Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2019Assessment of FOWLP process dependent wafer warpage using parametric FE study
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas
Konferenzbeitrag
2019The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki
Konferenzbeitrag
2018Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven
Konferenzbeitrag
2018On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements
Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P.
Konferenzbeitrag
2015Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S.
Konferenzbeitrag
2014Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J.
Aufsatz in Buch
2014Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B.
Aufsatz in Buch
2014Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B.
Aufsatz in Buch
2014New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B.
Aufsatz in Buch
2013Finite Element Analysis for BEOL Stress Engineering to Improve Yield and Reliability of sub-30 nm Structures
Kaulfersch, E.; Braemer, B.; Rzepka, S.; Breuer, D.; Cluass, E.; Feustel, F.
Konferenzbeitrag
2013Toolbox for visco-elastic material modeling of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Brabandt, I.; Michel, B.
Konferenzbeitrag
2013Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum – FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Konferenzbeitrag
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Konferenzbeitrag
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Zeitschriftenaufsatz
2011Reliability investigations on stacked chip on MEMS
Kaulfersch, E.; Winkler, T.; Brämer, B.; Hammacher, J.
Konferenzbeitrag
2010Combination of FE simulation and micro deformation measurements - A promising approach to consider reliability aspects right from the start
Sommer, J.-P.; Michel, B.; Brämer, B.; Kugler, A.; Rank, H.
Konferenzbeitrag
2009Thermo-mechanical reliability assessment for 3D through-Si stacking
Dudek, R.; Brämer, B.; Irsigler, R.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Konferenzbeitrag
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Konferenzbeitrag
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Konferenzbeitrag
2001Abstimmbare Siliziumsensoren zur Vibrationsanalyse mit elektromagnetischer Selbsttest-Funktionalität
Scheibner, D.; Mehner, J.; Brämer, B.; Gessner, T.; Dötzel, W.
Konferenzbeitrag
1999Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B.
Konferenzbeitrag