Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Conference Paper
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Journal Article
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Conference Paper
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Conference Paper
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Conference Paper
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Journal Article
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Conference Paper
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Journal Article, Conference Paper
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, K.; Lang, K.-D.
Conference Paper
2016Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.
Abstract
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Conference Paper
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.
Conference Paper
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D.
Conference Paper
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter
Conference Paper
2015Hochauflösende Magnetfeld-Positionssensoren
Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K.
Conference Paper
2015Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding
Zoschke, Kai; Lang, Klaus-Dieter
Conference Paper
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.
Conference Paper
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, Charles-Alix; Zoschke, Kai; Oppermann, Hermann; Ruffieux, D.; Piazza, S. dalla; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, Kai; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Journal Article, Conference Paper
2014Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.
Conference Paper
2014Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Journal Article
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.
Conference Paper
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Conference Paper
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing
Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.
Conference Paper
2012Low temperature wafer level bonding using benzocyclobutene adhesive polymers
Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.
Conference Paper
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Conference Paper
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2011Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
2010Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.
Conference Paper
2010BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique
Kaynak, M.; Wietstruck, M.; Scholz, R.; Drews, J.; Barth, R.; Ehwald, K.E.; Fox, A.; Haak, U.; Knoll, D.; Korndörfer, F.; Marschmeyer, S.; Schulz, K.; Wipf, C.; Wolansky, D.; Tillack, B.; Zoschke, K.; Fischer, T.; Kim, Y.S.; Kim, J.S.; Lee, W.-G.; Kim, J.W.
Conference Paper
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2010Silicon interposer for heterogeneous integration
Wolf, M.J.; Zoschke, K.; Wieland, R.; Klein, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Silicon-interposer with high density Cu-filled TSVs
Wieland, R.; Zoschke, K.; Jürgensen, N.; Merkel, R.; Nebrich, L.; Wolf, J.
Conference Paper
2010Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.
Journal Article
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009BCB with nano-filled BaSrTiO3 for thin film capacitors
Töpper, M.; Fischer, T.; Zoschke, K.; Zang, M.; Teipel, U.; Fehrenbacher, U.; Reichl, H.
Conference Paper
2009Fabrication of 3-D microstructures with permanent dielectric dry film
Baumgartner, T.; Hauck, K.; Zoschke, K.; Töpper, M.; Uno, H.; Liebsch, W.; Yun, H.; Ehlin, M.J.; Dietz, K.H.
Conference Paper
2009Functional Unit and Method aor the Production thereof
Wolf, J.; Zoschke, K.; Fischer, T.; Topper, M.; Reichl, H.
Patent
2009Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M.
Conference Paper
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
2008Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.
Patent
2008Verfahren zum Herstellen einer halbleiterbasierten Schaltung und halbleiterbasierte Schaltung mit dreidimensionaler Schaltungstopologie
Reichl, H.; Wolf, J.; Wieland, R.; Zoschke, K.
Patent
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.
Conference Paper
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.
Journal Article
2006FEA simulation of thin film coils to power wireless neural interfaces
Kim, S.; Scholz, O.; Zoschke, K.; Harrison, R.; Solzbacher, F.; Klein, M.; Toepper, M.
Conference Paper
2006Polymer based thin film coils as a power module of wireless neural interfaces
Kim, S.; Buschick, K.; Zoschke, K.; Klein, M.; Toepper, M.; Black, D.; Harrison, R.; Tathireddy, P.; Solzbacher, F.
Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2006WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Journal Article
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2005Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2005WLCSP technology direction
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.
Journal Article
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper