Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018International Maritime Management - a postgraduate distance degree course for a unique student group
John, Peter; Nause, Nicolas; Klimmek, Elisabeth; Wandelt, Ralf
Aufsatz in Buch
2018Trocken und rückstandsfrei CFK bearbeiten - Hochdruckstrahlschneiden mit flüssigem CO2
Uhlmann, Eckart; John, Patrick; Reinkober, Sascha
Zeitschriftenaufsatz
2018Visible learning on board ships: Providing for a transparent learning environment in a distance-education, postgraduate module on Academic Research Methods
John, Peter; Nause, Nicolas; Klimmek, Elisabeth
Aufsatz in Buch
2017Developing an assessment methodology for a universal maritime english proficiency test for deck officers
Toncheva, S.; Zlateva, D.; John, P.
Konferenzbeitrag
2017The plural of anecdote is not data: A study on different world views held by Asian and European students of Nautical Science
John, Peter; Björkroth, Peter; Lumban Batu, Purnama Nancy
Konferenzbeitrag
2016Developing and validating a universal maritime english proficiency test for deck officers
John, Peter
Konferenzbeitrag
2016Machining of hygroscopic materials by high-pressure CO2 jet cutting
Uhlmann, E.; Bilz, M.; Mankiewicz, J.; Motschmann, S.; John, P.
Konferenzbeitrag, Zeitschriftenaufsatz
2016Practising verbal maritime communication with computer dialogue systems using automatic speech recognition (My Practice session)
John, Peter; Wellmann, J.; Appell, J.E.
Konferenzbeitrag
2015Quality optimized additive manufacturing through measuring system analysis
Uhlmann, E.; John, P.; Kashevko, V.; Gerlitzky, G.; Bergmann, A.
Konferenzbeitrag
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Untersuchung von Designgrenzen generativer Fertigungsverfahren
Uhlmann, E.; Bergmann, A.; Kashevko, V.; John, P.
Konferenzbeitrag
2014Verification of design rules for additive manufacturing
Uhlmann, E.; Bergmann, A.; John, P.; Kashevko, V.
Konferenzbeitrag
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Konferenzbeitrag
2013Investigation of different methods for isolation in through silicon via for 3D integration
Sage, S.; John, P.; Dobritz, S.; Börnge, J.; Vitiello, J.; Böttcher, M.
Zeitschriftenaufsatz
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Konferenzbeitrag
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Konferenzbeitrag
2000In-production monitoring and control of in situ-chamber clean processes
Roeder, G.; Andrian-Werburg, M. von; Tschaftary, T.; Schneider, C.; Pfitzner, L.; Ryssel, H.; John, P.; Tegeder, V.
Konferenzbeitrag