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| 2011 | Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D. | Zeitschriftenaufsatz |
| 2010 | A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H. | Konferenzbeitrag |
| 2010 | Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M. | Konferenzbeitrag |
| 2010 | Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T. | Konferenzbeitrag |
| 2009 | A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level
Baumgartner, T.; Topper, M.; Klein, M.; Schmid, B.; Knodler, D.; Kuisma, H.; Nurmi, S.; Kattelus, H.; Dekker, J.; Schachler, R. | Konferenzbeitrag |
| 2009 | 3-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2009 | Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H. | Konferenzbeitrag |
| 2007 | Aqueous-base-developable benzocyclobutene (BCB)-based material - An emerging dielectric material for microelectronics
So, Y.-H.; Stark, E.; Kisting, S.; Scheck, D.; Baranek, K.; Toepper, M.; Baumgartner, T. | Konferenzbeitrag |
| 2007 | Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H. | Konferenzbeitrag |
| 2006 | Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air
So, Y.-H.; Stark, E.J.; Li, Y.; Kisting, S.; Achen, A.; Baranek, K.; Scheck, D.; Hetzner, J.; Folkenroth, J.J.; Töpper, M.; Baumgartner, T. | Zeitschriftenaufsatz |
| 2005 | Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D. | Konferenzbeitrag |
| 2005 | WLP Photoresists for the 21st Century
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Fischer, T.; Baumgartner, T.; Reichl, H. | Konferenzbeitrag |