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2019 | Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, U.; Klingler, M.; Arnold, J.; Baum, M.; Weißbach, M.; Schaal, M.; Wunderle, B. | Conference Paper |
2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Conference Paper |
2018 | Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, A.; Zschenderlein, U.; Baum, M.; Brunschwiler, T.; Wright, D.N.; Wunderle, B. | Conference Paper |
2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Conference Paper |
2017 | Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Journal Article, Conference Paper |
2016 | Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
2016 | Re-building the underfill: Performance of percolating fillers at package scale Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
2016 | Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R. | Conference Paper |
2015 | Advances in percolated thermal underfill (PTU) simulations for 3D-integration Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B. | Conference Paper |
2015 | Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B. | Conference Paper |
2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Conference Paper |
2014 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B. | Conference Paper |
2007 | Röntgenoptiken aus mikrostrukturiertem Silizium Zschenderlein, U.; Frühauf, J.; Straube, H.; Gärtner, E.; Kämpfe, B.; Luczak, F.; Zimny, F.; Petrick, H.; Böhme, H. | Conference Paper |
2007 | X-Ray Optics Manufactured by Microtechnology for ED XRD Systems Zschenderlein, U.; Frühauf, J.; Straube, H.; Gärtner, E.; Kämpfe, B.; Luczak, F.; Zimny, F.; Petrick, H.; Böhme, H. | Conference Paper |