Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Zeitschriftenaufsatz
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Zeitschriftenaufsatz