Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Identification and quantification of synthetic cannabinoids in 'spice-like' herbal mixtures: Update of the German situation in summer 2018
Ernst, L.; Langer, N.; Bockelmann, A.; Salkhordeh, E.; Beuerle, T.
Zeitschriftenaufsatz
2012Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2011Establishing the critical fracture properties of the die backside-to-molding compound interface
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2010Delamination and combined compound cracking of EMC-copper interfaces
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2010Interfacial fracture parameters of silicon-to-molding compound
Schlottig, G.; Maus, I.; Walter, H.; Jansen, K.M.B.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2010Interfacial strength of silicon-to-molding compound changes with thermal residual stress
Schlottig, G.; Xiao, A.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
Xiao, A.; Pape, H.; Schlottig, G.; Wunderle; Leung, Y.Y.; Jansen, K.B.; Ernst, L.J.
Konferenzbeitrag
2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009Establishing fracture properties of EMC-copper (-oxide) interfaces: Test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity
Ernst, L.J.; Xiao, A.; Vreugd, J. de; Jansen, K.M.B.; Pape, H.; Schlottig, G.; Wunderle, B.
Konferenzbeitrag
2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature region
Xiao, A.; Vreugd, J. de; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Sluis, O. van der; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurements
Schlottig, G.; Pape, H.; Xiao, A.; Wunderle, B.; Ernst, L.
Konferenzbeitrag
2009Induced delamination of silicon-molding compound interfaces
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2008Interface characterization and failure modeling for Semiconductor packages
Ernst, L.J.; Xiao, A.; Wunderle, B.; Jansen, K.M.B.; Pape, H.
Konferenzbeitrag
2008Interfacial Fracture Properties and Failure Modeling for Microelectronics
Xiao, A.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Vreugd, J. de; Ernst, L.J.
Konferenzbeitrag
2008Mixed mode interface characterization considering thermal residual stress
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2007Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Falat, T.; Wymyslowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L.
Zeitschriftenaufsatz
2006Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymysowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L.
Konferenzbeitrag