| | |
|---|
| 2020 | Dielectric strength and aging performance of polybutylene terephthalate (PBT) under the influence of temperature and humidity
Wels, S.; Boettge, B.; Bernhardt, R.; Klengel, S.; Claudi, A. | Konferenzbeitrag |
| 2020 | Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger | Konferenzbeitrag |
| 2018 | The influence of environmental conditions on the properties of housing materials for power electronics
Böttge, B.; Bernhardt, R.; Klengel, S.; Wels, S.; Claudi, A. | Konferenzbeitrag |
| 2018 | Limitation of test sample arrangements according to IEC 60243-1: Electrical strength of insulating materials - Test methods
Wels, S.; Obst, J.; Claudi, A.; Böttge, B.; Bernhardt, R.; Klengel, S. | Konferenzbeitrag |
| 2018 | Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R. | Konferenzbeitrag |
| 2018 | Microstructural and chemical investigation of dielectric breakdown areas in engineering plastics
Bernhardt, R.; Böttge, B.; Klengel, S.; Bron, M.; Wels, S.; Claudi, A. | Konferenzbeitrag |
| 2018 | Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves
Brand, S.; Böttge, B.; Kögel, M.; Naumann, F.; Zijl, J.; Kersjes, S.; Behrens, T.; Altmann, F. | Konferenzbeitrag |
| 2016 | Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S. | Konferenzbeitrag |
| 2014 | Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B. | Konferenzbeitrag |
| 2014 | High resolution failure analysis of silver-sintered contact interfaces for power electronics
Boettge, B.; Maerz, B.; Schischka, J.; Klengel, S.; Petzold, M. | Konferenzbeitrag |
| 2013 | Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates
Poller, T.; Lutz, J.; Boettge, B.; Knoll, H. | Konferenzbeitrag |
| 2013 | Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M. | Konferenzbeitrag |
| 2012 | Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2012 | Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H. | Konferenzbeitrag |
| 2011 | High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach
Klengel, S.; Böttge, B.; Petzold, M.; Schneider, W. | Konferenzbeitrag |
| 2010 | Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T. | Zeitschriftenaufsatz |
| 2010 | Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M. | Zeitschriftenaufsatz |
| 2010 | Selbstausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen
Bräuer, J.; Böttge, B.; Wiemer, M.; Petzold, M.; Gessner, T. | Konferenzbeitrag |
| 2010 | Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J. | Konferenzbeitrag |
| 2009 | Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B. | Konferenzbeitrag |
| 2008 | Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J. | Konferenzbeitrag |