Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Zeitschriftenaufsatz
2011Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Konferenzbeitrag
2011Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.
Konferenzbeitrag
2010Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.
Konferenzbeitrag
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Konferenzbeitrag