Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Comparison of material measures for areal surface topography measuring instrument calibration
Eifler, M.; Hering, J.; Seewig, J.; Leach, R.K.; Freymann, Georg von; Hu, X.; Dai, G.
Zeitschriftenaufsatz
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Zeitschriftenaufsatz
2020Ferrocenyl-Pyrenes, Ferrocenyl-9,10-Phenanthrenediones, and Ferrocenyl-9,10-Dimethoxyphenanthrenes: Charge-Transfer Studies and SWCNT Functionalization
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2020Progressive Bilateral-Context Driven Model for Post-Processing Person Re-Identification
Cao, Min; Chen, Chen; Dou, Hao; Hu, Xiyuan; Peng, Silong; Kuijper, Arjan
Zeitschriftenaufsatz
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X.
Dissertation
2018Simulation and Electrical Characterization of a Novel 2D-Printed Incontinence Sensor with Conductive Polymer PEDOT:PSS for Medical Applications
Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong
Konferenzbeitrag
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2017Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E.
Zeitschriftenaufsatz
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Konferenzbeitrag
2017The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Konferenzbeitrag
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Konferenzbeitrag
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, Piotr; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Konferenzbeitrag
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Konferenzbeitrag
2015Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2014Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2006Sprachkonferenzvorrichtung, Sprachkonferenzsystem und Verfahren zur Realisierung einer Sprachkonferenz
Hupp, J.; Tittel, M.; Hu, X.; Sturm, R.; Kauppert, T.
Patent