Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2015Investigation of room-temperature flip chip connections
Brink, Morten; Grams, Arian; Eichhammer, Yann; Broll, M.; Fritzsch, Thomas; Lang, Klaus-Dieter
Konferenzbeitrag
2015Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.
Zeitschriftenaufsatz
2014Combined Loads and Mechanisms
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter
Vortrag
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, Arian; Prewitz, Tobias; Wittler, Olaf; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter
Konferenzbeitrag
2013Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, Arian; Prewitz, Tobias; Wittler, Olaf; Kripfgans, Johannes; Schmitz, Stefan; Middendorf, Andreas; Müller, Wolfgang H.; Lang, Klaus-Dieter
Konferenzbeitrag
2012Investigation of pulse overload-behavior of a high-current connector with transient-thermo-electric FEM simulation
Bochow-Ness, Olaf; Grams, Arian; Hoene, Eckart; Huber, Saskia; Lang, Klaus-Dieter; Potter, Harald; Prewitz, Tobias; Wittier, Olaf; Wust, Felix
Konferenzbeitrag