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| 2017 | Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Dittrich, Michael; Heinig, Andy; Hopsch, Fabian; Trieb, Robert | Konferenzbeitrag |
| 2016 | Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael | Konferenzbeitrag |
| 2015 | Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen | Konferenzbeitrag |
| 2015 | Investigation of chip-to-chip interconnection structures for high data rates on a low cost silicon interposer
Dittrich, Michael; Heinig, Andy | Konferenzbeitrag |
| 2014 | Automatic footprint compaction and bond wire placement for bare die chips stacks
Dittrich, Michael; Heinig, Andy; Schneider, Peter | Konferenzbeitrag |
| 2014 | Dresdner Arbeitstagung Schaltungs- und Systementwurf, DASS 2014. Tagungsband. CD-ROM
: Schneider, Peter (Hrsg.); Dittrich, Michael (Hrsg.) | Tagungsband |
| 2014 | Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache
Fischbach, Robert; Dittrich, Michael; Heinig, Andy | Konferenzbeitrag |
| 2014 | Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael | Konferenzbeitrag |
| 2014 | Thermal analysis and optimization of 2.5D and 3D integrated systems with wide I/O memory
Heinig, Andy; Fischbach, Robert; Dittrich, Michael | Konferenzbeitrag |
| 2014 | Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen | Konferenzbeitrag |
| 2013 | Electro-thermal co-design of chip-package-board systems
Sohrmann, Christoph; Heinig, Andy; Dittrich, Michael; Jancke, Roland; Schneider, Peter | Konferenzbeitrag |
| 2012 | A flow for parasitics extraction in 3D-systems
Heinig, Andy; Dittrich, Michael; Reitz, Sven; Stolle, Jörn | Konferenzbeitrag |