Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
Koepge, R.; Buehler, K.; Kaule, F.; Zeh, J.; Schoenfelder, S.; Anspach, O.
Konferenzbeitrag
2018Improved mechanical strength and reflectance of diamond wire sawn multi-crystalline silicon wafers by inductively coupled plasma (ICP) etching
Kaule, F.; Köhler, B.; Hirsch, J.; Schoenfelder, S.; Lausch, D.
Zeitschriftenaufsatz
2018Laser-assisted spalling of large-area semiconductor and solid state substrates
Kaule, F.; Swoboda, M.; Beyer, C.; Rieske, R.; Ajaj, A.; Drescher, W.D.; Schoenfelder, S.; Richter, J.
Zeitschriftenaufsatz
2018Mechanical damage of half-cell cutting technologies in solar cells and module laminates
Kaule, F.; Pander, M.; Turek, M.; Grimm, M.; Hofmüller, E.; Schönfelder, S.
Konferenzbeitrag
2015High quality half-cell processing using thermal laser separation
Eiternick, S.; Kaule, F.; Zühlke, H.U.; Kießling, T.; Grimm, M.; Schoenfelder, S.; Turek, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Breakage Root Cause Analysis in as-Cut Monocrystalline Silicon Wafers
Klute, C.; Kaule, F.; Schoenfelder, S.
Konferenzbeitrag
2014Modeling and testing the mechanical strength of solar cells
Kaule, F.; Wang, W.; Schoenfelder, S.
Zeitschriftenaufsatz
2012Damage and breakage of silicon wafers during impact loading on the wafer edge
Kaule, F.; Koepge, R.; Schönfelder, S.
Konferenzbeitrag
2012Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M.
Konferenzbeitrag
2012Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells
Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich
Konferenzbeitrag