Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach under Different Accelerated Testing Conditions
Forndran, F.; Heilmann, J.; Metzler, M.; Leicht, M.; Wunderle, B.
Konferenzbeitrag
2021Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
May, D.; Heilmann, J.; Boschman, E.; Abo Ras, M.; Wunderle, B.
Konferenzbeitrag
2021Using AFM Measurements for Failure Indication during High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers
Osipova, V.; Jöhrmann, N.; Heilmann, J.; May, D.; Arnold, J.; Bieniek, T.; Pufall, R.; Wunderle, B.
Konferenzbeitrag
2019Accelerated Pump Out Testing for Thermal Greases
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Schacht, R.; Abo Ras, M.
Konferenzbeitrag
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Konferenzbeitrag
2018Visual-inertial model target tracking for consumer hardware
Heilmann, Johannes
: Kuijper, Arjan; Wuest, Harald
Bachelor Thesis
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Zeitschriftenaufsatz
2016Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2016Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2015Acceleration of lifetime modeling by isothermal bending fatigue tests
Heilmann, J.; Arnold, J.; Wunderle, B.
Konferenzbeitrag
2015Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2014Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag
2013Reliability of advanced thermal interface technologies based on sintered die-attach materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag