Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Zeitschriftenaufsatz
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Zeitschriftenaufsatz
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Zeitschriftenaufsatz, Konferenzbeitrag
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Zeitschriftenaufsatz
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Konferenzbeitrag
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Zeitschriftenaufsatz
2013Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Hauschildt, M.; Hennesthal, C.; Talut, G.; Aubel, O.; Gall, M.; Yeap, K.B.; Zschech, E.
Konferenzbeitrag
2013An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O.
Konferenzbeitrag
2013Lower PPM level EM reliability performance
Aubel, O.; Justison, P.; Hauschildt, M.; Talut, G.; Gall, M.
Konferenzbeitrag
2012Scaling and microstructure effects on electromigration reliability for Cu interconnects
Hu, C.-K.; Hübner, R.; Zhang, L.; Hauschildt, M.; Ho, P.S.
Aufsatz in Buch
2011Theoretical aspects of hot forming of sheet metals with graded characteristics
Neugebauer, Reimund; Meza-Garcia, E.; Cai, H.; Lachmann, L.; Hauschildt, M.; Kohnhäuser, M.; Kreimeyer, M.; Michael, D.
Zeitschriftenaufsatz
2010Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M.
Zeitschriftenaufsatz
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Zeitschriftenaufsatz
2007Auswirkungen unterschiedlicher Navigationshilfen auf die Usability einer Website sowie die Entwicklung eines mentalen Modells beim Benutzer
Hauschildt, M.
Diplomarbeit