| | |
|---|
| 2017 | Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L. | Konferenzbeitrag |
| 2014 | Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips
Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F. | Konferenzbeitrag |
| 2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2010 | Delamination and combined compound cracking of EMC-copper interfaces
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2010 | Interfacial fracture parameters of silicon-to-molding compound
Schlottig, G.; Maus, I.; Walter, H.; Jansen, K.M.B.; Pape, H.; Wunderle, B.; Ernst, L.J. | Konferenzbeitrag |
| 2010 | Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2009 | Comprehensive material characterization of organic packaging materials
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J. | Konferenzbeitrag |
| 2009 | Establishing fracture properties of EMC-copper (-oxide) interfaces: Test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity
Ernst, L.J.; Xiao, A.; Vreugd, J. de; Jansen, K.M.B.; Pape, H.; Schlottig, G.; Wunderle, B. | Konferenzbeitrag |
| 2009 | Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature region
Xiao, A.; Vreugd, J. de; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2009 | Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Sluis, O. van der; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2009 | Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components
Falat, T.; Jansen, K.M.B.; Vreugd, J. de; Rzepka, S. | Konferenzbeitrag |
| 2009 | Thermo mechanical characterization of packaging polymers
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J. | Konferenzbeitrag |
| 2008 | Interface characterization and failure modeling for Semiconductor packages
Ernst, L.J.; Xiao, A.; Wunderle, B.; Jansen, K.M.B.; Pape, H. | Konferenzbeitrag |
| 2008 | Interfacial Fracture Properties and Failure Modeling for Microelectronics
Xiao, A.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Vreugd, J. de; Ernst, L.J. | Konferenzbeitrag |
| 2008 | Mixed mode interface characterization considering thermal residual stress
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J. | Konferenzbeitrag |
| 2007 | Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Falat, T.; Wymyslowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L. | Zeitschriftenaufsatz |
| 2006 | Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymysowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L. | Konferenzbeitrag |