Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Bath chemistry and copper overburden as influencing factors of the TSV annealing
Saettler, P.; Boettcher, M.; Rudolph, C.; Wolter, K.-J.
Conference Paper
2013The effect of Cu and Ag on the yielding behaviour of lead-free solders at high strain rates
Meier, K.; Roellig, M.; Wolter, K.-J.
Conference Paper
2013Evaluation of embedded IC approach for automotive application
Schwerz, R.; Meier, K.; Roellig, M.; Schiessl, A.; Schingale, A.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2013Lifetime assessment for bipolar components under vibration and temperature loading
Meier, K.; Roellig, M.; Lautenschlaeger, G.; Schiessl, A.; Wolter, K.-J.
Conference Paper
2013Low cycle fatigue measurement results on real flip chip solder contacts
Metasch, R.; Roellig, M.; Roehsler, A.; Boehm, C.; Wolter, K.-J.
Conference Paper
2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2013Parameters of the manufacturing process and reliability of embedded components
Osmolovskyi, S.; Schwerz, R.; Wolter, K.-J.
Conference Paper
2013Reliability of embedding concepts for discrete passive components in organic circuit boards
Schwerz, R.; Boehme, B.; Roellig, M.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2012Bio and nano packaging techniques for electron devices
: Gerlach, Gerald; Wolter, K.-J.
Book
2012Characterisation of lead-free solders at high strain rates considering microstructural conditions
Meier, K.; Kraemer, F.; Roellig, M.; Wolter, K.-J.
Conference Paper
2012Characterization of the annealing behavior for copper-filled TSVs
Saettler, P.; Boettcher, M.; Wolter, K.-J.
Conference Paper
2012Combined creep and fatigue measurement method for lead-free solder alloys
Metasch, R.; Roellig, M.; Wolter, K.-J.
Conference Paper
2012Dual resonance excitation system for the contact mode of atomic force microscopy
Kopycinska-Müller, M.; Striegler, A.; Schlegel, R.; Kuzeyeva, N.; Köhler, B.; Wolter, K.-J.
Journal Article
2012Effects of bonding pressure on quality of SLID interconnects
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Conference Paper
2012Einbettung von Ultraschallwandler- und Elektroniksystemen in CFK-Strukturen für die sensorische Strukturüberwachung
Böhme, B.; Röllig, M.; Lautenschläger, G.; Franke, M.; Schulz, J.; Wolter, K.-J.
Conference Paper
2012Lifetime assessment of BGA solder joints with voids under thermo-mechanical load
Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.
Conference Paper
2012Modular design of fully integrated counting line detectors
Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Wolter, K.-J.; Meyendorf, N.
Journal Article, Conference Paper
2011The creep behaviour and microstructure of ultra small solder joints
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Wolter, K.-J.
Conference Paper
2011Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology
Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Zerna, T.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2011Finite element modeling on thermal fatigue of BGA solder joints with multiple voids
Schwerz, R.; Meyer, S.; Roellig, M.; Meier, K.; Wolter, K.-J.
Conference Paper
2011Life time prediction for lead-free solder joints under vibration loads
Meier, K.; Röllig, M.; Schiessl, A.; Wolter, K.-J.
Conference Paper
2011Packaging and characterisation of ultra low power VCSEL for sensor networks
Sohr, S.; Fischer, D.; Rieske, R.; Nieweglowski, K.; Wolter, K.-J.
Conference Paper
2011Packaging development for GaAs X-ray line detectors
Oppermann, M.; Albrecht, O.; Lohse, T.; Metasch, R.; Zerna, T.; Wolter, K.-J.
Conference Paper
2011Process and material effects on BGA board level solder joint reliability
Meyer, S.; Metasch, R.; Schwerz, R.; Wohlrabe, H.; Wolter, K.-J.
Conference Paper
2011Solidification processes in the Sn-rich part of the SnCu system
Panchenko, I.; Mueller, M.; Wiese, S.; Schindler, S.; Wolter, K.-J.
Conference Paper
2011Study of constant rate and constant force low cycle fatigue methods for solder characterization
Metasch, R.; Rodrigues, G.; Roellig, M.; Wendhausen, P.A.P.; Wolter, K.-J.
Conference Paper
2010Characterisation of the mechanical behaviour of SAC solder at high strain rates
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010CNTs - A comparable study of CNT-filled adhesives with common materials
Heimann, M.; Böhme, B.; Scheffler, S.; Wirts-Rütters, M.; Wolter, K.-J.
Conference Paper
2010Measurement of viscoelastic material properties of adhesives for SHM sensors under harsh environmental conditions
Boehme, B.; Roellig, M.; Wolter, K.-J.
Conference Paper
2010Mechanical behaviour of typical lead-free solders at high strain rate conditions
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Mechanical solder characterisation under high strain rate conditions
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Moisture induced change of the viscoelastic material properties of adhesives for SHM sensor applications
Boehme, B.; Röllig, M.; Wolter, K.-J.
Conference Paper
2010Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2010Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Conference Paper
2010The scaling effect on microstructure and creep properties of Sn-based solders
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Roellig, M.; Wolter, K.-J.
Conference Paper
2010Surface crack detection in ferritic and austenitic steel components using inductive heated thermography
Noethen, M.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2010Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Conference Paper
2010Thin film characterization using high frequency eddy current spectroscopy
Heuer, H.; Hillmann, S.; Röllig, M.; Schulze, M.; Wolter, K.-J.
Conference Paper
2009Application of carbon nanotubes as conductive filler of epoxy adhesives in microsystems
Heimann, M.; Rieske, R.; Wirts-Rütters, M.; Telychkina, O.; Böhme, B.; Wolter, K.-J.
Conference Paper
2009Characterization of nano-thin films and membranes by use of atomic force acoustic microscopy methods
Kopycinska-Müller, M.; Striegler, A.; Köhler, B.; Meyendorf, N.; Wolter, K.-J.
Conference Paper
2009CNTs - A comparable study of CNT-filled adhesives with common materials
Matthias, H.; Boehme, B.; Sebastian, S.; Wirts-Ruetters, M.; Wolter, K.-J.
Conference Paper
2009Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2009Elastic properties of nano - thin films by use of atomic force acoustic microscopy
Kopycinska-Müller, M.; Striegler, A.; Hürrich, A.; Köhler, B.; Meyendorf, N.; Wolter, K.-J.
Conference Paper
2009Mechanical characterisation of Lead free solder alloys under high strain rate loads
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Conference Paper
2009A novel thermo-mechanical test method of fatigue characterization of real solder joints
Metasch, R.; Röllig, M.; Wolter, K.-J.
Conference Paper
2009Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
Metasch, R.; Boareto, J.C.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2009Rasterkraftmikroskopie mit akustischer Probenanregung als Verfahren zur höchstaufgelösten Charakterisierung verborgener Strukturen und von Schichteigenschaften
Striegler, A.; Kopycinska-Müller, M.; Bendjus, B.; Köhler, B.; Meyendorf, N.; Wolter, K.-J.
Journal Article
2009The twinning phenomenon in SnAgCu solder balls
Mueller, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2008Carbon nanotube (CNT) filled adhesives for microelectronic packaging
Wirts-Rütters, M.; Heimann, M.; Kolbe, J.; Wolter, K.-J.
Conference Paper
2008Characterization of thin oxide layers by use of the atomic force acoustic microscopy
Striegler, A.; Kopycinska-Mueller, M.; Koehler, B.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2008Investigations of carbon nanotubes epoxy composites for electronics packaging
Heimann, M.; Wirts-Ruetters, M.; Boehme, B.; Wolter, K.-J.
Conference Paper
2008Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Conference Paper
2008Nano evaluation in electronics packaging
Oppermann, M.; Heuer, H.; Meyendorf, N.; Wolter, K.-J.
Conference Paper
2008Nano packaging - A challenge for non-destructive testing
Wolter, K.-J.; Oppermann, M.; Zerna, T.
Conference Paper
2008Nano-scaled functional layers for current and heat transport in electronics packaging
Heimann, M.; Meißner, F.; Schönecker, A.; Endler, I.; Wolter, K.-J.
Conference Paper
2008Scaling effects on grain size and texture of lead free interconnects - investigations by electron backscatter diffraction and nanoindentation
Krause, M.; Müller, M.; Petzold, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2007The center for non-destructive nano evaluation of electronic packaging (nanoEVA), a new research facility in dresden
Heuer, H.; Köhler, B.; Krüger, P.; Meyendorf, N.; Oppermann, M.; Wolter, K.-J.
Conference Paper
2007Electronics packaging for high reliable piezoactuators
Oppermann, M.; Lenk, A.; Schönecker, A.; Schuh, C.; Zerna, T.; Wolter, K.-J.
Conference Paper
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Journal Article
2007Laser-shaped thick-film and LTCC microresistors
Mi, E.; Borucki, M.; Dziedzic, A.; Kamiski, S.; Rebenklau, L.; Wolter, K.-J.; Sonntag, F.
Conference Paper
2007Micro- and nano-NDE for micro-electronics (back end)
Wolter, K.-J.; Oppermann, M.; Heuer, H.; Köhler, B.; Schubert, F.; Netzelmann, U.; Krüger, P.; Zhan, Q.; Meyendorf, N.
Conference Paper
2007Modeling LTCC-based microchannels using a network approach
Schlottig, G.; Rebenklau, L.; Uhlemann, J.; Nytsch-Geusen, C.; Wolter, K.-J.
Conference Paper
2007The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M.
Conference Paper
2006Analytical and mechanical methods for material property investigations of SnAgCu-solder
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2006Compositional effects on the creep properties of SnAgCu solder
Wiese, S.; Krämer, F.; Müller, M.; Röllig, M.; Wolter, K.-J.; Krause, M.; Bennemann, S.; Petzold, M.
Conference Paper
2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper