Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Konferenzbeitrag
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Konferenzbeitrag
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Konferenzbeitrag
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Konferenzbeitrag
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Konferenzbeitrag
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Konferenzbeitrag
2009Evaluating the effects of electromigration by using adjustable solder joints of concave shape
Jaeschke, J.; Kleff, J.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2009Stability of AuSn eutectic solder cap on Au socket during reflow
Yu, D.; Oppermann, H.; Kleff, J.; Hutter, M.
Zeitschriftenaufsatz
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Konferenzbeitrag
2008Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.
Zeitschriftenaufsatz