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| 2011 | Improved testing of soldered Busbar interconnects on silicon solar cells
Klengel, R.; Petzold, M.; Schade, D.; Sykes, B. | Konferenzbeitrag |
| 2011 | Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2011 | Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Dohle, R.; Petzold, M.; Klengel, R.; Schulze, H.; Rudolf, F. | Zeitschriftenaufsatz |
| 2010 | Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F. | Konferenzbeitrag |
| 2010 | Improved quality test method for solder ribbon interconnects on silicon solar cells
Wendt, J.; Träger, M.; Klengel, R.; Petzold, M.; Schade, D.; Sykes, R. | Konferenzbeitrag |
| 2010 | On the intermetallic corrosion of Cu-Al wire bonds
Boettcher, T.; Rother, M.; Liedtke, S.; Ullrich, M.; Bollmann, M.; Pinkernelle, A.; Gruber, D.; Funke, H.-J.; Kaiser, M.; Lee, K.; Li, M.; Leung, K.; Li, T.; Farrugia, M.L.; O'Halloran, O.; Petzold, M.; März, B.; Klengel, R. | Konferenzbeitrag |
| 2009 | Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M. | Konferenzbeitrag |
| 2009 | Application of He ion microscopy for material analysis
Altmann, F.; Simon, M.; Klengel, R. | Konferenzbeitrag |
| 2009 | Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
Petzold, M.; Klengel, R.; Dohle, R.; Schulze, H.; Rudolf, F. | Konferenzbeitrag |
| 2006 | Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material
Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L. | Konferenzbeitrag |