Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, A.; Jaeschke, J.; Wittler, O.; Fabian, B.; Thomas, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2020Process simulation of fan-out wafer level packaging: Influence of material and geometry on warpage
Dijk, M. van; Jaeschke, J.; Wittler, O.; Stegmaier, A.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Solder joint fatigue testing with harsh temperature rates: Influence of dwell time
Schambeck, S.; Jaeschke, J.; Hutter, M.; Deutinger, A.; Kederer, F.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Schambeck, S.; Hutter, M.; Jaeschke, J.; Deutinger, A.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2012Bewertung der Lebensdauer von Lotverbindungen unter Betrachtung des Fehlermechanismus Elektromigration
Jaeschke, Johannes
Dissertation
2012Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.
Konferenzbeitrag
2010Employing solder joints of concave shape for monitoring electromigration independently of material interfaces
Jaeschke, J.; Müller, W.H.; Nissen, N.; Reichl, H.
Konferenzbeitrag
2009Evaluating the effects of electromigration by using adjustable solder joints of concave shape
Jaeschke, J.; Kleff, J.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2008Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H.
Konferenzbeitrag
2008Präventive Ansätze zur zuverlässigkeitsorientierten Produktentwicklung
Steffen, D.; Jaeschke, J.; Middendorf, A.
Zeitschriftenaufsatz
2008Reliability and environmental evaluation in early design stages of mechatronics
Middendorf, A.; Jaeschke, J.; Tsunezawa, K.; Reichl, H.
Konferenzbeitrag