Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F.
Konferenzbeitrag
2020Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2019Assessment of FOWLP process dependent wafer warpage using parametric FE study
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas
Konferenzbeitrag
2019The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki
Konferenzbeitrag
2018Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven
Konferenzbeitrag
2016Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S.
Zeitschriftenaufsatz
2016Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S.
Konferenzbeitrag
2016Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles
Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I.
Konferenzbeitrag