Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Flicker distortion power factor analysis in lighting LED's
Ionescu, C.; Dima, M.; Bonfert, D.
Konferenzbeitrag
2018Novel chip embedding and interconnection technology for mm-wave System-in-Package (SiP) applications
Landesberger, Christof; Drost,, A.; Faul, R.; Hell, W.; Scherbaum, S.; Bonfert, D.; Ott, A.; Hotopan, R.; Böhnke, R.
Konferenzbeitrag
2016FFT based investigations on light flicker in new lighting systems
Ionescu, C.; Dima, M.; Bonfert, D.
Konferenzbeitrag
2016Mechanical reliability analysis of ultra-thin chip-on-foil assemblies under different types of recurrent bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Konferenzbeitrag
2016A novel micropump driver used in environmental sensor applications
Kinzel, B.; Bonfert, D.; Lippert, F.; Vanselow, F.; Isa, E.; Schmitt-Landsiedel, D.; Maurer, L.
Konferenzbeitrag
2016Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.
Konferenzbeitrag
2015Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Konferenzbeitrag
2015Electro-thermal analysis of flexible micro-heater
Botau, A.; Bonfert, D.; Negrea, C.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2015A SPICE model for electroluminescent foils
Ionescu, C.; Draghici, F.; Bonfert, D.
Konferenzbeitrag
2014Electrical and thermal behavior for DC and pulsed stress on chip resistors
Botau, A.; Bonfert, D.; Negrea, C.
Konferenzbeitrag
2014ESD protective equipment. Investigation of two-layer knitted structures with conductive fibres content
Carpus, E.; Scarlat, R.; Bonfert, D.; Ene, A.; Mihai, C.; Visileanu, E.; Donciu, C.; Popa, A.; Enache, G.
Zeitschriftenaufsatz
2014Investigation on thermal properties of substrates for printed electronics
Ionescu, C.; Bonfert, D.; Branzei, M.
Konferenzbeitrag
2014Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process
Bose, I.; Bonfert, D.; Heim, S.; Bock, K.
Konferenzbeitrag
2014Studies on thermal properties of substrates for electronics using IR thermography
Ionescu, C.; Branzei, M.; Mihailescu, B.; Bonfert, D.
Konferenzbeitrag
2013Electrical stress on transparent conductive oxide layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2013Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications
Ionescu, C.; Codreanu, N.D.; Svasta, P.; Bonfert, D.
Konferenzbeitrag
2013Optimization of a heater geometry for flexible gas sensor applications
Ionescu, C.; Bonfert, D.; Codreanu, N.D.; Svasta, P.
Konferenzbeitrag
2013Sensing properties of carbon nanotube based thick film layers on foils
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2012Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.
Konferenzbeitrag
2012Analytical modeling of contact resistance in organic transistors
Bonea, A.; Hassinen, T.; Ofrim, B.A.; Bonfert, D.C.; Svasta, P.
Konferenzbeitrag
2012Behavior of electrical stressed flexible resistive layer. Part I: Carbon filled polymer
Bonfert, D.; Svasta, P.; Ionescu, C.
Zeitschriftenaufsatz
2012Behavior of electrical stressed flexible resistive layer. Part II: Intrinsically conductive polymer
Bonfert, D.; Svasta, P.; Ionescu, C.
Zeitschriftenaufsatz
2012Electrical stress on intrinsically conductive polymer layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2012Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation
Urbanski, K.J.; Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bonfert, D.; Bock, K.
Konferenzbeitrag
2012Influence of channel geometry over source to drain current
Busu, I.; Bonfert, D.; Svasta, P.
Zeitschriftenaufsatz
2012Influence of the organic transistors' layout on electrical parameters
Bonea, A.; Bonfert, D.; Buu, I.; Svasta, P.
Konferenzbeitrag
2012Investigations on current capabilities of PEDOT:PSS conductors
Ionescu, C.; Bonfert, D.; Codreanu, N.D.; Svasta, P.
Konferenzbeitrag
2012Investigations on organic printed resistors based on PEDOT:PSS
Ionescu, C.; Svasta, P.; Vasile, A.; Bonfert, D.
Konferenzbeitrag
2011Analytic parameter extraction for organic transistors with TIPS-Pentacene
Buu, I.; Bonea, A.; Svasta, P.; Bonfert, D.
Konferenzbeitrag
2011Contact resistance in Polytriarylamine based organic transistors
Bonea, A.; Bonfert, D.; Svasta, P.
Konferenzbeitrag
2011Electrical stress on film resistive structures on different substrates
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2011Electrical stress on thin film TaN resistive structures
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2011Simulation of printed thermoelectric generators using finite element analysis
Ionescu, C.; Svasta, P.; Bonfert, D.
Konferenzbeitrag
2010Analysis of planar inductors on flexible substrates for RFID antennas
Ionescu, C.; Svasta, P.; Bonfert, D.; Klink, G.
Konferenzbeitrag
2010Electrical stress on film resistive structures on flexible substrates
Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2010Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D.
Konferenzbeitrag
2010Polymer electronics towards system integration
Bonfert, D.; Klink, G.; Bock, K.
Konferenzbeitrag
2010Pulsed stress behavior of platinum thin films
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H.
Konferenzbeitrag
2009DC and thermal behavior of PEDOT:PSS thin films
Busu, I.; Svasta, P.; Bunea, R.; Bonfert, D.
Konferenzbeitrag
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Konferenzbeitrag
2009Investigation of solder joints by thermographical analysis
Svasta, P.; Ionescu, C.; Codreanu, N.D.; Bonfert, D.
Konferenzbeitrag
2009Properties of conductive microstructures containing nano sized silver particles
Felba, J.; Nitsch, K.; Piasecki, T.; Tesarski, S.; Moscicki, A.; Kinart, A.; Bonfert, D.; Bock, K.
Konferenzbeitrag
2009Pulsed behavior of polymer protection devices
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2009Pulsed stress behavior of PEDOT:PSS thin films
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2008Pulsed stress behavior of flexible thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2008Transient latch-up analysis of power control device with combined light emission and backside transient interferometric mapping methods
Heer, M.; Pogany, D.; Street, M.; Smith, I.; Riedlberger, F.; Bonfert, D.; Gieser, H.A.
Konferenzbeitrag
2007High Current Pulse Stress on Flexible Thick Film Resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Hemmetzberger, D.
Konferenzbeitrag
2007Transmission line pulse stress on thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Svasta, P.; Romanescu, A.; Cazacu, E.
Konferenzbeitrag
2007Transmission line pulsing behavior of thin film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Svasta, P.
Konferenzbeitrag
2006ESD susceptibility of submicron air gaps
Wolf, H.; Gieser, H.; Bonfert, D.; Hauser, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2006ESD susceptibility of thick film chip resistors by means of transmission line pulsing
Bonfert, D.; Wolf, H.; Gieser, H.; Stocker, A.
Konferenzbeitrag
2006Transient-induced latch-up test setup for wafer-level and package-level
Bonfert, D.; Gieser, H.; Wolf, H.; Frank, M.; Konrad, A.; Schulz, J.
Konferenzbeitrag, Zeitschriftenaufsatz
20053D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P.
Konferenzbeitrag, Zeitschriftenaufsatz
2005High quality strained Si/SiGe substrates for CMOS and optical devices
Weber, J.; Nebrich, L.; Bensch, F.; Neumeier, K.; Vogg, G.; Wieland, R.; Bonfert, D.; Ramm, P.
Konferenzbeitrag
2005Process integration of infrared-sensitive PIN photodiodes and CMOS transistors in a single-SiGe substrate
Nebrich, L.; Neumeier, K.; Stadler, A.; Weber, J.; Bensch, F.; Kreuzer, S.; Vogg, G.; Herrmann, K.; Klumpp, A.; Wieland, R.; Bonfert, D.; Soldner, W.; Ramm, P.
Konferenzbeitrag, Zeitschriftenaufsatz
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Konferenzbeitrag
2001Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R.
Konferenzbeitrag
1999Transient induced latch-up triggered by very fast pulses
Bonfert, D.; Gieser, H.
Konferenzbeitrag, Zeitschriftenaufsatz
1999Transient-Induced Latch-Up Triggered by Very Fast Pulses
Bonfert, D.; Gieser, H.
Zeitschriftenaufsatz, Konferenzbeitrag
1990Reliability investigations of thin film metallizations on AlN-ceramics
Bonfert, D.; Drost, A.; Feil, M.
Konferenzbeitrag