Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Band-like charge transport in phytic acid-doped polyaniline thin films
Ballabio, Marco; Zhang, Tao; Chen, Chen; Zhang, Peng; Liao, Zhongquan; Hambsch, Mike; Mannsfeld, Stefan C.B.; Zschech, Ehrenfried; Sirringhaus, Henning; Feng, Xinliang; Bonn, Mischa; Dong, Renhao; Canovas, Enrique
Journal Article
2021Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography
Silomo, Jendrik; Gluch, Jürgen; Clausner, André; Paul, Jens; Zschech, Ehrenfried
Journal Article
2021Determination of the filler distribution in an epoxy molding compound using high-resolution X-ray computed tomography
Topal, Emre; Gluch, Jürgen; Clausner, André; Cardoso, Andre; Zschech, Ehrenfried
Journal Article
2021IC package related stress effects on the characteristics of ring oscillator circuits
Schlipf, Simon; Sander, Christoph; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Conference Paper
2021Interfacial covalent bonds regulated electron-deficient 2D black phosphorus for electrocatalytic oxygen reactions
Wang, Xin; Raghupathy, Ramya Kormath Madam; Querebillo, Christine Joy; Liao, Zhongquan; Li, Dongqi; Lin, Khui; Hantusch, Martin; Sofer, Zdenek; Li, Baohua; Zschech, Ehrenfried; Weidinger, Inez; Kühne, Thomas; Mirhosseini, Hossein; Yu, Minghoa; Feng, Xinliang
Journal Article
2021Microstructure and fracture mechanism investigation of porous silicon nitride-zirconia-graphene composite using multi-scale and in-situ microscopy
Liao, Zhongquan; Standke, Yvonne; Gluch, Jürgen; Balazsi, Katalin; Pathak, Onkar; Höhn, Sören; Herrmann, Mathias; Werner, Stephan; Dusza, Jan; Balazsi, Csaba; Zschech, Ehrenfried
Journal Article
2021Morphology and mechanical properties of fossil diatom frustules from genera of Ellerbeckia and Melosira
Li, Qiong; Gluch, Jürgen; Liao, Zhongquan; Posseckardt, Juliane; Clausner, André; Lepicka, Magdalena; Grądzka-Dahlke, Małgorzata; Zschech, Ehrenfried
Journal Article
2021Piezoresistive characteristics of MOSFET channels determined with indentation
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Journal Article
2021Solvent-mediated engineering of copper-metalated acetylenic polymer scaffolds with enhanced photoelectrochemical performance
Zhang, Tao; Xu, Shunqi; Hou, Yang; Chai, Guoliang; Olianas, Davide; Liao, Zhongquan; Milani, Alberto; Sun, Hanjun; Li, Wei; Zhang, Zhu; Mannsfeld, Stefan C.B.; Zschech, Ehrenfried; Tommasini, Matteo; Feng, Xinliang
Journal Article
2021Strategy to characterize electromigration short length effects in Cu/low-k interconnects
Zhang, James; Kraatz, Matthias; Hauschildt, Meike; Choi, Samuel; Clausner, André; Zschech, Ehrenfried; Gall, Martin
Conference Paper
2021Stress-induced transistor degradation studied by an indentation approach
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Journal Article
2020Anisotropy of Mechanical Properties of Pinctada margaritifera Mollusk Shell
Strag, Martyna; Maj, Åukasz; Bieda, Magdalena; Petrzak, PaweÅ; Jarzebska, Anna; Gluch, Jürgen; Topal, Emre; Kutukova, Kristina; Clausner, André; Heyn, Wieland; Berent, Katarzyna; Nalepka, Kinga; Zschech, Ehrenfried; Checa, Antonio G.; Sztwiertnia, Srzysztof
Journal Article
2020Confined growth of porous nitrogen-doped cobalt oxide nanoarrays as bifunctional oxygen electrocatalysts for rechargeable zinc-air batteries
Wang, Xia; Liao, Zhongquan; Fu, Yubin; Neumann, Christof; Turchanin, Andrey A.; Nam, Gyutae; Zschech, Ehrenfried; Cho, Jaephil; Zhang, Jian; Feng, Xinliang
Journal Article
2020Crack identification in BEoL stacks using acoustic emission testing and nano x-ray computed tomography
Silomon, Jendrik; Gluch, Jürgen; Clausner, André; Paul, Jens; Zschech, Ehrenfried
Conference Paper
2020Deep learning-based inaccuracy compensation in reconstruction of high resolution XCT data
Topal, Emre; Löffler, Markus; Zschech, Ehrenfried
Journal Article
2020Graphene added multilayer ceramic sandwich (GMCS) composites: Structure, preparation and properties
Balazsi, Katalin; Furko, Monika; Liao, Zhongquan; Fogarassy, Zsolt; Medved, David; Zschech, Ehrenfried; Dusza, Jan; Balazsi, Csaba
Journal Article
2020Investigations of internal stresses in high-voltage devices with deep trenches
Hieckmann, Ellen; Mühle, Uwe; Chekhonin, Paul; Zschech, Ehrenfried; Gambino, Jeff
Journal Article
2020Multi-scale X-ray tomography and machine learning algorithms to study MoNi4 electrocatalysts anchored on MoO2 cuboids aligned on Ni foam
Topal, Emre; Liao, Zhongquan; Löffler, Markus; Gluch, Jürgen; Zhang, Jian; Feng, Xinliang; Zschech, Ehrenfried
Journal Article
2020Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Conference Paper
2020Numerical and experimental study of the mechanical response of diatom frustules
Topal, Emre; Rajendran, Hariskaran; Zglobicka, Izabela; Gluch, Jürgen; Liao, Zhongquan; Clausner, André; Kurzydłowski, Krzysztof Jan; Zschech, Ehrenfried
Journal Article
2020Phthalocyanine-based 2D conjugated metal-organic framework nanosheets for high-performance micro-supercapacitors
Wang, Mingchao; Shi, Huanhuan; Zhang, Panpan; Liao, Zhongquan; Wang, Mao; Zhong, Haixia; Schwotzer, Friedrich; Shaygan Nia, Ali; Zschech, Ehrenfried; Zhou, Shengqian; Kaskel, Stefan; Dong, Renhao; Feng, Xinliang
Journal Article
2020Porous sandwich ceramic of layered silicon nitride-zirconia composite with various multilayered graphene content
Balazsi, Katalin; Furko, Monika; Liao, Zhongquan; Gluch, Jürgen; Medved, David; Sedlák, Richard; Dusza, Jan; Zschech, Ehrenfried; Balazsi, Csaba
Journal Article
2020Promoted oxygen reduction kinetics on nitrogen-doped hierarchically porous carbon by engineering proton-feeding centers
Chen, Guangbo; Wang, Tao; Liu, Pan; Liao, Zhongquan; Zhong, Haixia; Wang, Gang; Zhang, Panpan; Yu, Minghao; Zschech, Ehrenfried; Chen, Mingwei; Zhang, Jian; Feng, Xinliang
Journal Article
2020Study of structure and properties of Fe-based amorphous ribbons after pulsed laser interference heating
Czyz, Olaf; Kusinski, Jan; Radziszewska, Agnieszka; Liao, Zhongquan; Zschech, Ehrenfried; Kac, Malgorzata; Ostrowski, Roman
Journal Article
2020Synergistic electroreduction of carbon dioxide to carbon monoxide on bimetallic layered conjugated metal-organic frameworks
Zhong, Haixia; Ghorbani-Asl, Mahdi; Ly, Khoa Hoang; Zhang, Jichao; Ge, Jin; Wang, Mingchao; Liao, Zhongquan; Makarov, Denys; Zschech, Ehrenfried; Brunner, Eike; Weidinger, Inez M.; Zhang, Jian; Krasheninnikov, Arkady V.; Kaskel, Stefan; Dong, Renhao; Feng, Xinliang
Journal Article
2020Two-Dimensional boronate ester covalent organic framework thin films with large single crystalline domains for neuromorphic memory device
Park, Sang Wook; Liao, Zhongquan; Ibarlucea, Bergoi; Qi, Haoyuan; Lin, Hung-Hsuan; Becker, Daniel; Melidonie, Jason; Zhang, Tao; Sahabudeen, Hafeesudeen; Baraban, Larysa; Baek, Chang-Ki; Zheng, Zhikun; Zschech, Ehrenfried; Fery, Andreas; Heine, Thomas; Kaiser, Ute; Cuniberti, Gianaurelio; Dong, Renhao; Feng, Xinliang
Journal Article
2020Utilizing acoustic emission signals to evaluate BEoL stack damages of two different sample systems caused by Cu-pillar shear-off
Silomon, Jendrik; Clausner, André; Zschech, Ehrenfried
Conference Paper
2020Zinc-Mediated template synthesis of Fe-N-C electrocatalysts with densely accessible Fe-Nx active sites for efficient oxygen reduction
Chen, Guangbo; Liu, Pan; Liao, Zhongquan; Sun, Fanfei; He, Yanghua; Zhong, Haixia; Zhang, Tao; Zschech, Ehrenfried; Chen, Mingwei; Wu, Gang; Zhang, Jian; Feng, Xinliang
Journal Article
20193D Diatom-Designed and selective laser melting (SLM) manufactured metallic structures
Zglobicka, Izabela; Chmielewska, Agnieszka; Topal, Emre; Kutukova, Kristina; Gluch, Jürgen; Krüger, Peter; Kilroy, Cathy; Święszkowski, Wojciech; Kurzydłowski, Krzysztof Jan; Zschech, Ehrenfried
Journal Article
2019Cleaving silicene-terminated calcium disilicide in the transmission electron microscope
Liao, Zhongquan; Standke, Yvonne; Gluch, Jürgen; Brazda, Petr; Kopecek, Jaromir; Klementova, Mariana; Palatinus, Lukas; Zschech, Ehrenfried
Journal Article
2019Editorial for the Special Issue "Characterization of Nanomaterials: Selected Papers from 6th Dresden Nanoanalysis Symposium"
Zschech, Ehrenfried; Sinclair, Robert; Martins, Rodrigo; Sebastiani, Marco; Sartori, Sabrina
Editorial
2019Engineering crystalline quasi-two-dimensional polyaniline thin film with enhanced electrical and chemiresistive sensing performances
Zhang, Tao; Qi, Haoyuan; Liao, Zhongquan; Horev, Yehu David; Panes-Ruiz, Luis Antonio; Petkov, Petko S.; Zhang, Zhe; Shivhare, Rishi Ramdas; Zhang, Panpan; Liu, Kejun; Bezugly, Viktor; Liu, Shaohua; Zheng, Zhikun; Mannsfeld, Stefan C.B.; Heine, Thomas; Cuniberti, Gianaurelio; Haick, Hossam; Zschech, Ehrenfried; Kaiser, Ute; Dong, Renhao; Feng, Xinliang
Journal Article
2019Fully printed zinc oxide electrolyte-gated transistors on paper
Carvalho, José Tiago; Dubceac, Viorel; Grey, Paul; Cunha, Ines; Fortunato, Elvira; Martins, Rodrigo; Clausner, André; Zschech, Ehrenfried; Pereira, Luis
Journal Article
2019Impact of mechanical strain on 22 nm FDSOI device performance using nanoindentation
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Kurz, G.; Zschech, Ehrenfried
Conference Paper
2019Molecular engineering of conjugated acetylenic polymers for efficient cocatalyst-free photoelectrochemical water reduction
Sun, Hanjun; Öner, Ibrahim Halil; Wang, Tao; Zhang, Tao; Selyshchev, Oleksandr; Neumann, Christof; Fu, Yubin; Liao, Zhongquan; Xu, Shunqi; Hou, Yang; Turchanin, Andrey; Zahn, Dietrich R.T.; Zschech, Ehrenfried; Weidinger, Inez M.; Zhang, Jian; Feng, Xinliang
Journal Article
2019Polymer brushes on hexagonal boron nitride
Sheng, Wenbo; Amin, Ihsan; Neumann, Christof; Dong, Renhao; Zhang, Tao; Wegener, Erik; Chen, Wei-Liang; Förster, Paul; Tran, Hai Quang; Löffler, Markus; Winter, Andreas; Rodriguez, Raul D.; Zschech, Ehrenfried; Ober, Christopher K.; Feng, Xinliang; Turchanin, Andrey; Jordan, Rainer
Journal Article
2019A semiconducting layered metal-organic framework magnet
Yang, Chongqing; Dong, Renhao; Wang, Mao; Petkov, Petko S.; Zhang, Zhitao; Wang, Mingchao; Han, Peng; Ballabio, Marco; Bräuninger, Sascha A.; Liao, Zhongquan; Zhang, Jichao; Schwotzer, Friedrich; Zschech, Ehrenfried; Klauss, Hans-Henning; Canovas, Enrique; Kaskel, Stefan; Bonn, Mischa; Zhou, Shengqiang; Heine, Thomas; Feng, Xinliang
Journal Article
2019X-ray characterization of morphology and structure of materials at multiple length scales
Zschech, Ehrenfried
Journal Article
2018Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Characterization of spatial distribution of electrolyte in molten carbonate fuel cell cathodes
Wejrzanowski, Tomasz; Gluch, Jürgen; Ibrahim, Samih Haj; Cwieka, Karol; Milewski, Jaroslaw; Zschech, Ehrenfried
Journal Article
2018Cobalt-based metal-organic framework nanoarrays as bifunctional oxygen electrocatalysts for rechargeable Zn-air batteries
Chen, Guangbo; Zhang, Jian; Wang, Faxing; Wang, Lanlan; Liao, Zhongquan; Zschech, Ehrenfried; Müllen, Klaus; Feng, Xinliang
Journal Article
2018Combination of soft X-ray microscopy with in-situ mechanical testing to image crack propagation in microchips
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes
Zhang, Tao; Hou, Yang; Dzhagan, Volodymyr M.; Liao, Zhongquan; Chai, Guoliang; Löffler, Markus; Olianas, Davide; Milani, Alberto; Xu, Shunqi; Tommasini, Matteo; Zahn, Dietrich R.T.; Zheng, Zhikun; Zschech, Ehrenfried; Jordan, Rainer Andreas; Feng, Xinliang
Journal Article
2018A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior
Dong, Renhao; Zhang, Zhitao; Tranca, Diana C.; Zhou, Shengqiang; Wang, Mingchao; Adler, Peter; Liao, Zhongquan; Liu, Feng; Sun, Yan; Shi, Wujun; Zhang, Zhe; Zschech, Ehrenfried; Mannsfeld, Stefan C.B.; Felser, Claudia; Feng, Xinliang
Journal Article
2018Correction of stress release during sample preparation for TEM CBED measurements
Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried; Mühle, Uwe; Narendraraj, Chandran; Hrabovský, Miloš; Morávek, Tomáš
Conference Paper
2018A delamination strategy for thinly layered defect-free high-mobility black phosphorus flakes
Yang, Sheng; Zhang, Ke; Ricciardulli, Antonio Gaetano; Zhang, Panpan; Liao, Zhongquan; Lohe, Martin R.; Zschech, Ehrenfried; Blom, Paul W.M.; Pisula, Wojciech; Müllen, Klaus; Feng, Xinliang
Journal Article
2018In-situ X-ray microscopy of crack-propagation to study fracture mechanics of on-chip interconnect structures
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Laboratory computed x-ray tomography - a nondestructive technique for 3D microstructure analyis of materials
Zschech, Ehrenfried; Löffler, Markus; Krüger, Peter; Gluch, Jürgen; Kutukova, Kristina; Zglobicka, Izabela; Silomon, Jendrik; Rosenkranz, Rüdiger; Standke, Yvonne; Topal, E.
Journal Article
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Multi-modal porous microstructure for high temperature fuel cell application
Wejrzanowski, T.; Haj Ibrahim, S.; Cwieka, K.; Löffler, Markus; Milewski, J.V.; Zschech, Ehrenfried; Lee, C.-G.
Journal Article
2018A novel micro-double cantilever beam (micro-DCB) test in an X-ray microscope to study crack propagation in materials and structures
Kutukova, Kristina; Niese, Sven; Gelb, Jeff; Dauskardt, Reinhold; Zschech, Ehrenfried
Journal Article
2018Polymerization driven monomer passage through monolayer chemical vapour deposition graphene
Zhang, Tao; Liao, Zhongquan; Medrano Sandonas, Leonardo; Dianat, Arezoo; Liu, Xiaoling; Xiao, Peng; Amin, Ihsan; Gutierrez, Rafael; Chen, Tao; Zschech, Ehrenfried; Cuniberti, Gianaurelio; Jordan, Rainer
Journal Article
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers
Garitagoitia, Maria Aranzazu; Rosenkranz, Rüdiger; Löffler, M.; Clausner, André; Standke, Yvonne; Zschech, Ehrenfried
Journal Article
2018Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation
Huang, J.; Löffler, Markus; Mühle, Uwe; Möller, Wolfhard; Mulders, Johannes J.L.; Kwakman, Laurens; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2018Untersuchungen zur Charakteristik und Applikationen des EsB Detektors
Garitagoitia Cid, María Aránzazu
: Rosenkranz, Rüdiger (Betreuer); Zschech, Ehrenfried (Betreuender Hochschullehrer); Bartha, Johann W. (Vorsitzender)
Dissertation
2018Vorrichtung zur Durchführung von Biegeversuchen an plattenförmigen Proben
Clausner, André; Gall, Martin; Macher, Frank; Sander, Christoph; Zschech, Ehrenfried
Patent
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Journal Article
2017Area-selective atomic layer deposition of Ru on electron-beam-written Pt(C) patterns versus SiO2 substratum
Junige, Marcel; Löffler, Markus; Geidel, Marion; Albert, Matthias; Bartha, Johann W.; Zschech, Ehrenfried; Rellinghaus, Bernd; Dorp, Willem F. van
Journal Article
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Journal Article
2017Doping of graphene induced by boron/silicon substrate
Dianat, Arezoo; Liao, Zhongquan; Gall, Martin; Zhang, Tao; Gutierrez, Rafael; Zschech, Ehrenfried; Cuniberti, Gianaurelio
Journal Article
2017Editorial
Zschech, Ehrenfried
Editorial
2017Efficient hydrogen production on MoNi4 electrocatalysts with fast water dissociation kinetics
Zhang, Jian; Wang, Tao; Liu, Pan; Liao, Zhongquan; Liu, Shaohua; Zhuang, Xiaodong; Chen, Mingwei; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Enabling energy efficiency and polarity control in germanium nanowire transistors by individually gated nanojunctions
Trommer, Jens; Heinzig, André; Mühle, Uwe; Löffler, Markus; Winzer, Annett; Jordan, Paul M.; Beister, Jürgen; Baldauf, Tim; Geidel, Marion; Adolphi, Barbara; Zschech, Ehrenfried; Mikolajick, Thomas; Weber, Walter Michael
Journal Article
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2017In-Situ Transmission Electron Microscopy Studies on Advanced Materials for Micro- and Nano-Electronics
Liao, Zhongquan
: Zschech, Ehrenfried (Gutachter); Cuniberti, Gianaurelio (Gutachter); Wolf, Ingrid de (Gutachter)
Dissertation
2017Iridium nanoparticles anchored on 3D graphite foam as a bifunctional electrocatalyst for excellent overall water splitting in acidic solution
Zhang, Jian; Wang, Gang; Liao, Zhongquan; Zhang, Panpan; Wang, Faxing; Zhuang, Xiaodong; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2017Low temperature stability of 4O martensite in Ni49.1Mn38.9Sn12 metamagnetic Heusler alloy ribbons
Czaja, Paweł; Przewoźnik, Janusz; Gondek, Łukasz; Hawełek, Łukasz; Żywczak, Antoni; Zschech, Ehrenfried
Journal Article
2017Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried
Poster
2017Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried
Book Article
2017Visualization of the internal structure of Didymosphenia geminata frustules using nano X-ray tomography
Zglobicka, Izabela; Li, Qiong; Gluch, Jürgen; Płocińska, Magdalena; Noga, Teresa; Dobosz, Romuald; Szoszkiewicz, Robert; Witkowski, Andrzej; Zschech, Ehrenfried; Kurzydłowski, Krzysztof J.
Journal Article
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Conference Paper
2016A dedicated illumination for full-field X-ray microscopy with multilayer Laue lenses
Niese, Sven; Braun, Stefan; Dietsch, Reiner; Gluch, Jürgen; Holz, Thomas; Huber, Norman; Kubec, Adam; Zschech, Ehrenfried
Conference Paper
2016Energy-Filtered Backscattered Imaging Using Low-Voltage Scanning Electron Microscopy: Characterizing Blends of ZnPc-C60 for Organic Solar Cells
Cid, Aranzazu Garitagoitia; Sedighi, Mona; Löffler, Markus; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2016FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
Zschech, Ehrenfried; Gluch, Jürgen; Rosenkranz, Rüdiger; Standke, Yvonne; Niese, Sven
Journal Article
2016Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"
Ho, Paul S.; Zschech, Ehrenfried
Journal Article
2016Ga contamination in silicon by focused ion beam milling: Dynamic model simulation and atom probe tomography experiment
Huang, J.; Löffler, M.; Möller, W.; Zschech, Ehrenfried
Journal Article
2016Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy
Kopycinska-Müller, Malgorzata; Clausner, André; Yeap, Kong Boon Oon; Köhler, Bernd; Kuzeyeva, Nataliya; Mahajan, Sukesh; Savage, Travis; Zschech, Ehrenfried; Wolter, Klaus-Jürgen
Journal Article
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Conference Paper
2016Non-destructive imaging of organosilicate glass (OSG) thin films at low voltage with the EsB detector
Garitagoitia, Maria Aranzazu; Moayedi, Elham; Rosenkranz, Rüdiger; Clausner, André; Pakbaz, Khashayar; Zschech, Ehrenfried
Journal Article
2016Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy
Conference Paper
2016Optimization of the SEM working conditions: EsB detector at low voltage
Cid, Aranzazu Garitagoitia; Rosenkranz, Rüdiger; Zschech, Ehrenfried
Journal Article
2016Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography
Li, Qiong; Gluch, Jürgen; Krüger, Peter; Gall, Martin; Neinhuis, Christoph; Zschech, Ehrenfried
Journal Article
2016Structural characterisation of carbon fibres along the fabrication process using SEM/FIB and TEM
Mühle, Uwe; Standke, Yvonne; Zschech, Ehrenfried; Meinl, Juliane; Michaelis, Alexander; Kirsten, Martin; Cherif, Chokri
Conference Paper
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Conference Paper
2015Cross-sectional technologies
Voigtsberger, Bärbel; Rossner, Wolfgang; Lenk, Reinhard; Kinski, Isabel; Scheffler, Michael; Kollenberg, Wolfgang; Guillon, Olivier; Danzer, Robert; Wampers, Holger; Zschech, Ehrenfried
Journal Article
2015Fortschritte in der Metallographie
: Schneider, Gerhard (Hrsg.); Zschech, Ehrenfried (Hrsg.); Petzow, Günter (Hrsg.)
Conference Proceedings
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article
2015Lab-based in-situ X-ray microscopy - methodical developments and applications in materials science and microelectronics
Niese, Sven
: Schmeißer, Dieter (Gutachter); Zschech, Ehrenfried (Gutachter); Schneider, Gerd (Gutachter)
Dissertation
2015Lateral damage in graphene carved by high energy focused gallium ion beams
Liao, Zhongquan; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Rosenkranz, Rüdiger; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2015Preparation and characterization of silicon nanowires using SEM/FIB and TEM
Banerjee, Sayanti; Mühle, Uwe; Löffler, Markus; Heinzig, André; Trommer, Jens; Zschech, Ehrenfried
Journal Article
2015Spezielle Anwendungen der Transmissionselektronenmikroskopie in der Siliziumhalbleiterindustrie
Mühle, Uwe
: Rafaja, David (Betreuer); Lichte, Hannes (Gutachter); Zschech, Ehrenfried (Gutachter)
Habilitation
2015TEM study of schottky junctions in reconfigurable silicon nanowire devices
Banerjee, Sayanti; Löffler, Markus; Mühle, Uwe; Berent, Katarzyna; Heinzig, A.; Trommer, J.; Weber, Walter; Zschech, Ehrenfried
Journal Article
2015Verfahren zur Erstellung von Elementverteilungsbildern mit einem Transmissionselektronenmikroskop
Mühle, Uwe; Gluch, Jürgen; Zschech, Ehrenfried
Patent
20143D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried
Presentation
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced concepts for TDDB reliability in conjunction with 3D stress
Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Fabrication of customizable wedged multilayer Laue lenses by adding a stress layer
Niese, Sven; Krüger, Peter; Kubec, Adam; Laas, Roman; Gawlitza, Peter; Melzer, Kathleen; Braun, Stefan; Zschech, Ehrenfried
Journal Article
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Full-field X-ray microscopy with crossed partial multilayer Laue lenses
Niese, Sven; Krüger, Peter; Kubec, Adam; Braun, Stefan; Patommel, Jens; Schroer, Christian G.; Leson, Andreas; Zschech, Ehrenfried
Journal Article
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Journal Article
2014In-situ investigations of individual nanowires within a FIB/SEM system
Löffler, Markus; Banerjee, Sayanti; Trommer, Jens; Heinzig, André; Weber, Walter; Zschech, Ehrenfried
Journal Article
2014Managing stress-induced effects on performance and reliability of 3D IC stacks
Zschech, Ehrenfried
Conference Paper
2014Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies - effect of stress on 3D IC interconnect reliability
Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2014Multi-scale X-ray tomography for process and quality control in 3D TSV packaging
Zschech, Ehrenfried; Niese, Sven; Löffler, Markus; Wolf, M. Jürgen
Conference Paper
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2009Fracture toughness assessment of patterned Cu-interconnect stacks by dual-cantilever-beam (DCB) technique
Chumakov, Dmytro; Lindert, Frank; Lehr, Matthias U.; Grillberger, Michael; Zschech, Ehrenfried
Journal Article
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Journal Article
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Journal Article
2009Novel in-line inspection method for non-visual defects and charging
Höppner, K.; Manuwald, R.; Fahr, T.; Zschech, Ehrenfried; Tamayo, N.; Hickson, J.; Adrian, B.; Newcomb, R.
Conference Paper
2009The stability of C60 and its derivatives upon handling in microsystems technologies
Klocek, Jolanta; Friedrich, Daniel; Schmeißer, Dieter; Hecker, Michael; Zschech, Ehrenfried
Conference Paper
2008Application of high-resolution X-ray microscopy to image backend-of-line structures
Zschech, Ehrenfried; Braun, S.; Yun, W.
Conference Paper
2008Novel carbon-cage-based ultralow-k materials: Modeling and first experiments
Zagorodniy, K.; Chumakov, D.; Täschner, C.; Lukowiak, A.; Stegmann, H.; Schmeißer, D.; Geisler, H.; Engelmann, H.-J.; Hermann, H.; Zschech, Ehrenfried
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2007Assessing the effect of die sealing in Cu/Low-k structures
Kearney, A.V.; Vairagar, A.V.; Geisler, H.; Zschech, Ehrenfried; Dauskardt, R.H.
Conference Paper
2007Calibration of atomic force microscope for nanoscale friction measurements
Masalska, A.; Kolanek, K.; Woszczyna, M.; Zawierucha, P.; Ritz, Y.; Zschech, Ehrenfried
Conference Paper
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper
2000Microstructure characterization of metal interconnects and barrier layers: Status and future
Zschech, Ehrenfried; Besser, P.R.
Conference Paper