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| 2020 | Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Klengel, R.; Klengel, S.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T. | Konferenzbeitrag |
| 2019 | Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T. | Konferenzbeitrag |
| 2019 | Investigation of mechanical and microstructural properties of a new, corrosion resistant gold-palladium coated copper bond wire
Lorenz, G.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T. | Konferenzbeitrag |
| 2018 | Corrosion mechanism in metallization systems for printed circuit boards
Klengel, S.; Stephan, T.; Mühs-Portius, B.; Klengel, R. | Konferenzbeitrag |
| 2018 | Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S. | Konferenzbeitrag |
| 2018 | A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
Klengel, R.; Klengel, S.; Schusser, G.; Krause, M. | Konferenzbeitrag |
| 2016 | Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization
Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S. | Konferenzbeitrag |
| 2016 | Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S. | Konferenzbeitrag |
| 2015 | Electrical and thermal analysis of frequency dependent filamentary switching in printed rectifying diodes
Heljo, P.S.; Schmidt, C.; Klengel, R.; Majumdar, H.S.; Lupo, D. | Zeitschriftenaufsatz |
| 2014 | Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B. | Konferenzbeitrag |
| 2014 | Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M. | Konferenzbeitrag |
| 2014 | Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials
März, B.; Graff, A.; Klengel, R.; Petzold, M. | Zeitschriftenaufsatz |
| 2014 | Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Naumann, F.; März, B.; Klengel, R.; Schischka, J.; Petzold, M. | Konferenzbeitrag |
| 2013 | Differences in intermetallic phase growth in thermally aged alloyed gold bond interconnections on aluminium
Maerz, B.; Graff, A.; Klengel, R.; Petzold, M. | Konferenzbeitrag |
| 2013 | Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M. | Konferenzbeitrag |
| 2013 | Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M. | Konferenzbeitrag |
| 2012 | The impact of material composition and process parameters on the cSi solar cell interconnection
Schindler, S.; Schneider, J.; Klengel, R.; Petzold, M. | Konferenzbeitrag |
| 2012 | A proper alternative: Ultra sonic bonding for thin film solar cell interconnections
Klengel, R.; Stephan, T.; Petzold, M.; Schindler, S.; Schneider, J.; Spira, K. | Konferenzbeitrag |
| 2011 | Improved testing of soldered Busbar interconnects on silicon solar cells
Klengel, R.; Petzold, M.; Schade, D.; Sykes, B. | Konferenzbeitrag |
| 2011 | Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2011 | Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Dohle, R.; Petzold, M.; Klengel, R.; Schulze, H.; Rudolf, F. | Zeitschriftenaufsatz |
| 2010 | Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F. | Konferenzbeitrag |
| 2010 | Improved quality test method for solder ribbon interconnects on silicon solar cells
Wendt, J.; Träger, M.; Klengel, R.; Petzold, M.; Schade, D.; Sykes, R. | Konferenzbeitrag |
| 2010 | On the intermetallic corrosion of Cu-Al wire bonds
Boettcher, T.; Rother, M.; Liedtke, S.; Ullrich, M.; Bollmann, M.; Pinkernelle, A.; Gruber, D.; Funke, H.-J.; Kaiser, M.; Lee, K.; Li, M.; Leung, K.; Li, T.; Farrugia, M.L.; O'Halloran, O.; Petzold, M.; März, B.; Klengel, R. | Konferenzbeitrag |
| 2009 | Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M. | Konferenzbeitrag |
| 2009 | Application of He ion microscopy for material analysis
Altmann, F.; Simon, M.; Klengel, R. | Konferenzbeitrag |
| 2009 | Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Petzold, M.; Klengel, R.; Dohle, R.; Schulze, H.; Rudolf, F. | Konferenzbeitrag |
| 2006 | Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material
Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L. | Konferenzbeitrag |