Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Elektronisches Modul und Verfahren zu seiner Herstellung
Böttcher, Lars; Kosmider, Stefan; Löher, Thomas; Ostmann, Andreas
Patent
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Vortrag
2013Development of Embedded Power Electronics Modules for Automotive Applications
Böttcher, Lars; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Konferenzbeitrag
2013Power modules with embedded components
Ostmann, Andreas; Boettcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Lang, Klaus-Dieter
Konferenzbeitrag
2012Development of embedded power electronics modules
Boettcher, Lars; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Zeitschriftenaufsatz
2012Leistungselektronik in Leiterplatten einbetten
Böttcher, Lars
Zeitschriftenaufsatz
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Konferenzbeitrag
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Konferenzbeitrag
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Konferenzbeitrag
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Konferenzbeitrag, Zeitschriftenaufsatz