Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Verfahren und Vorrichtung zur Trennung einews flachen Werkstücks in mehrere Teilstücke
Zühlke, Hans-Ulrich; Koitzsch, Matthias; Lewke, Dirk; Tobisch, Alexander
Patent
2013Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment. Results from European collaborative SEAL project
Le Barillec, Olivier; Davenet, Magali; Bellet, B.; Koitzsch, Matthias; Lewke, Dirk; Schellenberger, Martin; Zühlke, Hans-Ulrich
Conference Paper
2012Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article, Conference Paper
2012Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells
Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich
Conference Paper
2012Thermal laser separation and its applications
Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich
Journal Article