Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Zeitschriftenaufsatz
2018A method for the assembly of microelectronic packages using microwave curing
Adamietz, Raphael
: Verl, Alexander (Hauptberichter)
Dissertation
2017A concept for flexible battery cell manufacturing from low to medium volumes
Giesen, Tim; Adamietz, Raphael; Mayer, Pablo; Stiefel, Philipp; Alle, Patrick; Schlenker, Dirk
Konferenzbeitrag
2016A modular flexible scalable and reconfigurable system for manufacturing of Microsystems based on additive manufacturing and e-printing
Scholz, Steffen; Müller, Tobias; Plasch, Matthias; Limbeck, Hannes; Adamietz, Raphael; Iseringhausen, Tobias; Kimmig, Daniel; Dickerhof, Markus; Wögerer, Christian
Zeitschriftenaufsatz
2014A first step towards cross-platform integration in modular micro-assembly systems - concept for a process module construction kit
Adamietz, Raphael; Iseringhausen, Tobias; Gerstenberg, Steffen; Verl, Alexander
Konferenzbeitrag
2014A generative manufacturing-based concept and equipment for flexible, scalable manufacturing of microsystems
Dickerhof, Markus; Kimmig, Daniel; Adamietz, Raphael; Iseringhausen, Tobias; Segal, Joel; Vladov, Nikola; Pfleging, Wilhelm; Torge, Maika
Konferenzbeitrag
2014A modular flexible scalable and reconfigurable system for manufacturing of microsystems based on additive manufacturing and E-printing
Wögerer, Christian; Plasch, Matthias; Heidl, Wolfgang; Dickerhof, Markus; Kimmig, Daniel; Scholz, Steffen; Adamietz, Raphael; Iseringhausen, Tobias
Konferenzbeitrag
2014Modular workpiece carrier system for micro production
Iseringhausen, Tobias; Adamietz, Raphael; Schlenker, Dirk; Verl, Alexander
Konferenzbeitrag
2014Overview of challenges in ultrathin substrate handling
Giesen, Tim; Adamietz, Raphael; Kreck, Guido; Iseringhausen, Tobias; Wertz, Roland
Zeitschriftenaufsatz
2014Process module construction kit for modular micro assembly systems
Adamietz, Raphael; Iseringhausen, Tobias; Verl, Alexander
Konferenzbeitrag
2014The SMARTLAM 3D-I concept: Design of microsystems from functional elements fabricated by generative manufacturing technologies
Dickerhof, Markus; Kimmig, Daniel; Adamietz, Raphael; Iseringhausen, Tobias; Segal, Joel; Vladov, Nikola; Pfleging, Wilhelm; Torge, Maika
Konferenzbeitrag
2013An additive manufacturing and e-printing based approach for flexible scalable manufacturing of Microsystems
Dickerhof, Markus; Kimmig, Daniel; Scholz, Steffen; Wögerer, Christian; Adamietz, Raphael; Pfleging, Wilhelm
Konferenzbeitrag
2013Wirtschaftlich vom Labor bis in die Serie - Prozessmodule aus dem Baukasten für die Mikromontage
Adamietz, Raphael; Gerstenberg, Steffen
Konferenzbeitrag
2012Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Zeitschriftenaufsatz
2012A microwave curing system for microelectronics assembly
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2011Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2011Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris
Konferenzbeitrag
2010Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P. Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Konferenzbeitrag
2010Modular microwave-based system for packaging applications
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P. Y.; Müller, Guido; Othman, Nabih; Eicher, Frank
Konferenzbeitrag
2010Modulare Montageanlage
Adamietz, Raphael; Iseringhausen, Tobias; Zapp, Matthias
Zeitschriftenaufsatz
2010Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P. Y.; Bailey, Chris
Konferenzbeitrag
2010Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P. Y.; Bailey, Chris
Konferenzbeitrag
2010On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P. Y.; Bailey, Chris
Konferenzbeitrag
2010On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P. Y.
Konferenzbeitrag
2009Modulare Bearbeitungsanlage und Verfahren zur Montage, Herstellung und Bearbeitung und Analyse
Schlenker, Dirk; Iseringhausen, Tobias; Adamietz, Raphael
Patent