Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Steinhardt, Alexander; Papaioannou, Dimitrios; Heinig, Andy; Schneider, Peter
Aufsatz in Buch
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2018Packaging and board design for 5G and millimeter wave applications
Heinig, Andy
Vortrag
2018Simulation, testing and implementation of temperature-reduction solutions on a high-power thermal demonstrator
Heinig, Andy; Papaioannou, Dimitrios
Vortrag
2018Why use an assembly design kit and assembly design flow?
Heinig, Andy
Elektronische Publikation
2017Comparison between thermal simulations and experimental measurements on an advanced microelectronics test-system
Papaioannou, Dimitrios; Heinig, Andy
Konferenzbeitrag
2017Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Dittrich, Michael; Heinig, Andy; Hopsch, Fabian; Trieb, Robert
Konferenzbeitrag
2017High speed interfaces for chip communication on interposer based integration
Chaudhary, Muhammad Waqas; Heinig, Andy
Vortrag
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2017Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT
Fischbach, Robert; Heinig, Andy; Lienig, Jens
Konferenzbeitrag
2016Advanced System Integration für hochintegrierte Sensoren im Umfeld von Industrie-4.0-Anwendungen
Heinig, Andy; Dietrich, Michael; Hopsch, Fabian
Konferenzbeitrag
2016Co-design of CML IO and interposer channel for low area and power signaling
Chaudhary, Muhammad Waqas; Heinig, Andy
Konferenzbeitrag
2016Entwurfsplattform für SiP in medizintechnischen Anwendungen
Heinig, Andy; Fischbach, Robert
Bericht
2016High speed interfaces between chips mounted with different integration technologies on an interposer
Chaudhary, Muhammad Waqas; Heinig, Andy
Konferenzbeitrag
2016High speed serial interfaces in 2.5D integrated systems
Chaudhary, Waqas Muhammad; Heinig, Andy
Konferenzbeitrag
2016Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael
Konferenzbeitrag
2016Model abstraction of 3D-integrated/interposer-based high performance systems for faster (thermal) simulation
Heinig, Andy; Papaioannou, Dimitrios; Fischbach, Robert
Konferenzbeitrag
2016Overview of 3D CAD design tools
Heinig, Andy; Fischbach, Robert
Aufsatz in Buch
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Konferenzbeitrag
2015Enabling automatic system design optimization through assembly design kits
Heinig, Andy; Fischbach, Robert
Konferenzbeitrag
2015Investigation of chip-to-chip interconnection structures for high data rates on a low cost silicon interposer
Dittrich, Michael; Heinig, Andy
Konferenzbeitrag
2015Technology options and their influence on routing for interposer-based memory processor integration
Heinig, Andy
Elektronische Publikation
2015Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems
Heinig, Andy; Papaioannou, Dimitrios
Konferenzbeitrag
2014Automatic footprint compaction and bond wire placement for bare die chips stacks
Dittrich, Michael; Heinig, Andy; Schneider, Peter
Konferenzbeitrag
2014Design für Vertikale 3D Systemintegration in mm-Wellen Anwendungen
Heinig, Andy; Fischbach, Robert
Bericht
2014Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache
Fischbach, Robert; Dittrich, Michael; Heinig, Andy
Konferenzbeitrag
2014Euclidean move surface decomposition of non-planar surfaces for the electronic system design
Steinhardt, Alexander; Heinig, Andy
Konferenzbeitrag
2014Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Konferenzbeitrag
2014System integration - the bridge between more than moore and more moore
Heinig, Andy; Dietrich, Manfred; Herkersdorf, Andreas; Miller, F.; Wild, T.; Hahn, Kai; Grünewald, Armin; Brück, Rainer; Kröhnert, Steffen; Reisinger, Jochen
Konferenzbeitrag
2014Technology, simulation and design for 3D integrated heterogeneous sensor systems
Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian
Konferenzbeitrag
2014Thermal analysis and optimization of 2.5D and 3D integrated systems with wide I/O memory
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Konferenzbeitrag
2014Thermische Analyse und Optimierung von Wide I/O-Speicher integrierenden 2.5- und 3-D Systemaufbauten
Heinig, Andy; Fischbach, Robert
Konferenzbeitrag
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Konferenzbeitrag
2013Challenges and methods for the design of 3D-integrated smart systems
Knöchel, Uwe; Heinig, Andy
Konferenzbeitrag
2013Consideration of local structures in hierarchical partitioning of integrated circuit netlists modelled by hypergraphs
Steinhardt, Alexander
: Tittmann, Peter (Erstprüfer); Heinig, Andy (Zweitprüfer)
Master Thesis
2013Electro-thermal co-design of chip-package-board systems
Sohrmann, Christoph; Heinig, Andy; Dittrich, Michael; Jancke, Roland; Schneider, Peter
Konferenzbeitrag
2013Layout dependent synthesis for manufacturing costs optimized 3D integrated systems
Heinig, Andy
Konferenzbeitrag
2013Testkonzept für ein interposerbasiertes 3D-System
Heinig, Andy; Hopsch, Fabian
Konferenzbeitrag
2013XML-based hierarchical description of 3D systems and SIP
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Zeitschriftenaufsatz
20123D-integration: Challenges and proposals
Dietrich, Manfred; Heinig, Andy; Knöchel, Uwe
Konferenzbeitrag
2012Current challenges in interposer and 3D-design
Wilde, Andreas; Heinig, Andy
Vortrag
2012Examination of process parameter variations
Acar, Emrah; Mau, Hendrik; Heinig, Andy; Li, Bing; Schlichtmann, Ulf
Aufsatz in Buch
2012A flow for parasitics extraction in 3D-systems
Heinig, Andy; Dittrich, Michael; Reitz, Sven; Stolle, Jörn
Konferenzbeitrag
2012NEEDS - Nanoelektronik-Entwurf für 3D-Systeme
Hylla, Kai; Metzdorf, Malte; Grünewald, Armin; Hahn, Kai; Heinig, Andy; Knöchel, Uwe; Wolf, Susann; Miller, Felix; Wild, Thomas; Quiring, Artur; Olbrich, Markus; Sattler, Sebastian; Treytnar, Dieter
Konferenzbeitrag
2012Syntheseoptimierung bei 3D-Schaltungen
Luo, Zhongying
: Heinig, Andy (Betreuer); Lienig, Jens (Betreuer)
Diplomarbeit
2012Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas
Konferenzbeitrag
2012Werkzeuge und Methoden für den interposerbasierten 3D-Entwurf
Heinig, Andy
Konferenzbeitrag
2012XML-basierte Sprache für die hierarchische und parametrisierbare Beschreibung von 3D-Systemen
Wolf, Susann; Heinig, Andy; Knöchel, Uwe
Aufsatz in Buch
2011Electronic design automation for implementation of 3D integrated systems
Knöchel, Uwe; Heinig, Andy; Stolle, Jörn; Reitz, Sven; Wilde, Andreas
Aufsatz in Buch
2011Thermal modeling of 3D stacks for floorplanning
Reitz, Sven; Heinig, Andy; Martin, Roland; Stolle, Jörn; Wilde, Andreas
Konferenzbeitrag
2011XML-basierte hierarchische Beschreibungssprache für 3D-Systeme
Heinig, Andy; Wolf, Susann; Knöchel, Uwe
Konferenzbeitrag

 

<