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| 2012 | Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation
Urbanski, K.J.; Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bonfert, D.; Bock, K. | Konferenzbeitrag |
| 2010 | Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D. | Konferenzbeitrag |
| 2009 | Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components
Falat, T.; Jansen, K.M.B.; Vreugd, J. de; Rzepka, S. | Konferenzbeitrag |
| 2009 | TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads
Falat, T.; Friedel, K.; Marenco, N.; Warnat, S. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | A numerical study on heat flow and load distribution during chip to wafer or wafer to wafer bonding in vacuum
Malecki, K.; Pikur, L.; Falat, T.; Bock, G.; Hillmann, G.; Sigl, A.; Marenco, N.; Friedel, K. | Konferenzbeitrag |
| 2007 | Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Falat, T.; Wymyslowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L. | Zeitschriftenaufsatz |
| 2007 | Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymyslowski, A.; Kolbe, J. | Zeitschriftenaufsatz |
| 2006 | Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymysowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L. | Konferenzbeitrag |