Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Hauschildt, M.; Hennesthal, C.; Talut, G.; Aubel, O.; Gall, M.; Yeap, K.B.; Zschech, E.
Conference Paper
2013An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
Yeap, K.B.; Gall, M.; Sander, C.; Niese, S.; Liao, Z.; Ritz, Y.; Rosenkranz, R.; Mühle, U.; Gluch, J.; Zschech, E.; Aubel, O.; Beyer, A.; Hennesthal, C.; Hauschildt, M.; Talut, G.; Poppe, J.; Vogel, N.; Engelmann, H.-J.; Stauffer, D.; Major, R.; Warren, O.
Conference Paper
2013Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods
Kopycinska-Müller, M.; Yeap, K.B.; Mahajan, S.; Köhler, B.; Kuzeyeva, N.; Müller, T.; Zschech, E.; Wolter, K.J.
Journal Article
2013Multi-scale materials data for 3D TSV stack performance simulation and model validation
Zschech, E.; Yeap, K.B.; Sander, C.; Muehle, U.; Gall, M.; Sukharev, V.
Conference Paper
2013Nanoindentation for reliability assessment of ULK films and interconnects structures
Yeap, K.B.; Iacopi, F.; Geisler, H.; Hangen, U.; Zschech, E.
Journal Article
2012Correction to "Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias" (vol 12, pg 225, 2012)
Karmarkar, A.P.; Xu, X.P.; Yeap, K.B.; Zschech, E.
Journal Article
2012Elastic anisotropy of Cu and its impact on stress management for 3D IC
Yeap, K.B.; Zschech, E.; Hangen, U.D.; Wyrobek, T.; Kong, L.W.; Karmakar, A.; Xu, X.P.; Panchenko, I.
Journal Article
2012Nanometer deformation of elastically anisotropic materials studied by nanoindentation
Yeap, K.B.; Kopycinska-Müller, M.; Hangen, U.D.; Zambaldi, C.; Hübner, R.; Niese, S.; Zschech, E.
Journal Article
2011Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
Kong, L.W.; Lloyd, J.R.; Yeap, K.B.; Zschech, E.; Rudack, A.; Liehr, M.; Diebold, A.
Journal Article
2011Nanoindentation for quality control of ULK films
Yeap, K.B.; Zeng, K.; Hangen, U.; Zschech, E.
Conference Paper
2011Nanoindentation study of elastic anisotropy of Cu single crystals and grains in TSVs
Yeap, K.B.; Hangen, U.D.; Raabe, D.; Zschech, E.
Conference Paper
2010Cohesive toughness of low-k film with periodically changing elastic modulus: Cube-corner indentation
Yeap, K.B.; Hangen, U.; Ritz, Y.; Kim, T.-S.; Dauskardt, R.; Zschech, E.
Conference Paper