Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation
Urbanski, K.J.; Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bonfert, D.; Bock, K.
Konferenzbeitrag
2010Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D.
Konferenzbeitrag
2009Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components
Falat, T.; Jansen, K.M.B.; Vreugd, J. de; Rzepka, S.
Konferenzbeitrag
2009TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads
Falat, T.; Friedel, K.; Marenco, N.; Warnat, S.
Konferenzbeitrag, Zeitschriftenaufsatz
2008A numerical study on heat flow and load distribution during chip to wafer or wafer to wafer bonding in vacuum
Malecki, K.; Pikur, L.; Falat, T.; Bock, G.; Hillmann, G.; Sigl, A.; Marenco, N.; Friedel, K.
Konferenzbeitrag
2007Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Falat, T.; Wymyslowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L.
Zeitschriftenaufsatz
2007Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymyslowski, A.; Kolbe, J.
Zeitschriftenaufsatz
2006Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymysowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L.
Konferenzbeitrag