Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fully printed zinc oxide electrolyte-gated transistors on paper
Carvalho, José Tiago; Dubceac, Viorel; Grey, Paul; Cunha, Ines; Fortunato, Elvira; Martins, Rodrigo; Clausner, André; Zschech, Ehrenfried; Pereira, Luis
Journal Article
2018Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Characterization of spatial distribution of electrolyte in molten carbonate fuel cell cathodes
Wejrzanowski, Tomasz; Gluch, Jürgen; Ibrahim, Samih Haj; Cwieka, Karol; Milewski, Jaroslaw; Zschech, Ehrenfried
Journal Article
2018Cobalt-based metal-organic framework nanoarrays as bifunctional oxygen electrocatalysts for rechargeable Zn-air batteries
Chen, Guangbo; Zhang, Jian; Wang, Faxing; Wang, Lanlan; Liao, Zhongquan; Zschech, Ehrenfried; Müllen, Klaus; Feng, Xinliang
Journal Article
2018Combination of soft X-ray microscopy with in-situ mechanical testing to image crack propagation in microchips
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article, Conference Paper
2018Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes
Zhang, Tao; Hou, Yang; Dzhagan, Volodymyr M.; Liao, Zhongquan; Chai, Guoliang; Löffler, Markus; Olianas, Davide; Milani, Alberto; Xu, Shunqi; Tommasini, Matteo; Zahn, Dietrich R.T.; Zheng, Zhikun; Zschech, Ehrenfried; Jordan, Rainer Andreas; Feng, Xinliang
Journal Article
2018A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior
Dong, Renhao; Zhang, Zhitao; Tranca, Diana C.; Zhou, Shengqiang; Wang, Mingchao; Adler, Peter; Liao, Zhongquan; Liu, Feng; Sun, Yan; Shi, Wujun; Zhang, Zhe; Zschech, Ehrenfried; Mannsfeld, Stefan C.B.; Felser, Claudia; Feng, Xinliang
Journal Article
2018A delamination strategy for thinly layered defect-free high-mobility black phosphorus flakes
Yang, Sheng; Zhang, Ke; Ricciardulli, Antonio Gaetano; Zhang, Panpan; Liao, Zhongquan; Lohe, Martin R.; Zschech, Ehrenfried; Blom, Paul W.M.; Pisula, Wojciech; Müllen, Klaus; Feng, Xinliang
Journal Article
2018In-situ X-ray microscopy of crack-propagation to study fracture mechanics of on-chip interconnect structures
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Laboratory computed x-ray tomography - a nondestructive technique for 3D microstructure analyis of materials
Zschech, Ehrenfried; Löffler, Markus; Krüger, Peter; Gluch, Jürgen; Kutukova, Kristina; Zglobicka, Izabela; Silomon, Jendrik; Rosenkranz, Rüdiger; Standke, Yvonne; Topal, E.
Journal Article
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Multi-modal porous microstructure for high temperature fuel cell application
Wejrzanowski, T.; Haj Ibrahim, S.; Cwieka, K.; Löffler, Markus; Milewski, J.V.; Zschech, Ehrenfried; Lee, C.-G.
Journal Article
2018A novel micro-double cantilever beam (micro-DCB) test in an X-ray microscope to study crack propagation in materials and structures
Kutukova, Kristina; Niese, Sven; Gelb, Jeff; Dauskardt, Reinhold; Zschech, Ehrenfried
Journal Article
2018Polymerization driven monomer passage through monolayer chemical vapour deposition graphene
Zhang, Tao; Liao, Zhongquan; Medrano Sandonas, Leonardo; Dianat, Arezoo; Liu, Xiaoling; Xiao, Peng; Amin, Ihsan; Gutierrez, Rafael; Chen, Tao; Zschech, Ehrenfried; Cuniberti, Gianaurelio; Jordan, Rainer
Journal Article
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers
Garitagoitia, Maria Aranzazu; Rosenkranz, Rüdiger; Löffler, M.; Clausner, André; Standke, Yvonne; Zschech, Ehrenfried
Journal Article
2018Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation
Huang, J.; Löffler, Markus; Mühle, Uwe; Möller, Wolfhard; Mulders, Johannes J.L.; Kwakman, Laurens; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2018Vorrichtung zur Durchführung von Biegeversuchen an plattenförmigen Proben
Clausner, André; Gall, Martin; Macher, Frank; Sander, Christoph; Zschech, Ehrenfried
Patent
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Journal Article
2017Area-selective atomic layer deposition of Ru on electron-beam-written Pt(C) patterns versus SiO2 substratum
Junige, Marcel; Löffler, Markus; Geidel, Marion; Albert, Matthias; Bartha, Johann W.; Zschech, Ehrenfried; Rellinghaus, Bernd; Dorp, Willem F. van
Journal Article
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Journal Article
2017Doping of graphene induced by boron/silicon substrate
Dianat, Arezoo; Liao, Zhongquan; Gall, Martin; Zhang, Tao; Gutierrez, Rafael; Zschech, Ehrenfried; Cuniberti, Gianaurelio
Journal Article
2017Editorial
Zschech, Ehrenfried
Journal Article
2017Efficient hydrogen production on MoNi4 electrocatalysts with fast water dissociation kinetics
Zhang, Jian; Wang, Tao; Liu, Pan; Liao, Zhongquan; Liu, Shaohua; Zhuang, Xiaodong; Chen, Mingwei; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Enabling energy efficiency and polarity control in germanium nanowire transistors by individually gated nanojunctions
Trommer, Jens; Heinzig, André; Mühle, Uwe; Löffler, Markus; Winzer, Annett; Jordan, Paul M.; Beister, Jürgen; Baldauf, Tim; Geidel, Marion; Adolphi, Barbara; Zschech, Ehrenfried; Mikolajick, Thomas; Weber, Walter Michael
Journal Article
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2017In-Situ Transmission Electron Microscopy Studies on Advanced Materials for Micro- and Nano-Electronics
Liao, Zhongquan
: Zschech, Ehrenfried (Gutachter); Cuniberti, Gianaurelio (Gutachter); Wolf, Ingrid de (Gutachter)
Dissertation
2017Iridium nanoparticles anchored on 3D graphite foam as a bifunctional electrocatalyst for excellent overall water splitting in acidic solution
Zhang, Jian; Wang, Gang; Liao, Zhongquan; Zhang, Panpan; Wang, Faxing; Zhuang, Xiaodong; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2017Low temperature stability of 4O martensite in Ni49.1Mn38.9Sn12 metamagnetic Heusler alloy ribbons
Czaja, Paweł; Przewoźnik, Janusz; Gondek, Łukasz; Hawełek, Łukasz; Żywczak, Antoni; Zschech, Ehrenfried
Journal Article
2017Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried
Poster
2017Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried
Book Article
2017Visualization of the internal structure of Didymosphenia geminata frustules using nano X-ray tomography
Zglobicka, Izabela; Li, Qiong; Gluch, Jürgen; Płocińska, Magdalena; Noga, Teresa; Dobosz, Romuald; Szoszkiewicz, Robert; Witkowski, Andrzej; Zschech, Ehrenfried; Kurzydłowski, Krzysztof J.
Journal Article
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Conference Paper
2016A dedicated illumination for full-field X-ray microscopy with multilayer Laue lenses
Niese, Sven; Braun, Stefan; Dietsch, Reiner; Gluch, Jürgen; Holz, Thomas; Huber, Norman; Kubec, Adam; Zschech, Ehrenfried
Conference Paper
2016Energy-Filtered Backscattered Imaging Using Low-Voltage Scanning Electron Microscopy: Characterizing Blends of ZnPc-C60 for Organic Solar Cells
Cid, Aranzazu Garitagoitia; Sedighi, Mona; Löffler, Markus; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2016FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
Zschech, Ehrenfried; Gluch, Jürgen; Rosenkranz, Rüdiger; Standke, Yvonne; Niese, Sven
Abstract
2016Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"
Ho, Paul S.; Zschech, Ehrenfried
Abstract
2016Ga contamination in silicon by focused ion beam milling: Dynamic model simulation and atom probe tomography experiment
Huang, J.; Löffler, M.; Möller, W.; Zschech, Ehrenfried
Journal Article, Conference Paper
2016Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy
Kopycinska-Müller, Malgorzata; Clausner, André; Yeap, Kong Boon Oon; Köhler, Bernd; Kuzeyeva, Nataliya; Mahajan, Sukesh; Savage, Travis; Zschech, Ehrenfried; Wolter, Klaus-Jürgen
Journal Article
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Conference Paper
2016Non-destructive imaging of organosilicate glass (OSG) thin films at low voltage with the EsB detector
Garitagoitia, Maria Aranzazu; Moayedi, Elham; Rosenkranz, Rüdiger; Clausner, André; Pakbaz, Khashayar; Zschech, Ehrenfried
Journal Article
2016Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy
Conference Paper
2016Optimization of the SEM working conditions: EsB detector at low voltage
Cid, Aranzazu Garitagoitia; Rosenkranz, Rüdiger; Zschech, Ehrenfried
Journal Article
2016Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography
Li, Qiong; Gluch, Jürgen; Krüger, Peter; Gall, Martin; Neinhuis, Christoph; Zschech, Ehrenfried
Journal Article
2016Structural characterisation of carbon fibres along the fabrication process using SEM/FIB and TEM
Mühle, Uwe; Standke, Yvonne; Zschech, Ehrenfried; Meinl, Juliane; Michaelis, Alexander; Kirsten, Martin; Cherif, Chokri
Conference Paper
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Conference Paper
2015Cross-sectional technologies
Voigtsberger, Bärbel; Rossner, Wolfgang; Lenk, Reinhard; Kinski, Isabel; Scheffler, Michael; Kollenberg, Wolfgang; Guillon, Olivier; Danzer, Robert; Wampers, Holger; Zschech, Ehrenfried
Journal Article
2015Fortschritte in der Metallographie
: Schneider, Gerhard (Hrsg.); Zschech, Ehrenfried (Hrsg.); Petzow, Günter (Hrsg.)
Conference Proceedings
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Lab-based in-situ X-ray microscopy - methodical developments and applications in materials science and microelectronics
Niese, Sven
: Schmeißer, Dieter (Gutachter); Zschech, Ehrenfried (Gutachter); Schneider, Gerd (Gutachter)
Dissertation
2015Lateral damage in graphene carved by high energy focused gallium ion beams
Liao, Zhongquan; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Rosenkranz, Rüdiger; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2015Preparation and characterization of silicon nanowires using SEM/FIB and TEM
Banerjee, Sayanti; Mühle, Uwe; Löffler, Markus; Heinzig, André; Trommer, Jens; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Spezielle Anwendungen der Transmissionselektronenmikroskopie in der Siliziumhalbleiterindustrie
Mühle, Uwe
: Rafaja, David (Betreuer); Lichte, Hannes (Gutachter); Zschech, Ehrenfried (Gutachter)
Habilitation
2015TEM study of schottky junctions in reconfigurable silicon nanowire devices
Banerjee, Sayanti; Löffler, Markus; Mühle, Uwe; Berent, Katarzyna; Heinzig, A.; Trommer, J.; Weber, Walter; Zschech, Ehrenfried
Journal Article
2015Verfahren zur Erstellung von Elementverteilungsbildern mit einem Transmissionselektronenmikroskop
Mühle, Uwe; Gluch, Jürgen; Zschech, Ehrenfried
Patent
20143D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried
Presentation
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced concepts for TDDB reliability in conjunction with 3D stress
Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Fabrication of customizable wedged multilayer Laue lenses by adding a stress layer
Niese, Sven; Krüger, Peter; Kubec, Adam; Laas, Roman; Gawlitza, Peter; Melzer, Kathleen; Braun, Stefan; Zschech, Ehrenfried
Journal Article
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Full-field X-ray microscopy with crossed partial multilayer Laue lenses
Niese, Sven; Krüger, Peter; Kubec, Adam; Braun, Stefan; Patommel, Jens; Schroer, Christian G.; Leson, Andreas; Zschech, Ehrenfried
Journal Article
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Journal Article
2014In-situ investigations of individual nanowires within a FIB/SEM system
Löffler, Markus; Banerjee, Sayanti; Trommer, Jens; Heinzig, André; Weber, Walter; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Managing stress-induced effects on performance and reliability of 3D IC stacks
Zschech, Ehrenfried
Abstract
2014Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies - effect of stress on 3D IC interconnect reliability
Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2014Multi-scale X-ray tomography for process and quality control in 3D TSV packaging
Zschech, Ehrenfried; Niese, Sven; Löffler, Markus; Wolf, M. Jürgen
Conference Paper
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2009Fracture toughness assessment of patterned Cu-interconnect stacks by dual-cantilever-beam (DCB) technique
Chumakov, Dmytro; Lindert, Frank; Lehr, Matthias U.; Grillberger, Michael; Zschech, Ehrenfried
Journal Article
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Journal Article
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Journal Article
2009Novel in-line inspection method for non-visual defects and charging
Höppner, K.; Manuwald, R.; Fahr, T.; Zschech, Ehrenfried; Tamayo, N.; Hickson, J.; Adrian, B.; Newcomb, R.
Conference Paper
2009The stability of C60 and its derivatives upon handling in microsystems technologies
Klocek, Jolanta; Friedrich, Daniel; Schmeißer, Dieter; Hecker, Michael; Zschech, Ehrenfried
Conference Paper
2008Application of high-resolution X-ray microscopy to image backend-of-line structures
Zschech, Ehrenfried; Braun, S.; Yun, W.
Conference Paper
2008Novel carbon-cage-based ultralow-k materials: Modeling and first experiments
Zagorodniy, K.; Chumakov, D.; Täschner, C.; Lukowiak, A.; Stegmann, H.; Schmeißer, D.; Geisler, H.; Engelmann, H.-J.; Hermann, H.; Zschech, Ehrenfried
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2007Assessing the effect of die sealing in Cu/Low-k structures
Kearney, A.V.; Vairagar, A.V.; Geisler, H.; Zschech, Ehrenfried; Dauskardt, R.H.
Conference Paper
2007Calibration of atomic force microscope for nanoscale friction measurements
Masalska, A.; Kolanek, K.; Woszczyna, M.; Zawierucha, P.; Ritz, Y.; Zschech, Ehrenfried
Conference Paper
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper
2000Microstructure characterization of metal interconnects and barrier layers: Status and future
Zschech, Ehrenfried; Besser, P.R.
Conference Paper