Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Journal Article, Conference Paper
2014TSV-annealing: A thermo-mechanical assessment
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Conference Paper
2013µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery
Saettler, P.; Boettcher, M.; Wolter, K.J.
Conference Paper
2013Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods
Kopycinska-Müller, M.; Yeap, K.B.; Mahajan, S.; Köhler, B.; Kuzeyeva, N.; Müller, T.; Zschech, E.; Wolter, K.J.
Journal Article
2012Thermo-mechanical characterization and modeling of TSV annealing behavior
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig, M.; Boettcher, M.; Wolter, K.J.
Conference Paper
2010Influence of indium on microstructure and creep properties of SnAg3.5InX (X=0,2,4,8) solder alloys
Boareto, J.C.; Metasch, R.; Roellig, M.; Wendhausen, P.A.P.; Wolter, K.J.
Conference Paper
2009Comprehensive material characterization of organic packaging materials
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J.
Conference Paper
2009Modeling, simulation and calibration of the chip encapsulation molding process
Roellig, M.; Meyer, S.; Thiele, M.; Rzepka, S.; Wolter, K.J.
Conference Paper
2009Thermo mechanical characterization of packaging polymers
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J.
Conference Paper
2001Plasma treatment for fluxless soldering
Deltschew, R.; Hirsch, D.; Neumann, H.; Herzog, T.; Wolter, K.J.; Nowottnick, M.; Wittke, K.
Journal Article