 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2006/2007
: Lang, K.-D. | Elektronische Publikation, Jahresbericht |
| 2007 | High temperature and element alloying influences on Kirkendall voiding in Au ball bond interconnects on Al chip metallization
Schneider-Ramelow, M.; Schuch, B.; Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 2007 | Hochentwickelte Integrations- und Packagingtechnologien für miniaturisierte Systeme
Lang, K.-D. | Konferenzbeitrag |
| 2007 | Interface reactions during Au-ball/wedge and AlSi1- Wedge/wedge bonding at room temperature
Schneider-Ramelow, M.; Lang, K.-D.; Geißler, U.; Scheel, W.; Reichl, H. | Konferenzbeitrag |
| 2007 | Smart System Integration - Grundlage zukünftiger Anwendungen im Maschinenbau
Pötter, H.; Großer, V.; Lang, K.-D.; Reichl, H.; Schmitz, S.; Wolf, J. | Zeitschriftenaufsatz |
| 2006 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2005
: Lang, K.-D. | Elektronische Publikation, Jahresbericht |
| 2006 | Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichel, H. | Zeitschriftenaufsatz |
| 2006 | Microsystem technologies for smart golf balls
Wolf, M.J.; Schmitz, S.; Amiri Jam, K.; Semionyk, P.; Grosser, V.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2006 | Predicting the shear strength of a wire bond using laser vibration measurements
Gaul, H.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 2006 | Processing and Design of Integrated Passives in LTCCII
Lang, K.-D. | Konferenzbeitrag |
| 2006 | Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H. | Konferenzbeitrag |
| 2005 | Application of 3D-stacking technology for sensor integration and miniaturization
Amiri Jam, K.; Großer, V.; Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 2005 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2004
: Lang, K.-D.; Pötter, H. | Jahresbericht |
| 2005 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2004
: Lang, K.-D. | Jahresbericht |
| 2005 | Grenzflächenuntersuchungen beim US-Wedge/Wedge-Bonden von Al-Drähten verschiedener Drahtstärken
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2004 | Bond reliability of new quality Au and Cu wires at high temperature load > 175 ºC
Schneider-Ramelow, M.; Lang, K.-D.; Ferber, A.; Meier, P. | Zeitschriftenaufsatz |
| 2004 | Demonstration of autarkic distributed microsystems with existing hybrid technologies
Lang, K.-D.; Grosser, V.; Rochlitzer, R.; Quaas, H. | Zeitschriftenaufsatz |
| 2004 | Grenzflächenuntersuchungen beim Ultraschall-Wedge-Wedge-Bonden von 25 µm AlSi1-Draht
Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.; Reichl, H. | Zeitschriftenaufsatz |
| 2004 | Metallkundliche Phänomene und Grenzflächenreaktionen beim US-Bonden von 25µm-AlSi1-Draht
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D. | Konferenzbeitrag |
| 2004 | Modern wire bonding technologies - ready for the challenges of future microelectronic packaging
Lang, K.-D.; Harman, G.G.; Schneider-Ramelow, M. | Aufsatz in Buch |
| 2004 | Ver- oder Entfestigung von Aluminiumdrähten beim Ultraschall-Wedge-Wedge-Bonden
Schneider-Ramelow, M.; Ferber, A.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2004 | Visuelle und mechanische Prüfungen in der AVT
Lang, K.-D. | Konferenzbeitrag |
| 2003 | Aufbau eines Multi-Sensor-Datenloggers zur biomaritimen Erforschung tief tauchender Meerestiere
Schneider-Ramelow, M.; Lang, K.-D.; Bielau, M.; Driesen, H.-H. | Zeitschriftenaufsatz |
| 2000 | Fertigungsautomatisierung für die Direktmontage
Sturm, R.; Matuscheck, P.; Frauenhoffer, F.; Schäfer, W.; Schilde, B.; Lang, K.-D. | Konferenzbeitrag |
| 2000 | The influence of surface oxide films on hardness and thermosonic wire bonding of Al bondpads
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D. | Konferenzbeitrag |
| 2000 | MST-BioMar-COB-Technik in hermetisch gekapselten Mikrosystemen
Funke, E.; Lang, K.-D.; Rudolf, F.; Schneider-Ramelow, M. | Zeitschriftenaufsatz |
| 2000 | Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness
Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2000 | Wire-Bonding bleibt auf Draht - Herausforderungen und Entwicklungen in der Halbleiter Verbindungstechnik
Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M. | Zeitschriftenaufsatz |
| 2000 | Wire-Bonding bleibt auf Draht. Herausforderungen und Entwicklungen in der Halbleiter-Verbindungstechnik
Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M. | Zeitschriftenaufsatz |
| 1998 | Bondability check using enhanced evolutionary strategy (EES)
Bremer, J.; Herrmann, J.; Osterwald, F.; Lang, K.-D. | Konferenzbeitrag |
| 1998 | How to influence bondability of different metallization systems using methods of mechanical pre-treatment
Osterwald, F.; Schmidt, R.; Lang, K.-D.; Schilde, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | Packaging-Trends. High Tech im Kleinstformat
Reichl, H.; Wolf, J.; Lang, K.-D. | Zeitschriftenaufsatz |
| 1997 | Rißentstehung und -entwicklung in Dickdrahtbonds auf IGBT-Chips bei aktiven elektrischen Lastwechseln
Osterwald, F.; Lang, K.-D.; Bierwirth, R.; Zietz, H.-J.; Reichl, H.; Farokhzad, B. | Konferenzbeitrag |
| 1997 | Thermosonic-Drahtbonden auf Flashgold in der Chip-on-Board-Technik
Bierwirth, R.; Lang, K.-D.; Licht, A.; Rudolf, F.; Tiederle, V. | Zeitschriftenaufsatz |
| 1996 | Aktive Qualitätssicherung in der Drahtbondtechnik
Osterwald, F.; Lang, K.-D.; Stäcker, K.-O. | Aufsatz in Buch |
| 1995 | Chip- und Drahtbonden im Rahmen der Chip on Board-Technik
Lang, K.-D. | Aufsatz in Buch |
| 1995 | Einflüsse und Grenzbereiche für das Drahtbonden bei der Chip-on-Board-Technik
Lang, K.-D.; Reichl, H. | Konferenzbeitrag |
| 1995 | Materialeinflüsse beim Drahtbonden von Chip-on-Board- und Chip-on-Glass-Komponenten
Lang, K.-D.; Krabe, D.; Reichl, H. | Konferenzbeitrag |
| 1993 | Developments in wire bonding and alternative interconnection methods for applications in microsystem and multi chip technologies
Lang, K.-D.; Zakel, E.; Reichl, H. | Konferenzbeitrag |