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| 2011 | Netzwerkmodellierung von Doppelwandler Synthetic Jet Aktoren. Poster
Schüller, M.; Schulze, R.; Gebauer, C.; Lipowski, M.; Kaulfersch, E.; Nestler, J.; Otto, T.; Geßner, T. | Konferenzbeitrag |
| 2011 | Reliability investigations on stacked chip on MEMS
Kaulfersch, E.; Winkler, T.; Brämer, B.; Hammacher, J. | Konferenzbeitrag |
| 2010 | Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Pufall, R.; Michel, B.; Kaulfersch, E. | Konferenzbeitrag |
| 2010 | Networking in micro/nano reliability research encouraged by EUCEMAN, the European center for micro- and nanoreliability
Hammacher, J.; Michel, B.; Winkler, T.; Kaulfersch, E. | Konferenzbeitrag |
| 2008 | FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B. | Konferenzbeitrag |
| 2008 | Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2008 | Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2007 | Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures
Janczyk, G.; Bieniek, T.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.; Reitz, M.S.; Schneider, P.; Kaulfersch, E. | Konferenzbeitrag |
| 2007 | A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2005 | Combination of nanoDAC and FEM for reliability analysis of materials in the micro-nano-transition scale
Kaulfersch, E.; Keller, J.; Michel, B. | Abstract |
| 2005 | Thermo-mechanical Reliability Analysis of Magneto-resistive Current Sensors
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Auersperg, J.; Döring, R.; Jost, F.; Kreyßig, K.; Walter, H.; Hölzl, J. | Konferenzbeitrag |
| 2005 | Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Konferenzbeitrag |
| 2004 | Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B. | Zeitschriftenaufsatz |
| 2004 | Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Aufsatz in Buch |
| 2003 | Fluidic power modules for power electronics and stacked modules
Kaulfersch, E.; Vogel, J.; Kieselstein, E. | Abstract |
| 2003 | Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | Micro thermal management of high-power diode laser bars
Lorenzen, D.; Bonhaus, J.; Fahrner, E.; Kaulfersch, E.; Wörner, E.; Koidl, P.; Unger, K.; Müller, D.; Rölke, S.; Schmidt, H.; Grellmann, M. | Zeitschriftenaufsatz |
| 2000 | Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2000 | Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B. | Konferenzbeitrag |
| 1999 | Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunications
Kaulfersch, E.; Mehlhorn, T.; Töpfer, M.; Reichl, H. | Aufsatz in Buch |
| 1999 | Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B. | Zeitschriftenaufsatz |
| 1999 | Diamond as a heat spreader material for laser applications
Töpfer, M.; Kaulfersch, E.; Fotheringham, G.; Schmidt, M.; Dai, W.; Reichl, H. | Aufsatz in Buch |
| 1999 | Stochastic FEM for parameter scattering in numerical simulation of advanced packages
Winkler, T.; Skurt, L.; Kaulfersch, E.; Michel, B. | Aufsatz in Buch |
| 1999 | Thermo-mechanical FE analysis and micro deformation measurement
Sommer, J.-P.; Kaulfersch, E.; Hussack, J.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 1998 | Chipanordnung und Verfahren zum Herstellen derselben
Töpfer, M.; Kaulfersch, E.; Weiss, S.; Reichl, H. | Patent |
| 1998 | Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1998 | Microdeformation analysis of packages and interconnects by the MicroDAC method
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1998 | Thermomechanical behavior of metal contacts and interconnects for information technology
Kaulfersch, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | CTE matched and mismatched heat-spreader materials for high power laser diode attachment. Thermal and mechanical optimization
Kaulfersch, E.; Töpfer, M.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder
Weiß, S.; Kaulfersch, E.; Töpfer, M.; Zakel, E.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Reliability evaluation of components using fracture machanics in spite of uncertain data
Winkler, T.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1997 | A simple method to reduce thermomechanical stress in GaAs Assemblies including diamond heat spreaders and AuSn solders
Töpfer, M.; Kaulfersch, E.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Thermomechanical simulation of advanced packages in spite of uncertain characteristics
Winkler, T.; Kaulfersch, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1995 | FEM-Anwendungen auf mechanisch-thermische Probleme in der Mikrotechnik
Auersperg, J.; Kaulfersch, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1994 | Optical deformation analysis of surface mounted devices
Vogel, D.; Kaulfersch, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1993 | Automatisierte specklefotografische Lasermeßtechnik zur berührungslosen, ortsauflösenden Deformationsanalyse
Vogel, D.; Kaulfersch, E. | Aufsatz in Buch |
| 1993 | SPY - a modular specklephotographic measurement system for micro-mechanics purposes
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |