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| 2013 | Influence of the fullerene derivatives and cage polyhedral oligomeric silsesqiuoxanes on 3-aminopropyltrimethoxysilane based hybrid nanocomposites chemical, morphological and electrical properties
Klocek, J.; Kolanek, K.; Henkel, K.; Zschech, E.; Schmeisser, D. | Journal Article |
| 2012 | 3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy
Kong, L.; Rudack, A.C.; Krueger, P.; Zschech, E.; Arkalgud, S.; Diebold, A.C. | Journal Article, Conference Paper |
| 2012 | Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias
Karmarkar, A.P.; Xu, X.; Yeap, K.-B.; Zschech, E. | Journal Article |
| 2012 | Correction to "Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias" (vol 12, pg 225, 2012)
Karmarkar, A.P.; Xu, X.P.; Yeap, K.B.; Zschech, E. | Journal Article |
| 2012 | A critical review on multiscale material database requirement for accurate three-dimensional IC simulation input
Yeap, K.-B.; Roellig, M.; Huebner, R.; Gall, M.; Sukharev, V.; Zschech, E. | Journal Article |
| 2012 | Elastic anisotropy of Cu and its impact on stress management for 3D IC
Yeap, K.B.; Zschech, E.; Hangen, U.D.; Wyrobek, T.; Kong, L.W.; Karmakar, A.; Xu, X.P.; Panchenko, I. | Journal Article |
| 2012 | Forward to the special section on "Materials, Processing, and Reliability of 3-D Interconnects". Editorial
Ho, P.S.; Smith, L.; Tong, H.M.; Zschech, E. | Journal Article |
| 2012 | Multi-scale simulation methodology for stress assessment in 3D IC
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R. | Journal Article |
| 2012 | Nanometer deformation of elastically anisotropic materials studied by nanoindentation
Yeap, K.B.; Kopycinska-Müller, M.; Hangen, U.D.; Zambaldi, C.; Hübner, R.; Niese, S.; Zschech, E. | Journal Article |
| 2012 | Physics-based models for EM and SM simulation in three-dimensional IC structures
Sukharev, V.; Kteyan, A.; Zschech, E. | Journal Article |
| 2012 | Spectroscopic and capacitance-voltage characterization of thin aminopropylmethoxysilane films doped with copper phthalocyanine, tris(dimethylvinylsilyloxy)-POSS and fullerene cages
Klocek, J.; Henkel, K.; Kolanek, K.; Zschech, E.; Schmeißer, D. | Journal Article |
| 2012 | Studies of the chemical and electrical properties of fullerene and 3-aminopropyltrimethoxysilane based low-k materials
Klocek, J.; Henkel, K.; Kolanek, K.; Broczkowska, K.; Schmeisser, D.; Miller, M.; Zschech, E. | Journal Article |
| 2011 | Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
Kong, L.W.; Lloyd, J.R.; Yeap, K.B.; Zschech, E.; Rudack, A.; Liehr, M.; Diebold, A. | Journal Article |
| 2011 | Atomic-scale engineering of future high-k dynamic random access memory dielectrics
Dudek, P.; Lupina, G.; Kozowski, G.; Zaumseil, P.; Bauer, J.; Fursenko, O.; Dabrowski, J.; Schmidt, R.; Lippert, G.; Müssig, H.-J.; Schroeder, T.; Schmeißer, D.; Zschech, E. | Journal Article, Conference Paper |
| 2011 | Characterization of small Cu grains using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E.; Zschech, E. | Journal Article, Conference Paper |
| 2011 | Devices, materials, and processes for nanoelectronics: Characterization with advanced X-ray techniques using lab-based and synchrotron radiation sources
Zschech, E.; Wyon, C.; Murray, C.E.; Schneider, G. | Journal Article |
| 2011 | Efficient target preparation by combined pulsed laser ablation and FIB milling
Stegmann, H.; Dömer, H.; Rosenkranz, R.; Zschech, E. | Journal Article, Conference Paper |
| 2011 | Efficient target preparation by combining laser ablation and FIB milling in a single tool
Stegmann, H.; Dömer, H.; Cai, H.; Rosenkranz, R.; Zschech, E. | Conference Paper |
| 2011 | Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
Zhang, L.J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E. | Journal Article |
| 2011 | A high-resolution measurement system for novel scanning thermal microscopy resistive nanoprobes
Wielgoszewski, G.; Sulecki, P.; Janus, P.; Grabiec, P.; Zschech, E.; Gotszalk, T. | Journal Article |
| 2011 | Improved scanning geometry to collect 3D-geometry data in flat samples
Krüger, P.; Niese, S.; Zschech, E.; Gelb, J.; Feser, M. | Conference Paper |
| 2011 | Metrology and Failure Analysis for 3D IC Integration
Zschech, E.; Diebold, A. | Conference Paper |
| 2011 | Multi-scale environment for simulation and materials characterization in stress management for 3D IC TSV-based technologies - effect of stress on the device characteristics
Sukharev, V.; Zschech, E. | Conference Paper |
| 2011 | Nanoindentation for quality control of ULK films
Yeap, K.B.; Zeng, K.; Hangen, U.; Zschech, E. | Conference Paper |
| 2011 | Nanoindentation study of elastic anisotropy of Cu single crystals and grains in TSVs
Yeap, K.B.; Hangen, U.D.; Raabe, D.; Zschech, E. | Conference Paper |
| 2011 | Nanomechanical characterization and metrology for low-k and ULK materials
Hangen, U.D.; Yeap, K.-B.; Vodnick, D.; Zschech, E.; Li, H.; Vlassak, J. | Conference Paper |
| 2011 | NanoXCT - A high-resolution technique for TSV characterization
Niese, S.; Krueger, P.; Zschech, E. | Conference Paper |
| 2011 | Scanning thermal microscopy: A nanoprobe technique for studying the thermal properties of nanocomponents
Wielgoszewski, G.; Sulecki, P.; Gotszalk, T.; Janus, P.; Grabiec, P.; Hecker, M.; Ritz, Y.; Zschech, E. | Journal Article |
| 2011 | Stress management for 3D ICs using through silicon vias
: Zschech, E. | Conference Proceedings |
| 2011 | Stress-induced effects caused by 3D IC TSV packaging in advanced semiconductor device performance
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R. | Conference Paper |
| 2010 | Assessment of mechanical properties of nanoscale structures for microprocessor manufacturing
Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.; Wu, Z.; Ho, P.S. | Conference Paper |
| 2010 | Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Im, J.; Zschech, E.; Ho, P.S. | Conference Paper |
| 2010 | Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon-germanium for high-performance complementary metal oxide semiconductor devices
Hübner, R.; Engelmann, H.-J.; Zschech, E. | Journal Article |
| 2010 | Cohesive toughness of low-k film with periodically changing elastic modulus: Cube-corner indentation
Yeap, K.B.; Hangen, U.; Ritz, Y.; Kim, T.-S.; Dauskardt, R.; Zschech, E. | Conference Paper |
| 2010 | Conical dark-field analysis for small grain characterization in narrow Cu interconnect structures: Potential and challenges
Hübner, R.; Engelmann, H.-J.; Zschech, E. | Conference Paper |
| 2010 | Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node
Zhang, L.; Zhou, J.P.; Im, J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E. | Conference Paper |
| 2010 | EM and SM induced degradation dynamics in copper interconnects studied using electron microscopy and X-ray microscopy
Zschech, E.; Hübner, R.; Aubel, O.; Ho, P.S. | Conference Paper |
| 2010 | Fullerene based materials for ultra-low-k application
Broczkowska, K.; Klocek, J.; Friedrich, D.; Henkel, K.; Kolanek, K.; Urbanowicz, A.; Schmeisser, D.; Miller, M.; Zschech, E. | Conference Paper |
| 2010 | Grain size and cap layer effects on electromigration reliability of Cu interconnects: Experiments and simulation
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ho, P.S. | Conference Paper |
| 2010 | Local anodic oxidation by atomic force microscopy for nano-Raman strain measurements on silicon-germanium thin films
Kolanek, K.; Hermann, P.; Dudek, P.T.; Gotszalk, T.; Chumakov, D.; Weisheit, M.; Hecker, M.; Zschech, E. | Journal Article |
| 2010 | Materials for information technology
Zschech, E. | Journal Article |
| 2010 | Microfabricated resistive high-sensitivity nanoprobe for scanning thermal microscopy
Wielgoszewski, G.; Sulecki, P.; Gotszalk, T.; Janus, P.; Szmigiel, D.; Grabiec, P.; Zschech, E. | Journal Article |
| 2010 | Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices
Janus, P.; Szmigiel, D.; Weisheit, M.; Wielgoszewski, G.; Ritz, Y.; Grabiec, P.; Hecker, M.; Gotszalk, T.; Sulecki, P.; Zschech, E. | Conference Paper, Journal Article |
| 2010 | Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M. | Journal Article |
| 2010 | Small grain and twin characterization in sub-100 nm Cu interconnects using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E. | Conference Paper |
| 2010 | Strain distribution analysis in Si/SiGe line structures for CMOS technology using Raman spectroscopy
Hecker, M.; Roelke, M.; Hermann, P.; Zschech, E.; Vartanian, V. | Journal Article |
| 2010 | Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization 2010. Preface
Zschech, E.; Ho, P.; Ogawa, S. | Journal Article |
| 2010 | Sub-imaging techniques for 3D-interconnects on bonded wafer pairs
Kong, L.W.; Krueger, P.; Zschech, E.; Rudack, A.C.; Arkalgud, S.; Diebold, A.C. | Conference Paper |
| 2009 | Investigation of boron delta-layers in silicon measured by atom probe tomography (APT)
Klein, C.; Mutas, S.; Würfel, A.; Zschech, E. | Conference Paper, Journal Article |
| 2009 | Post annealing effect on ultra-thin Hf-based high-k gate oxides on Si
Kim, J.-H.; Ignatova, V.A.; Kücher, P.; Weisheit, M.; Zschech, E. | Journal Article |
| 2009 | Stress-induced phenomena in nanosized copper interconnect structures studied by x-ray and electron microscopy
Zschech, E.; Huebner, R.; Chumakov, D.; Aubel, O.; Friedrich, D.; Guttmann, P.; Heim, S.; Schneider, G. | Journal Article |
| 2009 | Surface-sensitive strain analysis of Si/SiGe line structures by raman and UV-raman spectroscopy
Roelke, M.; Hecker, M.; Hermann, P.; Lehninger, D.; Ritz, Y.; Zschech, E.; Vartanian, V. | Conference Paper |
| 2008 | Nano-Röntgentomographie für Prozesskontrolle und Fehleranalyse in der Halbleiterindustrie
Braun, S.; Zschech, E.; Yun, W. | Conference Paper |
| 2005 | The FABLAB concept integration of analytics and metrology in semiconductor industry
Zschech, E.; Mantz, U.; Kücher, P. | Conference Paper |