Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Piazza, Silvio dalla; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter
Konferenzbeitrag
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter
Konferenzbeitrag
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, Charles-Alix; Zoschke, Kai; Oppermann, Hermann; Ruffieux, D.; Piazza, S. dalla; Suni, T.; Dekker, J.; Allegato, G.
Konferenzbeitrag
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Konferenzbeitrag
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Zeitschriftenaufsatz
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Konferenzbeitrag
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Konferenzbeitrag
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Konferenzbeitrag
2009A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level
Baumgartner, T.; Töpper, M.; Klein, M.; Schmid, B.; Knödler, D.; Kuisma, H.; Nurmi, S.; Kattelus, H.; Dekker, J.; Schachler, R.
Konferenzbeitrag