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| 2012 | Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2012 | Micro structural root cause analysis of potential induced degradation in c-Si solar cells
Naumann, V.; Hagendorf, C.; Grosser, S.; Werner, M.; Bagdahn, J. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2011 | The influence of transport operations on the wafer strength and breakage rate
Köpge, Ringo; Schönfelder, Stephan; Giesen, Tim; Fischmann, Christian; Verl, Alexander; Bagdahn, Jörg | Konferenzbeitrag |
| 2011 | Investigations on crack development and crack growth in embedded solar cells
Sander, M.; Dietrich, S.; Pander, M.; Schweizer, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2011 | Mechanical characterisation and modelling of thin chips
Schoenfelder, S.; Bagdahn, J.; Petzold, M. | Aufsatz in Buch |
| 2011 | Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2011 | Systematische Untersuchung der Rissentstehung und des Rissfortschritts in eingebetteten Solarzellen
Sander, M.; Henke, B.; Schweizer, S.; Dietrich, S.; Pander, M.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Characterization of PV Modules by Combination of Mechanical and Electrical Analysis Methods
Sander, M.; Henke, B.; Schweizer, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Characterization of PV modules by combining results of mechanical and electrical analysis methods
Sander, M.; Henke, B.; Schwarz, H.; Dietrich, S.; Schweizer, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T. | Zeitschriftenaufsatz |
| 2010 | Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring
Gerbach, R.; Ebert, M.; Brokmann, G.; Hein, T.; Bagdahn, J. | Zeitschriftenaufsatz |
| 2010 | Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
Ganapati, V.; Schoenfelder, S.; Castellanos, S.; Oener, S.; Koepge, R.; Sampson, A.; Marcus, M.A.; Lai, B.; Morhenn, H.; Hahn, G.; Bagdahn, J.; Buonassisi, T. | Zeitschriftenaufsatz |
| 2010 | Investigations of laser and design parameters of via holes on mechanical strength of metal wrap through solar cells
Schoenfelder, S.; Oswald, M.; Fischer, C.; Zühlke, H.-U.; Berbig, C.; Geppert, T.; Wütherich, T.; Krokoszinski, H.-J.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Mechanical behavior and lamination issues of solar modules containing elastomeric and amorphous encapsulates
Schulze, S.H.; Ehrich, C.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots
Oswald, M.; Turek, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | PV module defect detection by combination of mechanical and electrical analysis methods
Sander, M.; Henke, B.; Schweizer, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J. | Konferenzbeitrag |
| 2010 | Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Constitutive behaviour of copper ribbons used in solar cell assembly processes
Wiese, S.; Meier, R.; Kraemer, F.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Identification of mechanical defects in MEMS using dynamic measurements for application in the production monitoring
Gerbach, R.; Ebert, M.; Brokmann, G.; Hein, T.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Local electronic properties and microstructure of individual laser-fired contacts
Naumann, V.; Hagendorf, C.; Werner, M.; Henke, B.; Schmidt, C.; Nekarda, J.-F.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Tensile testing of individual ultrathin electrospun poly(L-lactic acid) fibers
Jaeger, D.; Schischka, J.; Bagdahn, J.; Jaeger, R. | Zeitschriftenaufsatz |
| 2008 | Development of test procedures for polymer material characterization in view of long-term durability of PV-modules
Schulze, S.-H.; Dietrich, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | Fast characterization of silicon membrane structures by laser-doppler vibrometry
Gerbach, R.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | High-cycle fatigue and strengthening in polycrystalline silicon
Boroch, R.E.; Müller-Fiedler, R.; Bagdahn, J.; Gumbsch, P. | Zeitschriftenaufsatz |
| 2008 | Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
Sari, F.; Wiemer, M.; Bernasch, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | Mechanical strength of mono- and multicrystalline wafers
Schönfelder, S.; Bohne, A.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | Solarmodul sowie Verfahren zur Herstellung eines Solarmoduls
Busch, M.; Bagdahn, J. | Patent |
| 2008 | A standard method for measuring wafer bond strength for MEMS applications
Allen, R.A.; Marshall, J.; Baylies, W.; Read, D.; Delrio, F.; Turner, K.T.; Bernasch, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | Verfahren zur mechanischen Charakterisierung von Produktionsmaschinen fuer sproedbrechende Materialien
Kray, D.; Bagdahn, J.; Schoenfelder, S. | Patent |
| 2007 | Bonding and reliability for 3D mechanical, optical and fluidic systems
Wiemer, M.; Bagdahn, J.; Beckert, E.; Eichler, M.; Hollaender, A.; Vogel, D. | Konferenzbeitrag |
| 2007 | Characterization of strength properties of thin polycrystalline silicon films for MEMS applications
Boroch, R.; Wiaranowski, J.; Mueller-Fiedler, R.; Ebert, M.; Bagdahn, J. | Zeitschriftenaufsatz |
| 2007 | Comparison of test methods for strength characterization of thin solar wafer
Schönfelder, S.; Bohne, A.; Bagdahn, J. | Konferenzbeitrag |
| 2007 | Dynamic analyses of membranes and thin films on wafer level
Gerbach, R.; Naumann, F.; Ebert, M.; Bagdahn, J.; Klattenhoff, J.; Rembe, C. | Konferenzbeitrag |
| 2007 | Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J. | Zeitschriftenaufsatz |
| 2007 | Measurement of dynamic properties of MEMS and the possibilities of parameter identification by simulation
Ebert, M.; Naumann, F.; Gerbach, R.; Bagdahn, J. | Konferenzbeitrag |
| 2007 | Waferbond technologies and quality assesment
Wiemer, M.; Froemel, J.; Bagdahn, J.; Knechtel, R. | Konferenzbeitrag |
| 2006 | Comparison of the mechanical properties of low temperature bonded test samples
Bagdahn, J.; Bernasch, M.; Fischer, C.; Wiemer, M. | Konferenzbeitrag |
| 2006 | Drop simulation and stress analysis of MEMS devices
Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2006 | Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H. | Konferenzbeitrag |
| 2006 | Identification of geometrical parameters of MEMS from measured resonant frequencies
Gerbach, R.; Ebert, M.; Bagdahn, J.; Hering, S. | Konferenzbeitrag |
| 2006 | Influence of moulding process on strength of glass frit bonded structures
Ebert, M.; Bagdahn, J.; Knechtel, R. | Konferenzbeitrag |
| 2006 | Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M. | Zeitschriftenaufsatz |
| 2006 | Influence of the thickness of silicon dies on strength
Schönfelder, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2006 | Mechanical properties of glass frit bonded micro packages
Dresbach, C.; Krombholz, A.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2006 | Numerical identification of geometric parameters from dynamic measurement of grinded membranes on wafer level
Ebert, M.; Gerbach, R.; Bagdahn, J.; Michael, S.; Hering, S. | Konferenzbeitrag |
| 2006 | Room temperature bonding of nanostructured silicon wafers and mechanical characterization
Stubenrauch, M.; Fischer, M.; Bernasch, M.; Bagdahn, J. | Konferenzbeitrag |
| 2006 | Simulation of aggregating beads in microfluidics on high performance computers with a fluid particle method
Glatzel, T.; Ebert, M.; Bagdahn, J.; Hering, S. | Konferenzbeitrag |
| 2006 | Strength characterization of directly bonded silicon
Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J. | Konferenzbeitrag |
| 2006 | Strength characterization of laser diced silicon for application in solar industry
Schönfelder, S.; Bagdahn, J.; Baumann, S.; Kray, D.; Mayer, K.; Willeke, G.; Becker, M.; Christiansen, S. | Konferenzbeitrag |
| 2006 | A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
Knechtel, R.; Knaup, M.; Bagdahn, J. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2005 | Fracture and delamination of thin multilayers on ultra-thin silicon
Kravchenko, G.; Bagdahn, J. | Konferenzbeitrag |
| 2005 | Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C. | Konferenzbeitrag |
| 2005 | Konzepte für die Sicherung von Festigkeit und Zuverlässigkeit von Komponenten der Siliziummikromechanik
Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2005 | Mechanical failure behavior of glass frit bondet structures
Ebert, M.; Dresbach, C.; Krombholz, A.; Bagdahn, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Hofer, H. | Konferenzbeitrag |
| 2005 | Mechanical reliability of directly bonded silicon MEMS components
Bagdahn, J.; Wiemer, M.; Petzold, M. | Konferenzbeitrag |
| 2005 | NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M. | Konferenzbeitrag |
| 2005 | Reliability of wafer bonding in microsystem technologies
Bagdahn, J. | Konferenzbeitrag |
| 2005 | Sicherung der Ausbeute und Zuverlässigkeit industriell gefertigter direkt wafergebondeter mikromechanischer Sensoren
Bagdahn, J.; Wiemer, M | Bericht |
| 2005 | Strength analysis of etched silicon pressure sensors
Ebert, M.; Knaup, M.; Stelzer, T.; Bagdahn, J.; Bartuch, H.; Brokmann, G. | Konferenzbeitrag |
| 2004 | Debonding of wafer-bonded interfaces for handling and transfer applications
Bagdahn, J.; Petzold, M. | Aufsatz in Buch |
| 2004 | Determination of residual stress in glass frit bonded MEMS by finite element analysis
Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2004 | Fatigue testing of polysilicon - a review
Sharpe, W.N.; Bagdahn, J. | Zeitschriftenaufsatz |
| 2004 | Strength and reliability properties of glass frit bondet micro packages
Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2004 | Strength and reliability testing for silicon based MEMS
Petzold, M.; Bagdahn, J.; Katzer, D. | Aufsatz in Buch |
| 2003 | Debonding of directly wafer-bonded silicon after high temperature process steps
Bagdahn, J.; Knoll, H.; Petzold, M.; Wiemer, M.; Frömel,J. | Abstract, Konferenzbeitrag |
| 2003 | A failure criterion for interface notches in silicon/glass anodic bonds
Knaup, M.; Busch, M.; Bagdahn, J.; Maschke, H.-G. | Konferenzbeitrag |
| 2003 | Fatigue of polycrystalline silicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N. | Zeitschriftenaufsatz |
| 2003 | Fracture strength of polysilicon at stress concentrations
Bagdahn, J.; Sharpe, W.N.; Jadaan, O. | Zeitschriftenaufsatz |
| 2003 | A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M. | Zeitschriftenaufsatz |
| 2003 | Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials
Jadaan, O.M.; Nemeth, N.N.; Bagdahn, J.; Sharpe, W.N. | Zeitschriftenaufsatz |
| 2003 | Tensil testing of MEMS materials recent progress
Sharpe, W.N.; Bagdahn, J.; Jackson, K.; Coles, G. | Zeitschriftenaufsatz |
| 2002 | Fatique of materials used in microelectromechanical systems (MEMS)
Sharpe, W.N.; Bagdahn, J. | Konferenzbeitrag |
| 2002 | Fracture strength of polysilicon thin films at stress concentration
Bagdahn, J.; Sharpe, W.N. | Konferenzbeitrag |
| 2002 | Influence of the frequency on fatique of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M. | Konferenzbeitrag |
| 2002 | Reliability of polysilicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N. | Konferenzbeitrag |
| 2002 | Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J. | Konferenzbeitrag |
| 2001 | Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren
Wiemer, M; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2001 | Fatigue of directly wafer-bonded silicon under static and cyclic loading
Bagdahn, J.; Petzold, M. | Zeitschriftenaufsatz |
| 2001 | Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, M.; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2001 | Lifetime properties of wafer-bonded components under static and cyclic loading
Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2001 | Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
Bagdahn, J.; Petzold, M.; Plößl, A.; Wiemer, M. | Konferenzbeitrag |
| 2001 | A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U. | Konferenzbeitrag |
| 2001 | Strength and fatigue investigations of polycrystalline silicon
Bagdahn, J.; Sharpe, W.N.; Schischka, J.; Petzold, M. | Konferenzbeitrag |
| 2001 | Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
Petzold, M.; Knoll, H.; Bagdahn, J. | Konferenzbeitrag |
| 2001 | Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U. | Konferenzbeitrag |
| 2000 | Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag |
| 2000 | Lifetime investigations of directly wafer-bonded samples under static and cyclic loading
Bagdahn, J.; Petzold, M.; Sommer, E. | Konferenzbeitrag |
| 2000 | Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches
Bagdahn, J.; Petzold, M.; Seidel, H. | Konferenzbeitrag |
| 1999 | Quality and mechanical reliability assessment of wafer-bonded micromechanical components
Petzold, M.; Bagdahn, J.; Katzer, D. | Zeitschriftenaufsatz |
| 1998 | The interface of silicon samples joined at room temperature by wafer direct bonding in ultrahigh vacuum
Plößel, A.; Scholz, R.; Bagdahn, J.; Stenzel, H.; Tu, K.N.; Gösele, U. | Konferenzbeitrag |
| 1998 | Mechanical reliability of silicon wafer-bonded components
Bagdahn, J.; Katzer, D.; Petzold, M. | Konferenzbeitrag |
| 1998 | Untersuchungen zum subkritischen Rißwachstum gebondeter Siliziumwafer
Bagdahn, J.; Katzer, D.; Petzold, M. | Konferenzbeitrag |
| 1997 | Characterisation of directly bonded silicon wafers by means of the double cantilever crack opening method
Bagdahn, J.; Petzold, M.; Reiche, M.; Gutjahr, K. | Konferenzbeitrag |
| 1997 | The influence of sharp notches on the strength of directly bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M. | Konferenzbeitrag |
| 1997 | Mechanical reliability tests for bonded wafers
Bagdahn, J.; Petzold, M.; Reiche, M.; Wiemer, M. | Konferenzbeitrag |
| 1995 | Einfluß von Prüfbedingungen und Strukturierungen auf die Zugfestigkeit gebondeter Siliziumwafer
Bagdahn, J. | Diplom-Arbeit |
| 1995 | Investigations of the interface strength of bonded silicon wafers
Bagdahn, J.; Heinzelmann, M.; Petzold, M.; Reiche, M. | Konferenzbeitrag |