Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fully printed zinc oxide electrolyte-gated transistors on paper
Carvalho, José Tiago; Dubceac, Viorel; Grey, Paul; Cunha, Ines; Fortunato, Elvira; Martins, Rodrigo; Clausner, André; Zschech, Ehrenfried; Pereira, Luis
Journal Article
2019A semiconducting layered metal-organic framework magnet
Yang, Chongqing; Dong, Renhao; Wang, Mao; Petkov, Petko St.; Zhang, Zhitao; Wang, Mingchao; Han, Peng; Ballabio, Marco; Bräuninger, Sascha A.; Liao, Zhongquan; Zhang, Jichao; Schwotzer, Friedrich; Zschech, Ehrenfried; Klauss, Hans-Henning; Canovas, Enrique; Kaskel, Stefan; Bonn, Mischa; Zhou, Shengqiang; Heine, Thomas; Feng, Xinliang
Journal Article
2018Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Characterization of spatial distribution of electrolyte in molten carbonate fuel cell cathodes
Wejrzanowski, Tomasz; Gluch, Jürgen; Ibrahim, Samih Haj; Cwieka, Karol; Milewski, Jaroslaw; Zschech, Ehrenfried
Journal Article
2018Cobalt-based metal-organic framework nanoarrays as bifunctional oxygen electrocatalysts for rechargeable Zn-air batteries
Chen, Guangbo; Zhang, Jian; Wang, Faxing; Wang, Lanlan; Liao, Zhongquan; Zschech, Ehrenfried; Müllen, Klaus; Feng, Xinliang
Journal Article
2018Combination of soft X-ray microscopy with in-situ mechanical testing to image crack propagation in microchips
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article, Conference Paper
2018Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes
Zhang, Tao; Hou, Yang; Dzhagan, Volodymyr M.; Liao, Zhongquan; Chai, Guoliang; Löffler, Markus; Olianas, Davide; Milani, Alberto; Xu, Shunqi; Tommasini, Matteo; Zahn, Dietrich R.T.; Zheng, Zhikun; Zschech, Ehrenfried; Jordan, Rainer Andreas; Feng, Xinliang
Journal Article
2018A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior
Dong, Renhao; Zhang, Zhitao; Tranca, Diana C.; Zhou, Shengqiang; Wang, Mingchao; Adler, Peter; Liao, Zhongquan; Liu, Feng; Sun, Yan; Shi, Wujun; Zhang, Zhe; Zschech, Ehrenfried; Mannsfeld, Stefan C.B.; Felser, Claudia; Feng, Xinliang
Journal Article
2018A delamination strategy for thinly layered defect-free high-mobility black phosphorus flakes
Yang, Sheng; Zhang, Ke; Ricciardulli, Antonio Gaetano; Zhang, Panpan; Liao, Zhongquan; Lohe, Martin R.; Zschech, Ehrenfried; Blom, Paul W.M.; Pisula, Wojciech; Müllen, Klaus; Feng, Xinliang
Journal Article
2018In-situ X-ray microscopy of crack-propagation to study fracture mechanics of on-chip interconnect structures
Kutukova, Kristina; Liao, Zhongquan; Werner, Stephan; Guttmann, Peter; Standke, Yvonne; Gluch, Jürgen; Schneider, Gerd; Zschech, Ehrenfried
Journal Article
2018Laboratory computed x-ray tomography - a nondestructive technique for 3D microstructure analyis of materials
Zschech, Ehrenfried; Löffler, Markus; Krüger, Peter; Gluch, Jürgen; Kutukova, Kristina; Zglobicka, Izabela; Silomon, Jendrik; Rosenkranz, Rüdiger; Standke, Yvonne; Topal, E.
Journal Article
2018A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
Kutukova, Kristina; Niese, Sven; Sander, Christoph; Standke, Yvonne; Gluch, Jürgen; Gall, Martin; Zschech, Ehrenfried
Journal Article
2018Multi-modal porous microstructure for high temperature fuel cell application
Wejrzanowski, T.; Haj Ibrahim, S.; Cwieka, K.; Löffler, Markus; Milewski, J.V.; Zschech, Ehrenfried; Lee, C.-G.
Journal Article
2018A novel micro-double cantilever beam (micro-DCB) test in an X-ray microscope to study crack propagation in materials and structures
Kutukova, Kristina; Niese, Sven; Gelb, Jeff; Dauskardt, Reinhold; Zschech, Ehrenfried
Journal Article
2018Polymerization driven monomer passage through monolayer chemical vapour deposition graphene
Zhang, Tao; Liao, Zhongquan; Medrano Sandonas, Leonardo; Dianat, Arezoo; Liu, Xiaoling; Xiao, Peng; Amin, Ihsan; Gutierrez, Rafael; Chen, Tao; Zschech, Ehrenfried; Cuniberti, Gianaurelio; Jordan, Rainer
Journal Article
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers
Garitagoitia, Maria Aranzazu; Rosenkranz, Rüdiger; Löffler, M.; Clausner, André; Standke, Yvonne; Zschech, Ehrenfried
Journal Article
2018Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation
Huang, J.; Löffler, Markus; Mühle, Uwe; Möller, Wolfhard; Mulders, Johannes J.L.; Kwakman, Laurens; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2018Vorrichtung zur Durchführung von Biegeversuchen an plattenförmigen Proben
Clausner, André; Gall, Martin; Macher, Frank; Sander, Christoph; Zschech, Ehrenfried
Patent
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Journal Article
2017Area-selective atomic layer deposition of Ru on electron-beam-written Pt(C) patterns versus SiO2 substratum
Junige, Marcel; Löffler, Markus; Geidel, Marion; Albert, Matthias; Bartha, Johann W.; Zschech, Ehrenfried; Rellinghaus, Bernd; Dorp, Willem F. van
Journal Article
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Journal Article
2017Doping of graphene induced by boron/silicon substrate
Dianat, Arezoo; Liao, Zhongquan; Gall, Martin; Zhang, Tao; Gutierrez, Rafael; Zschech, Ehrenfried; Cuniberti, Gianaurelio
Journal Article
2017Editorial
Zschech, Ehrenfried
Journal Article
2017Efficient hydrogen production on MoNi4 electrocatalysts with fast water dissociation kinetics
Zhang, Jian; Wang, Tao; Liu, Pan; Liao, Zhongquan; Liu, Shaohua; Zhuang, Xiaodong; Chen, Mingwei; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Enabling energy efficiency and polarity control in germanium nanowire transistors by individually gated nanojunctions
Trommer, Jens; Heinzig, André; Mühle, Uwe; Löffler, Markus; Winzer, Annett; Jordan, Paul M.; Beister, Jürgen; Baldauf, Tim; Geidel, Marion; Adolphi, Barbara; Zschech, Ehrenfried; Mikolajick, Thomas; Weber, Walter Michael
Journal Article
2017In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope
Liao, Zhongquan; Sandonas, Leonardo Medrano; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Gutierrez, Rafael; Mühle, Uwe; Gluch, Jürgen; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2017In-Situ Transmission Electron Microscopy Studies on Advanced Materials for Micro- and Nano-Electronics
Liao, Zhongquan
: Zschech, Ehrenfried (Gutachter); Cuniberti, Gianaurelio (Gutachter); Wolf, Ingrid de (Gutachter)
Dissertation
2017Iridium nanoparticles anchored on 3D graphite foam as a bifunctional electrocatalyst for excellent overall water splitting in acidic solution
Zhang, Jian; Wang, Gang; Liao, Zhongquan; Zhang, Panpan; Wang, Faxing; Zhuang, Xiaodong; Zschech, Ehrenfried; Feng, Xinliang
Journal Article
2017Low ppm failure analysis for advanced Cu and Cu alloy on-chip wiring
Kraatz, Matthias; Hauschildt, Meike; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2017Low temperature stability of 4O martensite in Ni49.1Mn38.9Sn12 metamagnetic Heusler alloy ribbons
Czaja, Paweł; Przewoźnik, Janusz; Gondek, Łukasz; Hawełek, Łukasz; Żywczak, Antoni; Zschech, Ehrenfried
Journal Article
2017Preparation and TEM characterization of interfaces in co-sintered metal-ceramic composites
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Gluch, Jürgen; Zschech, Ehrenfried
Poster
2017Target preparation and characterization of interfaces in co-sintered metal ceramic composites using imaging and analytical Transmission Electron Microscopy
Mühle, Uwe; Günther, Anne; Standke, Yvonne; Moritz, Tassilo; Herrmann, Mathias; Gluch, Jürgen; Zschech, Ehrenfried
Book Article
2017Visualization of the internal structure of Didymosphenia geminata frustules using nano X-ray tomography
Zglobicka, Izabela; Li, Qiong; Gluch, Jürgen; Płocińska, Magdalena; Noga, Teresa; Dobosz, Romuald; Szoszkiewicz, Robert; Witkowski, Andrzej; Zschech, Ehrenfried; Kurzydłowski, Krzysztof J.
Journal Article
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Conference Paper
2016A dedicated illumination for full-field X-ray microscopy with multilayer Laue lenses
Niese, Sven; Braun, Stefan; Dietsch, Reiner; Gluch, Jürgen; Holz, Thomas; Huber, Norman; Kubec, Adam; Zschech, Ehrenfried
Conference Paper
2016Energy-Filtered Backscattered Imaging Using Low-Voltage Scanning Electron Microscopy: Characterizing Blends of ZnPc-C60 for Organic Solar Cells
Cid, Aranzazu Garitagoitia; Sedighi, Mona; Löffler, Markus; Dorp, Willem F. van; Zschech, Ehrenfried
Journal Article
2016FIB sample preparation for X-ray microscopy and ROI target cross-sectioning
Zschech, Ehrenfried; Gluch, Jürgen; Rosenkranz, Rüdiger; Standke, Yvonne; Niese, Sven
Abstract
2016Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"
Ho, Paul S.; Zschech, Ehrenfried
Abstract
2016Ga contamination in silicon by focused ion beam milling: Dynamic model simulation and atom probe tomography experiment
Huang, J.; Löffler, M.; Möller, W.; Zschech, Ehrenfried
Journal Article, Conference Paper
2016Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy
Kopycinska-Müller, Malgorzata; Clausner, André; Yeap, Kong Boon Oon; Köhler, Bernd; Kuzeyeva, Nataliya; Mahajan, Sukesh; Savage, Travis; Zschech, Ehrenfried; Wolter, Klaus-Jürgen
Journal Article
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Conference Paper
2016Non-destructive imaging of organosilicate glass (OSG) thin films at low voltage with the EsB detector
Garitagoitia, Maria Aranzazu; Moayedi, Elham; Rosenkranz, Rüdiger; Clausner, André; Pakbaz, Khashayar; Zschech, Ehrenfried
Journal Article
2016Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy
Conference Paper
2016Optimization of the SEM working conditions: EsB detector at low voltage
Cid, Aranzazu Garitagoitia; Rosenkranz, Rüdiger; Zschech, Ehrenfried
Journal Article
2016Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography
Li, Qiong; Gluch, Jürgen; Krüger, Peter; Gall, Martin; Neinhuis, Christoph; Zschech, Ehrenfried
Journal Article
2016Structural characterisation of carbon fibres along the fabrication process using SEM/FIB and TEM
Mühle, Uwe; Standke, Yvonne; Zschech, Ehrenfried; Meinl, Juliane; Michaelis, Alexander; Kirsten, Martin; Cherif, Chokri
Conference Paper
2016TEM investigation of time-dependent dielectric breakdown mechanisms in Cu/Low-k interconnects
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Rosenkranz, Rüdiger; Aubel, Oliver; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Conference Paper
2015Cross-sectional technologies
Voigtsberger, Bärbel; Rossner, Wolfgang; Lenk, Reinhard; Kinski, Isabel; Scheffler, Michael; Kollenberg, Wolfgang; Guillon, Olivier; Danzer, Robert; Wampers, Holger; Zschech, Ehrenfried
Journal Article
2015Fortschritte in der Metallographie
: Schneider, Gerhard (Hrsg.); Zschech, Ehrenfried (Hrsg.); Petzow, Günter (Hrsg.)
Conference Proceedings
2015In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried
Journal Article
2015In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Mühle, Uwe; Gluch, Jürgen; Standke, Yvonne; Aubel, Oliver; Vogel, Norman; Hauschildt, Meike; Beyer, Armand; Engelmann, Hans Jürgen; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Lab-based in-situ X-ray microscopy - methodical developments and applications in materials science and microelectronics
Niese, Sven
: Schmeißer, Dieter (Gutachter); Zschech, Ehrenfried (Gutachter); Schneider, Gerd (Gutachter)
Dissertation
2015Lateral damage in graphene carved by high energy focused gallium ion beams
Liao, Zhongquan; Zhang, Tao; Gall, Martin; Dianat, Arezoo; Rosenkranz, Rüdiger; Jordan, Rainer; Cuniberti, Gianaurelio; Zschech, Ehrenfried
Journal Article
2015Preparation and characterization of silicon nanowires using SEM/FIB and TEM
Banerjee, Sayanti; Mühle, Uwe; Löffler, Markus; Heinzig, André; Trommer, Jens; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Spezielle Anwendungen der Transmissionselektronenmikroskopie in der Siliziumhalbleiterindustrie
Mühle, Uwe
: Rafaja, David (Betreuer); Lichte, Hannes (Gutachter); Zschech, Ehrenfried (Gutachter)
Habilitation
2015TEM study of schottky junctions in reconfigurable silicon nanowire devices
Banerjee, Sayanti; Löffler, Markus; Mühle, Uwe; Berent, Katarzyna; Heinzig, A.; Trommer, J.; Weber, Walter; Zschech, Ehrenfried
Journal Article
2015Verfahren zur Erstellung von Elementverteilungsbildern mit einem Transmissionselektronenmikroskop
Mühle, Uwe; Gluch, Jürgen; Zschech, Ehrenfried
Patent
20143D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried
Presentation
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced concepts for TDDB reliability in conjunction with 3D stress
Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried
Journal Article
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Fabrication of customizable wedged multilayer Laue lenses by adding a stress layer
Niese, Sven; Krüger, Peter; Kubec, Adam; Laas, Roman; Gawlitza, Peter; Melzer, Kathleen; Braun, Stefan; Zschech, Ehrenfried
Journal Article
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Full-field X-ray microscopy with crossed partial multilayer Laue lenses
Niese, Sven; Krüger, Peter; Kubec, Adam; Braun, Stefan; Patommel, Jens; Schroer, Christian G.; Leson, Andreas; Zschech, Ehrenfried
Journal Article
2014In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
Yeap, Kong Boon; Gall, Martin; Liao, Zhongquan; Sander, Christoph; Mühle, Uwe; Justison, Patrick; Aubel, Oliver; Hauschildt, Meike; Beyer, Armand; Vogel, Norman; Zschech, Ehrenfried
Journal Article
2014In-situ investigations of individual nanowires within a FIB/SEM system
Löffler, Markus; Banerjee, Sayanti; Trommer, Jens; Heinzig, André; Weber, Walter; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Managing stress-induced effects on performance and reliability of 3D IC stacks
Zschech, Ehrenfried
Abstract
2014Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies - effect of stress on 3D IC interconnect reliability
Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2014Multi-scale X-ray tomography for process and quality control in 3D TSV packaging
Zschech, Ehrenfried; Niese, Sven; Löffler, Markus; Wolf, M. Jürgen
Conference Paper
2014A new in situ microscopy approach to study the degradation and failure mechanisms of time-dependent dielectric breakdown: Set-up and opportunities
Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Aubel, Oliver; Mühle, Uwe; Gluch, Jürgen; Niese, Sven; Standke, Yvonne; Rosenkranz, Rüdiger; Löffler, Markus; Vogel, Norman; Beyer, Armand; Engelmann, Hans Jürgen; Guttmann, Peter; Schneider, Gerhard; Zschech, Ehrenfried
Journal Article
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Conference Paper
2014X-ray microscopy and tomography of hydrogen storage materials
Gluch, J.; Niese, S.; Röntzsch, L.; Zschech, E.
Journal Article
2013The effect of the pore topology on the elastic modulus of organosilicate glasses
Yeap, K.-B.; Kopycinska-Mueller, M.; Chen, L.; Chen, Y.; Jungmann, M.; Krause-Rehberg, R.; Mahajan, S.; Vlassak, J.; Gall, M.; Zschech, E.
Journal Article
2013Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Hauschildt, M.; Hennesthal, C.; Talut, G.; Aubel, O.; Gall, M.; Yeap, K.B.; Zschech, E.
Conference Paper
2013EUFANET workshop 2012 report
Touzel, J.; Langer, E.; Zschech, E.
Journal Article
2013An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O.
Conference Paper
2013Influence of the fullerene derivatives and cage polyhedral oligomeric silsesqiuoxanes on 3-aminopropyltrimethoxysilane based hybrid nanocomposites chemical, morphological and electrical properties
Klocek, J.; Kolanek, K.; Henkel, K.; Zschech, E.; Schmeisser, D.
Journal Article
2013Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods
Kopycinska-Müller, M.; Yeap, K.B.; Mahajan, S.; Köhler, B.; Kuzeyeva, N.; Müller, T.; Zschech, E.; Wolter, K.J.
Journal Article
2013Multi-scale materials data for 3D TSV stack performance simulation and model validation
Zschech, E.; Yeap, K.B.; Sander, C.; Muehle, U.; Gall, M.; Sukharev, V.
Conference Paper
2013Nanoindentation for reliability assessment of ULK films and interconnects structures
Yeap, K.B.; Iacopi, F.; Geisler, H.; Hangen, U.; Zschech, E.
Journal Article
20123D interconnect technology
Knickerbocker, J.U.; Kong, L.W.; Niese, S.; Diebold, A.; Zschech, E.
Book Article
20123D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy
Kong, L.; Rudack, A.C.; Krueger, P.; Zschech, E.; Arkalgud, S.; Diebold, A.C.
Journal Article, Conference Paper
2012Advanced interconnects for ULSI technology
: Baklanov, M.R.; Ho, P.S.; Zschech, E.
Book
2012Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects
Cao, L.; Ganesh, K.J.; Zhang, L.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ferreira, P.J.; Ho, P.S.
Conference Paper
2012Annealing influence on siloxane-based materials incorporated with fullerenes, phthalocyanines, and silsesquioxanes
Klocek, J.; Henkel, K.; Kolanek, K.; Zschech, E.; Schmeißer, D.
Journal Article
2012Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias
Karmarkar, A.P.; Xu, X.; Yeap, K.-B.; Zschech, E.
Journal Article
2012Correction to "Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias" (vol 12, pg 225, 2012)
Karmarkar, A.P.; Xu, X.P.; Yeap, K.B.; Zschech, E.
Journal Article
2012A critical review on multiscale material database requirement for accurate three-dimensional IC simulation input
Yeap, K.-B.; Roellig, M.; Huebner, R.; Gall, M.; Sukharev, V.; Zschech, E.
Journal Article
2012Elastic anisotropy of Cu and its impact on stress management for 3D IC
Yeap, K.B.; Zschech, E.; Hangen, U.D.; Wyrobek, T.; Kong, L.W.; Karmakar, A.; Xu, X.P.; Panchenko, I.
Journal Article
2012Forward to the special section on "Materials, Processing, and Reliability of 3-D Interconnects". Editorial
Ho, P.S.; Smith, L.; Tong, H.M.; Zschech, E.
Journal Article
2012Multi-scale simulation methodology for stress assessment in 3D IC
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.
Journal Article
2012Nanometer deformation of elastically anisotropic materials studied by nanoindentation
Yeap, K.B.; Kopycinska-Müller, M.; Hangen, U.D.; Zambaldi, C.; Hübner, R.; Niese, S.; Zschech, E.
Journal Article
2012Physics-based models for EM and SM simulation in three-dimensional IC structures
Sukharev, V.; Kteyan, A.; Zschech, E.
Journal Article
2012Setup for measuring the resonance characteristics of high-frequency microtransducers
Maozie, G.; Nieradka, K.; Kopiec, D.; Ritz, Y.; Zschech, E.; Gotszalk, T.
Journal Article
2012Spectroscopic and capacitance-voltage characterization of thin aminopropylmethoxysilane films doped with copper phthalocyanine, tris(dimethylvinylsilyloxy)-POSS and fullerene cages
Klocek, J.; Henkel, K.; Kolanek, K.; Zschech, E.; Schmeißer, D.
Journal Article
2012Studies of the chemical and electrical properties of fullerene and 3-aminopropyltrimethoxysilane based low-k materials
Klocek, J.; Henkel, K.; Kolanek, K.; Broczkowska, K.; Schmeisser, D.; Miller, M.; Zschech, E.
Journal Article
2011Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
Kong, L.W.; Lloyd, J.R.; Yeap, K.B.; Zschech, E.; Rudack, A.; Liehr, M.; Diebold, A.
Journal Article
2011Atomic-scale engineering of future high-k dynamic random access memory dielectrics
Dudek, P.; Lupina, G.; Kozowski, G.; Zaumseil, P.; Bauer, J.; Fursenko, O.; Dabrowski, J.; Schmidt, R.; Lippert, G.; Müssig, H.-J.; Schroeder, T.; Schmeißer, D.; Zschech, E.
Journal Article, Conference Paper
2011Characterization of small Cu grains using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E.; Zschech, E.
Journal Article, Conference Paper
2011Devices, materials, and processes for nanoelectronics: Characterization with advanced X-ray techniques using lab-based and synchrotron radiation sources
Zschech, E.; Wyon, C.; Murray, C.E.; Schneider, G.
Journal Article
2011Efficient target preparation by combined pulsed laser ablation and FIB milling
Stegmann, H.; Dömer, H.; Rosenkranz, R.; Zschech, E.
Journal Article, Conference Paper
2011Efficient target preparation by combining laser ablation and FIB milling in a single tool
Stegmann, H.; Dömer, H.; Cai, H.; Rosenkranz, R.; Zschech, E.
Conference Paper
2011Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping
Zhang, L.J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Journal Article
2011A high-resolution measurement system for novel scanning thermal microscopy resistive nanoprobes
Wielgoszewski, G.; Sulecki, P.; Janus, P.; Grabiec, P.; Zschech, E.; Gotszalk, T.
Journal Article
2011Improved scanning geometry to collect 3D-geometry data in flat samples
Krüger, P.; Niese, S.; Zschech, E.; Gelb, J.; Feser, M.
Conference Paper
2011Metrology and Failure Analysis for 3D IC Integration
Zschech, E.; Diebold, A.
Conference Paper
2011Multi-scale environment for simulation and materials characterization in stress management for 3D IC TSV-based technologies - effect of stress on the device characteristics
Sukharev, V.; Zschech, E.
Conference Paper
2011Nanoindentation for quality control of ULK films
Yeap, K.B.; Zeng, K.; Hangen, U.; Zschech, E.
Conference Paper
2011Nanoindentation study of elastic anisotropy of Cu single crystals and grains in TSVs
Yeap, K.B.; Hangen, U.D.; Raabe, D.; Zschech, E.
Conference Paper
2011Nanomechanical characterization and metrology for low-k and ULK materials
Hangen, U.D.; Yeap, K.-B.; Vodnick, D.; Zschech, E.; Li, H.; Vlassak, J.
Conference Paper
2011NanoXCT - A high-resolution technique for TSV characterization
Niese, S.; Krueger, P.; Zschech, E.
Conference Paper
2011Scanning thermal microscopy: A nanoprobe technique for studying the thermal properties of nanocomponents
Wielgoszewski, G.; Sulecki, P.; Gotszalk, T.; Janus, P.; Grabiec, P.; Hecker, M.; Ritz, Y.; Zschech, E.
Journal Article
2011Stress management for 3D ICs using through silicon vias
: Zschech, E.
Conference Proceedings
2011Stress-induced effects caused by 3D IC TSV packaging in advanced semiconductor device performance
Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.
Conference Paper
2010Assessment of mechanical properties of nanoscale structures for microprocessor manufacturing
Niese, S.; Hecker, M.; Liske, R.; Ritz, Y.; Zschech, E.; Wojcik, H.; Bartha, J.; Wu, Z.; Ho, P.S.
Conference Paper
2010Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Im, J.; Zschech, E.; Ho, P.S.
Conference Paper
2010Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon-germanium for high-performance complementary metal oxide semiconductor devices
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Journal Article
2010Cohesive toughness of low-k film with periodically changing elastic modulus: Cube-corner indentation
Yeap, K.B.; Hangen, U.; Ritz, Y.; Kim, T.-S.; Dauskardt, R.; Zschech, E.
Conference Paper
2010Conical dark-field analysis for small grain characterization in narrow Cu interconnect structures: Potential and challenges
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Conference Paper
2010Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node
Zhang, L.; Zhou, J.P.; Im, J.; Ho, P.S.; Aubel, O.; Hennesthal, C.; Zschech, E.
Conference Paper
2010EM and SM induced degradation dynamics in copper interconnects studied using electron microscopy and X-ray microscopy
Zschech, E.; Hübner, R.; Aubel, O.; Ho, P.S.
Conference Paper
2010Fullerene based materials for ultra-low-k application
Broczkowska, K.; Klocek, J.; Friedrich, D.; Henkel, K.; Kolanek, K.; Urbanowicz, A.; Schmeisser, D.; Miller, M.; Zschech, E.
Conference Paper
2010Grain size and cap layer effects on electromigration reliability of Cu interconnects: Experiments and simulation
Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Zschech, E.; Ho, P.S.
Conference Paper
2010Local anodic oxidation by atomic force microscopy for nano-Raman strain measurements on silicon-germanium thin films
Kolanek, K.; Hermann, P.; Dudek, P.T.; Gotszalk, T.; Chumakov, D.; Weisheit, M.; Hecker, M.; Zschech, E.
Journal Article
2010Materials for information technology
Zschech, E.
Journal Article
2010Microfabricated resistive high-sensitivity nanoprobe for scanning thermal microscopy
Wielgoszewski, G.; Sulecki, P.; Gotszalk, T.; Janus, P.; Szmigiel, D.; Grabiec, P.; Zschech, E.
Journal Article
2010Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices
Janus, P.; Szmigiel, D.; Weisheit, M.; Wielgoszewski, G.; Ritz, Y.; Grabiec, P.; Hecker, M.; Gotszalk, T.; Sulecki, P.; Zschech, E.
Conference Paper, Journal Article
2010Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S.; Zschech, E.; Schmeißer, D.; Meyer, M.A.; Hübner, R.; Hauschildt, M.; Zhang, L.; Gall, M.; Kraatz, M.
Journal Article
2010Small grain and twin characterization in sub-100 nm Cu interconnects using the conical dark-field technique in the transmission electron microscope
Hübner, R.; Engelmann, H.-J.; Zschech, E.
Conference Paper
2010Strain distribution analysis in Si/SiGe line structures for CMOS technology using Raman spectroscopy
Hecker, M.; Roelke, M.; Hermann, P.; Zschech, E.; Vartanian, V.
Journal Article
2010Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization 2010. Preface
Zschech, E.; Ho, P.; Ogawa, S.
Journal Article, Conference Paper
2010Sub-imaging techniques for 3D-interconnects on bonded wafer pairs
Kong, L.W.; Krueger, P.; Zschech, E.; Rudack, A.C.; Arkalgud, S.; Diebold, A.C.
Conference Paper
2009Fracture toughness assessment of patterned Cu-interconnect stacks by dual-cantilever-beam (DCB) technique
Chumakov, Dmytro; Lindert, Frank; Lehr, Matthias U.; Grillberger, Michael; Zschech, Ehrenfried
Journal Article
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Journal Article
2009Investigation of boron delta-layers in silicon measured by atom probe tomography (APT)
Klein, C.; Mutas, S.; Würfel, A.; Zschech, E.
Conference Paper, Journal Article
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Journal Article
2009Novel in-line inspection method for non-visual defects and charging
Höppner, K.; Manuwald, R.; Fahr, T.; Zschech, Ehrenfried; Tamayo, N.; Hickson, J.; Adrian, B.; Newcomb, R.
Conference Paper
2009Post annealing effect on ultra-thin Hf-based high-k gate oxides on Si
Kim, J.-H.; Ignatova, V.A.; Kücher, P.; Weisheit, M.; Zschech, E.
Journal Article
2009The stability of C60 and its derivatives upon handling in microsystems technologies
Klocek, Jolanta; Friedrich, Daniel; Schmeißer, Dieter; Hecker, Michael; Zschech, Ehrenfried
Conference Paper
2009Stress-induced phenomena in nanosized copper interconnect structures studied by x-ray and electron microscopy
Zschech, E.; Huebner, R.; Chumakov, D.; Aubel, O.; Friedrich, D.; Guttmann, P.; Heim, S.; Schneider, G.
Journal Article
2009Surface-sensitive strain analysis of Si/SiGe line structures by raman and UV-raman spectroscopy
Roelke, M.; Hecker, M.; Hermann, P.; Lehninger, D.; Ritz, Y.; Zschech, E.; Vartanian, V.
Conference Paper
2008Application of high-resolution X-ray microscopy to image backend-of-line structures
Zschech, Ehrenfried; Braun, S.; Yun, W.
Conference Paper
2008Nano-Röntgentomographie für Prozesskontrolle und Fehleranalyse in der Halbleiterindustrie
Braun, S.; Zschech, E.; Yun, W.
Conference Paper
2008Novel carbon-cage-based ultralow-k materials: Modeling and first experiments
Zagorodniy, K.; Chumakov, D.; Täschner, C.; Lukowiak, A.; Stegmann, H.; Schmeißer, D.; Geisler, H.; Engelmann, H.-J.; Hermann, H.; Zschech, Ehrenfried
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2007Assessing the effect of die sealing in Cu/Low-k structures
Kearney, A.V.; Vairagar, A.V.; Geisler, H.; Zschech, Ehrenfried; Dauskardt, R.H.
Conference Paper
2007Calibration of atomic force microscope for nanoscale friction measurements
Masalska, A.; Kolanek, K.; Woszczyna, M.; Zawierucha, P.; Ritz, Y.; Zschech, Ehrenfried
Conference Paper
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper
2005The FABLAB concept integration of analytics and metrology in semiconductor industry
Zschech, E.; Mantz, U.; Kücher, P.
Conference Paper
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper
2000Microstructure characterization of metal interconnects and barrier layers: Status and future
Zschech, Ehrenfried; Besser, P.R.
Conference Paper