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| 2012 | Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Topper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.D. | Konferenzbeitrag |
| 2012 | A via last TSV process applied to ATLAS pixel detector modules: Proof of principle demonstration
Barbero, M.; Fritzsch, T.; Gonella, L.; Hügging, F.; Krüger, H.; Rothermund, M.; Wermes, N. | Zeitschriftenaufsatz |
| 2011 | Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2011 | Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H. | Zeitschriftenaufsatz |
| 2010 | 3D integration technology: Status and application development
Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P. | Konferenzbeitrag |
| 2010 | Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M. | Konferenzbeitrag |
| 2010 | The European 3D technology platform (e-CUBES)
Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M. | Zeitschriftenaufsatz |
| 2009 | 3-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2009 | Body surface backed flexible antennas and 3D Si-level integrated wireless sensor nodes for 17 GHz wireless body area networks
Rydberg, A.; Engen, P. van; Cheng, S.; Doremalen, R. van; Sanduleanu, M.; Hjort, K.; Raedt, W. de; Fritzsch, T.; Hallbjörner, P. | Konferenzbeitrag |
| 2009 | Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H. | Konferenzbeitrag |
| 2009 | VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components
Pruijmboom, A.; Booij, S.; Schemmann, M.; Werner, K.; Hoeven, P.; Limpt, H. van; Intemann, S.; Jordan, R.; Fritzsch, T.; Oppermann, H.; Barge, M. | Konferenzbeitrag |
| 2009 | Wireless activity monitor using 3D integration
Doremalen, R. van; Engen, P. van; Jochems, W.; Rommers, A.; Maas, G.; Cheng, S.; Rydberg, A.; Fritzsch, T.; Wolf, J.; Raedt, W. de; Jansen, R.; Müller, P.; Alarcon, E.; Sanduleanu, M. | Konferenzbeitrag |
| 2008 | Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H. | Konferenzbeitrag |
| 2007 | Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H. | Zeitschriftenaufsatz |
| 2007 | Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H. | Konferenzbeitrag |
| 2006 | Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2006 | Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N. | Konferenzbeitrag |
| 2006 | Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H. | Konferenzbeitrag |
| 2005 | Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J. | Konferenzbeitrag |
| 2005 | Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H. | Konferenzbeitrag |
| 2005 | Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H. | Konferenzbeitrag |
| 2005 | Technology requirements for chip-on-chip packaging solutions
Topper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Roder, J.; Dietrich, L.; Lutz, M. | Konferenzbeitrag |
| 2004 | Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J. | Konferenzbeitrag |