Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Zeitschriftenaufsatz
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Zeitschriftenaufsatz
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Konferenzbeitrag
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Konferenzbeitrag
2012Multi-scale simulation methodology for stress assessment in 3D IC
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.
Zeitschriftenaufsatz
2012Physics-based models for EM and SM simulation in three-dimensional IC structures
Sukharev, V.; Kteyan, A.; Zschech, E.
Zeitschriftenaufsatz
2011Stress-induced effects caused by 3D IC TSV packaging in advanced semiconductor device performance
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.
Konferenzbeitrag
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Zeitschriftenaufsatz