Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Journal Article
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Conference Paper
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Conference Paper
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Conference Paper
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Conference Paper
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Conference Paper
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Conference Paper
2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Conference Paper
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2015Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.
Conference Paper
2015Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B.
Conference Paper
2015Challenges of TSV backside process integration
Rudolph, C.; Wachsmuth, H.; Boettcher, M.; Steller, W.; Wolf, M.J.
Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014Challenges in 3D die stacking
Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2014Highly ionized sputter deposition into through silicon vias with aspect ratios up to 15:1
Viehweger, Kay; Weichart, J.; Elghazzali, M.; Reynolds, G.J.; Wolf, M.J.; Lang, K.-D.; Koller, A.; Dill, A.
Conference Paper
2014Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools
Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D.
Conference Paper
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013JEMSIP 3D. Major results & achievements from the project and exploitation thereof in future products
Wolf, M.J.; Kapitza, H.; Pressel, K.; Perrocheau, J.; Maquille, Y. de; Kwakman, L.F.T.; Rouzaud, A.
Conference Paper
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
20123D integration - technology and test strategy
Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Conference Paper
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2010Future perspectives: From packaging to system integration
Wolf, M.J.; Reichl, H.; Lang, K.-D.
Book Article
2010Heterogeneous system integration: A key technology for future microelectronic applications
Wolf, M.J.
Conference Paper
2010Silicon interposer for heterogeneous integration
Wolf, M.J.; Zoschke, K.; Wieland, R.; Klein, M.; Lang, K.-D.; Reichl, H.
Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Design study of the bump on flexible lead by FEA for wafer level packaging
Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Miniaturised sensor node for tire pressure monitoring (e-CUBES)
Schjølberg-Henriksen, K.; Taklo, M.M.V.; Lietaer, N.; Prainsack, J.; Dielacher, M.; Klein, M.; Wolf, M.J.; Weber, J.; Ramm, P.; Seppänen, T.
Conference Paper
2009Reliability study of the bump on flexible lead for wafer level packaging
Kolb, I.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
20083D integration technologies for wireless sensor systems (e-CUBES)
Ramm, P.; Taklo, M.; Weber, J.; Wolf, M.J.
Conference Paper
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.
Conference Paper
20083D wafer level system integration - requirements & technologies
Klumpp, A.; Wolf, M.J.; Ramm, P.; Wunderle, B.; Reichl, H.
Conference Paper
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2008Heterogeneous System Integration - A Key Technology for Future Microelectronic Applications
Reichl, H.; Wolf, M.J.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008System-in-Package
Wolf, M.J.; Reichl, H.
Journal Article
2008Technologies for 3D wafer level heterogeneous integration
Wolf, M.J.; Ramm, P.; Klumpp, A.; Reichl, H.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Wunderle, B.
Book Article
2007Autarkes miniaturisiertes Kommunikationsmodul
Reichel, H.; Wolf, M.J.; Lang, K.D.
Patent
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007From Microelectronic Packaging to System Integration
Wolf, M.J.; Reichl, H.
Conference Paper
2007Reliability Aspects in Heterogeneous System Integration Technologies
Reichl, H.; Wolf, M.J.
Conference Paper
2007System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H.
Conference Paper
2007System Integration Technologies for Wireless Sensor Nodes
Reichl, H.; Wolf, M.J.
Conference Paper
2006Flip chip bumping technology - Status and update
Wolf, M.J.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper, Journal Article
2006Hetero System Integration - Challenges and Requirements for Packaging
Wolf, M.J.; Reichl, H.
Conference Paper
2006Microsystem technologies for smart golf balls
Wolf, M.J.; Schmitz, S.; Amiri Jam, K.; Semionyk, P.; Grosser, V.; Lang, K.-D.
Journal Article
2006System integration technologies for ultra small systems
Reichl, H.; Wolf, M.J.
Conference Paper
2005Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C.; Kim, J.Y.; Wolf, M.J.; Engelmann, G.; Ehrmann, O.; Yu, J.; Reichl, H.
Conference Paper
2005Elektronischer Staub
Wolf, M.J.
Journal Article
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Lead Free Solder / UBM Phase Reactions in Electroplated Bumps
Engelmann, G.; Jurenka, C.; Wolf, M.J.; Dietrich, L.
Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2004The "e-grain" concept building blocks for self-sufficient distributed microsystems
Wolf, M.J.; Schacht, R.; Reichl, H.
Journal Article
2004Characterization of electroplated leadfree bumps
Wolf, M.J.; Jang, S.-Y.; Ehrmann, O.; Reichl, H.; Paik, K.-W.
Journal Article
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.
Journal Article
2004From packaging to system integration – the paradigm shift in microelectronics
Wolf, M.J.; Reichl, H.; Adams, J.; Aschenbrenner, R.
Book Article
2001High Density Bumping for Advanced Packaging
Wolf, M.J.; Ritzdorf, T.; Kuna, I.; Kasap, T.; Worm, O.
Conference Paper