Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Advanced interconnects for ULSI technology
: Baklanov, M.R.; Ho, P.S.; Zschech, E.
Buch
2012Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects
Cao, L.; Ganesh, K.J.; Zhang, L.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ferreira, P.J.; Ho, P.S.
Konferenzbeitrag
2012Forward to the special section on "Materials, Processing, and Reliability of 3-D Interconnects". Editorial
Ho, P.S.; Smith, L.; Tong, H.M.; Zschech, E.
Zeitschriftenaufsatz
2012Scaling and microstructure effects on electromigration reliability for Cu interconnects
Hu, C.-K.; Hübner, R.; Zhang, L.; Hauschildt, M.; Ho, P.S.
Aufsatz in Buch
2011Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
Zhang, L.J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Zeitschriftenaufsatz
2010Assessment of mechanical properties of nanoscale structures for microprocessor manufacturing
Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.; Wu, Z.; Ho, P.S.
Konferenzbeitrag
2010Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Im, J.; Zschech, E.; Ho, P.S.
Konferenzbeitrag
2010Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node
Zhang, L.; Zhou, J.P.; Im, J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Konferenzbeitrag
2010EM and SM induced degradation dynamics in copper interconnects studied using electron microscopy and X-ray microscopy
Zschech, E.; Hübner, R.; Aubel, O.; Ho, P.S.
Konferenzbeitrag
2010Grain size and cap layer effects on electromigration reliability of Cu interconnects: Experiments and simulation
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ho, P.S.
Konferenzbeitrag
2010Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M.
Zeitschriftenaufsatz