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| 2012 | Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
Schmidt, C.; Altmann, F.; Breitenstein, O. | Zeitschriftenaufsatz |
| 2012 | Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L. | Konferenzbeitrag |
| 2012 | Emerging techniques for 3-D integrated system-in-package failure diagnostics
Altmann, F.; Petzold, M. | Zeitschriftenaufsatz |
| 2012 | Enhanced comparison of lock-in thermography and magnetic microscopy for 3D defect localization of system in packages
Schmidt, C.; Altmann, F.; Vallett, D. P. | Konferenzbeitrag |
| 2012 | Enhanced failure analysis on open TSV interconnects
Altmann, F.; Schmidt, C.; Beyersdorfer, J.; Simon-Najasek, M.; Große, C.; Schrank, F.; Kraft, J. | Konferenzbeitrag |
| 2012 | Failure analysis using scanning acoustic microscopy for diagnostics of electronic devices and 3D system integration technologies
Czurratis, P.; Hoffrogge, P.; Brand, S.; Altmann, F.; Petzold, M. | Konferenzbeitrag |
| 2012 | Microscopic degradation analysis of RF-stressed AlGaN/GaN HEMTs
Gütle, F.; Baeumler, M.; Dammann, M.; Cäsar, M.; Walcher, H.; Waltereit, P.; Bronner, W.; Müller, S.; Kiefer, R.; Quay, R.; Mikulla, M.; Ambacher, O.; Graff, A.; Altmann, F.; Simon, M. | Konferenzbeitrag |
| 2012 | A new technique for non-invasive short-localisation in thin dielectric layers by electron beam absorbed current (EBAC) imaging
Simon-Najasek, M.; Jatzkowski, J.; Große, C.; Altmann, F. | Konferenzbeitrag |
| 2012 | Novel techniques for dopant contrast analysis on real IC structures
Jatzkowski, J.; Simon-Najasek, M.; Altmann, F. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Thermal investigations on CMOS integrated micro-hot-plates using IR thermography
Schmidt, C.; Altmann, F.; Mutinati, G. C.; Brunet, E.; Steinhauer, S.; Koeck, A.; Siegele, M.; Gamauf, C.; Nemecek, A.; Teva, J.; Kraft, J.; Siegert, J.; Schrank, F.; Kruschke, H. | Konferenzbeitrag |
| 2011 | 3D Sensor application with open through silicon via technology
Kraft, J.; Schrank, F.; Teva, J.; Siegert, J.; Koppitsch, G.; Cassidy, C.; Wachmann, E.; Altmann, F.; Brand, S.; Schmidt, C.; Petzold, M. | Konferenzbeitrag |
| 2011 | Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution
Krause, M.; Altmann, F.; Schmidt, C.; Petzold, M.; Malta, D.; Temple, D. | Konferenzbeitrag |
| 2011 | Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
Malta, D.; Gregory, C.; Lueck, M.; Temple, D.; Krause, M.; Altmann, F.; Petzold, M.; Weatherspoon, M.; Miller, J. | Konferenzbeitrag |
| 2011 | Characterization of wafer-bonded joins using high-resolution transmission electron microscopy
Höche, T.; Graff, A.; Altmann, F.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2011 | Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M. | Konferenzbeitrag |
| 2011 | From recombinant proteins to plant-made-pharmaceuticals
Stoger, E.; Rademacher, T.; Arcalis, E.; Sack, M.; Stiegler, G.; Altmann, F.; Fischer, R. | Zeitschriftenaufsatz |
| 2011 | Quantitative phase shift analysis for 3D defect localization using lock-in thermography
Schmidt, C.; Altmann, F. | Konferenzbeitrag |
| 2011 | Reliability and degradation mechanism of 0.25 µm AlGaN/GaN HEMTs under RF stress conditions
Dammann, M.; Baeumler, M.; Gütle, F.; Cäsar, M.; Walcher, H.; Waltereit, P.; Bronner, W.; Müller, S.; Kiefer, R.; Quay, R.; Mikulla, M.; Ambacher, O.; Graff, A.; Altmann, F.; Simon, M. | Konferenzbeitrag |
| 2011 | Use of lock-in thermography for non-destructive 3D defect localization on system in package and stacked-die technology
Schlangen, R.; Motegi, S.; Nagatomo, T.; Schmidt, C.; Altmann, F.; Murakami, H.; Hollingshead, S. | Konferenzbeitrag |
| 2010 | Application of lock-in thermography for backside failure localization using solid immersion lenses
Schmidt, C.; Große, C.; Altmann, F.; Schulz, J.; Seibt, A. | Konferenzbeitrag |
| 2010 | The changing fate of a secretory glycoprotein in developing maize endosperm
Arcalis, E.; Stadlmann, J.; Marcel, S.; Drakakaki, G.; Winter, V.; Rodriguez, J.; Fischer, R.; Altmann, F.; Stoger, E. | Zeitschriftenaufsatz |
| 2010 | Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis
Altmann, F.; Petzold, M.; Schmidt, C.; Salzer, R.; Cassidy, C.; Tesch, P.; Smith, N. | Konferenzbeitrag |
| 2010 | Combined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization
Altmann, F.; Schischka, J.; Ngo, V. van; Stone, S.; Kwakman, L.F.T.; Lehmann, R. | Konferenzbeitrag |
| 2010 | Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
Schlangen, R.; Deslandes, H.; Lundquist, T.; Schmidt, C.; Altmann, F.; Yu, K.; Andreasyan, A.; Li, S. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2010 | Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M. | Konferenzbeitrag |
| 2010 | Fehlermechanismen an Leiterplattenmetallisierungen für bleifrei gelötete Packageaufbauten
Bennemann, S.; Simon, M.; Petzold, M.; Altmann, F. | Konferenzbeitrag |
| 2010 | Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F. | Konferenzbeitrag |
| 2010 | Localization of electrical defects in system in package devices using lock-in thermography
Schmidt, C.; Grosse, C.; Altmann, F. | Konferenzbeitrag |
| 2010 | Micro structure analysis for system in package components - novel tools for fault isolation, target preparation, and high-resolution material diagnostics
Petzold, M.; Altmann, F.; Krause, M.; Salzer, R.; Schmidt, C.; Martens, S.; Mack, W.; Dömer, H.; Nowodzinski, A. | Konferenzbeitrag |
| 2010 | Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography
Schmidt, C.; Altmann, F.; Schlangen, R.; Deslandes, H. | Konferenzbeitrag |
| 2010 | Optimal nitrogen supply as a key to increased and sustained production of a monoclonal full-size antibody in BY-2 suspension culture
Holland, T.; Sack, M.; Rademacher, T.; Schmale, K.; Altmann, F.; Stadlmann, J.; Fischer, R.; Hellwig, S. | Zeitschriftenaufsatz |
| 2010 | Quantitative assessment of TEM-sample warping caused by FIB preparation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F. | Konferenzbeitrag, Abstract |
| 2010 | Strain determination using electron backscatter diffraction
Krause, M.; Graff, A.; Altmann, F. | Konferenzbeitrag |
| 2009 | Application of He ion microscopy for material analysis
Altmann, F.; Simon, M.; Klengel, R. | Konferenzbeitrag |
| 2009 | Failure analysis of stacked-die devices by combining non-destructive localization and target preparation methods
Schmidt, C.; Simon, M.; Altmann, F.; Nowodzinski, A. | Konferenzbeitrag |
| 2009 | Reliability characterization and process optimization of Ni-based microinsert interconnections for flip chip die on wafer attachment
Boutry, H.; Brun, J.; Nowodzinski, A.; Sillon, N.; Depoutot, F.; Dubois-Bonvalot, B.; Schmidt, C.; Simon, M.; Altmann, F. | Konferenzbeitrag |
| 2009 | Standard free thickness determination of thin TEM samples via backscatter electron image correlation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F. | Konferenzbeitrag |
| 2009 | Standard free thickness determination of thin TEM samples via backscatter electron image correlation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Surface amorphization, sputter rate, and intrinsic stresses of silicon during low energy Ga+ focused-ion beam milling
Pastewka, L.; Salzer, R.; Graff, A.; Altmann, F.; Moseler, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Thermal simulation of defect localisation using lock-in thermography in complex and fully packaged devices
Schmidt, C.; Naumann, F.; Altmann, F.; Martens, S.; Wilde, J. | Konferenzbeitrag |
| 2008 | Application of lock-in-thermography for 3D defect localisation in complex devices
Schmidt, C.; Altmann, F.; Grosse, C.; Naumann, F.; Lindner, A. | Konferenzbeitrag |
| 2008 | Lock-in-thermography for 3- dimensional localization of electrical defects inside complex packaged devices
Schmidt, C.; Altmann, F.; Grosse, C.; Lindner, A.; Gottschalk, V. | Konferenzbeitrag |
| 2008 | Reducing of ion beam induced surface damaging using »low voltage«
Salzer, R.; Simon, M.; Graff, A.; Altmann, F.; Pastewka, L.; Moseler, M. | Konferenzbeitrag |
| 2007 | Investigation of cell-sensor hybrid structures by Focused Ion Beam (FIB) technology
Heilmann, A.; Altmann, F.; Cismak, A.; Baumann, W.; Lehmann, M. | Konferenzbeitrag |
| 2007 | Long-term stability of composite cathode at high current densities
Kusnezoff, M.; Trofimenko, N.; Mosch, S.; Beckert, W.; Graff, A.; Altmann, F. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Verfahren zur Detektion von durch Unterbrechungen charakterisierbare Fehlstellen in Leitbahnnetzwerken
Altmann, F.; Riediger, T. | Patent |
| 2006 | Analyseverfahren, zerstörende Analyse und hochauflösende Diagnostik
Petzold, M.; Altmann, F.; Wilde, J.; Schneider-Ramelow, M. | Aufsatz in Buch |
| 2006 | Influence of intermetallic phases on reliability in thermosonic Au-Al wire bonding
Müller, T.; Schräpler, L.; Altmann, F.; Knoll, H.; Petzold, M. | Konferenzbeitrag |
| 2006 | The intracellular fate of a recombinant protein is tissue-dependent
Drakakaki, G.; Marcel, S.; Arcalis, E.; Altmann, F.; Gonzalez-Melendi, P.; Fischer, R.; Christou, P.; Stoger, E. | Zeitschriftenaufsatz |
| 2006 | Inversion of microscopic lock-in thermograms in the presence of emissivity contrast
Breitenstein, O.; Altmann, F. | Zeitschriftenaufsatz |
| 2006 | Lock-in infrared microscopy with 1.4. µm resolution by using a solid immersion lens
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D. | Zeitschriftenaufsatz |
| 2006 | Lock-in thermal IR imaging using a solid immersion lens
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.; Gottschalk, V. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2006 | Mikrogreifer
Große, C.; Altmann, F.; Simon, M.; Hoffmeister, H.; Riemer, D. | Patent |
| 2006 | TEM-Präparation mittels "low-voltage-FIB"
Altmann, F.; Graff, A.; Simon, M.; Hoffmeister, H.; Gnauck, P. | Zeitschriftenaufsatz |
| 2006 | Use of a solid immersion lens for thermal IR imaging
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.; Gottschalk, V. | Konferenzbeitrag |
| 2005 | TEM-Zielpräparation unter REM-Beobachtung mittels Zweistrahl-FIB
Altmann, F. | Zeitschriftenaufsatz |
| 2004 | New developments in IR lock-in thermography
Breitenstein, O.; Rakotoniaina, J.P.; Al Rifai, M.H.; Gradhand, M.; Altmann, F.; Riediger, T. | Konferenzbeitrag |
| 2004 | Unexpected deposition patterns of recombinant proteins in post-endoplasmic reticulum compartments of wheat endosperm
Arcalis, E.; Marcel, S.; Altmann, F.; Kolarich, D.; Drakakaki, G.; Fischer, R.; Christou, P.; Stoger, E. | Zeitschriftenaufsatz |
| 2004 | Zielgenaue Präparation von Proben für die Transmissionselektronenmikroskopie
Altmann, F.; Katzer, D. | Zeitschriftenaufsatz |
| 2003 | FIB-pinpointed preparation of TEM samples by a needle based manipulator (lift-out) technique
Altmann, F. | Zeitschriftenaufsatz |
| 2003 | FIB-Zielpräparation von TEM-Proben mittels Nadelmanipulationstechnik
Altmann, F. | Zeitschriftenaufsatz |
| 2002 | Fault localization and functional testing of ICs by lock-in thermography
Breitenstein, O.; Rakotoniaina, J.P.; Altmann, F.; Schulz, J.; Linse, G. | Konferenzbeitrag |
| 2002 | Lock-In IR-Thermography - A Novel Tool for Material and Device Characterization
Huth, S.; Breitenstein, O.; Huber, A.; Danz, D.; Lambert, U.; Altmann, F. | Zeitschriftenaufsatz |
| 2002 | Verfahren und Vorrichtung zur Untersuchung von Waermequellen innerhalb einer elektrisch leitendes Material aufweisenden Probe
Altmann, F. | Patent |
| 2000 | Microscopic lock-in thermography investigation of leakage sites in integrated circuits
Breitenstein, O.; Langenkamp, M.; Altmann, F.; Katzer, D.; Lindner, A.; Eggers, H. | Zeitschriftenaufsatz |
| 1999 | Cross-sectional specimen preparation from ICs downside for SEM and TEM-failure analysis using focused ion beam etching
Altmann, F.; Katzer, D. | Zeitschriftenaufsatz |
| 1999 | Determination of the pore size and the vertical structure of nanoporous aluminium oxide membranes
Heilmann, A.; Altmann, F.; Katzer, D.; Müller, F.; Sawitowski, T.; Schmid, G. | Zeitschriftenaufsatz |
| 1999 | Einsatz von Elektronen- und Ionenstrahltechniken für die Diagnose an glasartigen Systemen
Füting, M.; Altmann, F.; Berthold, L.; Petzold, M. | Konferenzbeitrag |
| 1997 | Strain measurement by means of convergent beam electron diffraction in submicron volumes
Langer, E.; Altmann, F.; Katzer, D.; Neumann, W. | Konferenzbeitrag |
| 1996 | Messung mechanischer Spannungen in Mikrokomponenten mittels konvergenter Beugung (CBED) im TEM
Altmann, F. | Diplom-Arbeit |