Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Holistic Die-to-Die Interface Design Methodology for 2.5-D Multi-Chip-Module Systems
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Zeitschriftenaufsatz
2021Transmitter and Channel Design for Multi-Chip Communication Interfaces
Chaudhary, Muhammad Waqas
Dissertation
202013-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Konferenzbeitrag
2020Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Konferenzbeitrag
2017High speed interfaces for chip communication on interposer based integration
Chaudhary, Muhammad Waqas; Heinig, Andy
Vortrag
2016Co-design of CML IO and interposer channel for low area and power signaling
Chaudhary, Muhammad Waqas; Heinig, Andy
Konferenzbeitrag
2016High speed interfaces between chips mounted with different integration technologies on an interposer
Chaudhary, Muhammad Waqas; Heinig, Andy
Konferenzbeitrag
2016Interposer based integration to achieve high speed interfaces for ADC application
Chaudhary, Muhammad Waqas; Heinig, Andy; Dittrich, Michael
Konferenzbeitrag