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| 2019 | Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales
Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T. | Zeitschriftenaufsatz |
| 2016 | Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles
Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T. | Zeitschriftenaufsatz |
| 2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Zeitschriftenaufsatz |
| 2015 | Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Konferenzbeitrag |
| 2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2014 | Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films
Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T. | Zeitschriftenaufsatz |
| 2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Aufsatz in Buch |
| 2014 | The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Zeitschriftenaufsatz |
| 2014 | Flash lamp annealing of spray coated films containing oxidized or hydrogen terminated silicon nanoparticles
Seidel, F.; Toader, I.G.; Koth, S.; Fritzsche, R.; Schäfer, P.; Bülz, D.; Büchter, B.; Gordan, O.D; Freitag, H.; Jakob, A.; Buschbeck, R.; Hietschold, M.; Lang, H.; Mehring, M.; Baumann, R.R.; Zahn, D.R.T. | Zeitschriftenaufsatz |
| 2014 | Influence of porosity and methyl doping inside silica network
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Zeitschriftenaufsatz |
| 2014 | Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Konferenzbeitrag |
| 2013 | Conductive AFM for CNT characterization
Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M. | Zeitschriftenaufsatz |
| 2013 | Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, M.; Waechtler, T.; Müller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T. | Zeitschriftenaufsatz |
| 2013 | Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment
Luo, J.; Billep, D.; Waechtler, T.; Otto, T.; Toader, M.; Gordan, O.; Sheremet, E.; Martin, J.; Hietschold, M.; Zahn, D.R.T.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | Nanoscale optical and electrical characterization of horizontally aligned single-walled carbon nanotubes
Rodriguez, R.D.; Toader, M.; Hermann, S.; Sheremet, E.; Mueller, S.; Gordan, O.D.; Yu, H.; Schulz, S.E.; Hietschold, M.; Zahn, D.R.T. | Zeitschriftenaufsatz |
| 2010 | TEM/EELS analysis of ultra low-k inter-metal dielectric
Singh, P.K.; Zimmerman, S.; Schulze, S.; Schulz, S.; Hietschold, M. | Konferenzbeitrag |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Detailed growth studies on SiO2 and TaN
Wächtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Konferenzbeitrag |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Growth studies and application as seed layers for electrochemical copper deposition
Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Konferenzbeitrag |
| 2009 | Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M. | Zeitschriftenaufsatz |
| 2009 | Detailed study of copper oxide ALD on SiO2, TaN, and Ru
Wächtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Konferenzbeitrag |
| 2004 | Sensor-actuator-arrays for dynamic atomic force microscopy and their application in temporary MESFET devices
Müller, A.-D.; Müller, F.; Mehner, J.; Geßner, T.; Hietschold, M. | Konferenzbeitrag |
| 2004 | Single electron transistors: Modeling and fabrication
Morris, J.E.; Wu, F.; Radehaus, C.; Hietschold, M.; Henning, A.; Hofmann, K.; Kiesow, A. | Konferenzbeitrag |