Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Automatic Transient Thermal Impedance Tester for Quality Inspection of Soldered and Sintered Power Electronic Devices on Panel and Tile Level
Schmid, M.; Krishna, B.S.; Elger, G.
2019Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor
Mokhtari, O.; Conti, F.; Bhogaraju, S.K.; Meier, M.; Schweigart, H.; Tetzlaff, U.; Elger, G.
2019Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models
Hanss, A.; Liu, E.; Abdullah, M.R.; Elger, G.
2019Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging
Bhogaraju, S.R.; Mokhtari, O.; Pascucci, J.; Hanss, A.; Schmid, M.; Conti, F.; Elger, G.
2019Investigation of Thermomechanical Local Stress Induced in Assembled GaN LEDs
Brugnolotto, E.; Bhogaraju, S.K.; Liu, E.; Conti, F.; Pedron, D.; Signorini, R.; Elger, G.
2019Modelling of 3D Temperature Behavior of Prismatic Lithium-Ion Cell with Focus on Experimental Validation Under Battery Electric Vehicle Conditions
Kleiner, Jan; Komsiyska, Lidiya; Elger, Gordon; Endisch, Christian
2019Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments
Liu, E.; Conti, F.; Signorini, R.; Brugnolotto, E.; Bhogaraju, S.K.; Elger, G.
2019Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy
Signorini, R.; Conti, F.; Brugnolotto, E.; Pedron, D.; Liu, E.; Bhogaraju, S.K.; Elger, G.
2019Time Saving Averaging Algorithm for Transient Thermal Analyses over Deterministic Pulse Superposition
Schmid, M.; Hanss, A.; Bhogaraju, S.K.; Elger, G.
2016Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.
2002Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering
Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E.
Zeitschriftenaufsatz, Konferenzbeitrag
2001Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Elger, G.; Oppermann, H.H.
2001Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Elger, G.; Voigt, J.; Oppermann, H.