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| 2016 | Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Piazza, Silvio dalla; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter | Konferenzbeitrag |
| 2015 | Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter | Konferenzbeitrag |
| 2015 | Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, Charles-Alix; Zoschke, Kai; Oppermann, Hermann; Ruffieux, D.; Piazza, S. dalla; Suni, T.; Dekker, J.; Allegato, G. | Konferenzbeitrag |
| 2014 | A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G. | Zeitschriftenaufsatz |
| 2013 | Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D. | Konferenzbeitrag |
| 2013 | Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G. | Konferenzbeitrag |
| 2013 | A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G. | Konferenzbeitrag |
| 2009 | Investigation of key technologies for system-in-package integration of inertial MEMS
Marenco, N.; Reinert, W.; Warnat, S.; Lange, P.; Gruenzig, S.; Allegato, G.; Hillmann, G.; Kostner, H.; Gal, W.; Guadagnuolo, S.; Conte, A.; Malecki, K.; Friedel, K. | Konferenzbeitrag |