Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Handwashing with soap after potential faecal contact: Global, regional and country estimates
Wolf, J.; Johnston, R.; Freeman, M.C.; Ram, P.K.; Slaymaker, T.; Laurenz, E.; Prüss-Ustün, A.
Journal Article
2019Sichere mobile Authentifizierung
Ernst, Thilo; Menz, Nadja; Svacina, Jaroslav; Welzel, Christian; Wolf, Johannes
Book
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Journal Article, Conference Paper
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Conference Paper
2018Standardisierung von Dünnschichten
Gäbler, J.; Becker, J.; Feuchter, P.; Hinzmann, D.; Winkler, J.; Wolf, J.
Journal Article
2017Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Conference Paper
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Conference Paper
2017Investigation of the refractive index repeatability for tantalum pentoxide coatings, prepared by physical vapor film deposition techniques
Stenzel, O.; Wilbrandt, S.; Wolf, J.; Schürmann, M.; Kaiser, N.; Ristau, D.; Ehlers, H.; Carstens, F.; Schippel, S.; Mechold, L.; Rauhut, R.; Kennedy, M.; Bischoff, M.; Nowitzki, T.; Zöller, A.; Hagedorn, H.; Reus, H.; Hegemann, T.; Starke, K.; Harhausen, J.; Foest, R.; Schumacher, J.
Journal Article
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Conference Paper
2017Recommended approaches to the scientific evaluation of ecotoxicological hazards and risks of endocrine-active substances
Matthiessen, P.; Ankley, G.T.; Biever, R.C.; Bjerregaard, P.; Borgert, C.; Brugger, K.; Blankinship, A.; Chambers, J.; Coady, K.K.; Constantine, L.; Dang, Z.; Denslow, N.D.; Dreier, D.A.; Dungey, S.; Gray, L.E.; Gross, M.; Guiney, P.D.; Hecker, M.; Holbech, H.; Iguchi, T.; Kadlec, S.; Karouna-Renier, N.K.; Katsiadaki, I.; Kawashima, Y.; Kloas, W.; Krueger, H.; Kumar, A.; Lagadic, L.; Leopold, A.; Levine, S.L.; Maack, G.; Marty, S.; Meador, J.; Mihaich, E.; Odum, J.; Ortego, L.; Parrott, J.; Pickford, D.; Roberts, M.; Schaefers, C.; Schwarz, T.; Solomon, K.; Verslycke, T.; Weltje, L.; Wheeler, J.R.; Williams, M.; Wolf, J.C.; Yamazaki, K.
Journal Article
2016Basisprojekt: Smart Tools for Smart Design
Weisheit, Linda; Wolf, Julia; Biedermann, Miriam; Schönecker, Andreas
Report
2016Investigation of the refractive index reproducibility for tantalum pentoxide coatings, prepared by PVD techniques
Stenzel, O.; Wilbrandt, S.; Schürmann, M.; Kaiser, N.; Wolf, J.; Ristau, D.; Ehlers, H.; Carstens, F.; Schippel, S.; Mechold, L.; Rauhut, R.; Kennedy, M.; Bischoff, M.; Nowitzki, T.; Zöller, A.; Hagedorn, H.; Reus, H.; Hegemann, T.; Starke, K.; Harhausen, J.; Foest, R.; Schumacher, J.
Conference Paper
2016Optische Konstanten von Substraten im NIR/MIR-Spektralbereich: Bestimmung mittels Fourier-Transform-Infrarot-(FTIR-)Spektrometrie
Franke, C.; Stenzel, O.; Wilbrandt, S.; Schürmann, M.; Wolf, J.; Todorova, V.; Doherty, B.; Kaiser, N.
Journal Article
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Conference Paper
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Conference Paper
2015Estimation of the composition of coelectron-beam-evaporated thin-mixture films by making use of the Wiener bounds
Franke, Christian; Stenzel, Olaf; Wilbrandt, S.; Wolf, Josephine; Kaiser, Norbert; Tünnermann, A.
Journal Article
2014Comparative analysis of quantum cascade laser modeling based on density matrices and non-equilibrium Green's functions
Lindskog, M.; Wolf, J.M.; Trinite, V.; Liverini, V.; Faist, J.; Maisons, G.; Carras, M.; Aidam, R.; Ostendorf, R.; Wacker, A.
Journal Article
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Investigation of Different Fresnel Lens Designs and Methods to Determine the Optical Efficiency
Wiesenfarth, M.; Steiner, M.; Wolf, J.; Schmidt, T.; Bett, A.W.
Conference Paper
2014An ultrasound monitoring system for concrete structures
Wolf, Julia; Mielentz, Frank; Milmann, Boris; Helmerich, Rosemarie; Wiggenhauser, Herbert; Kurz, Jochen Horst; Moryson, Ralf M.; Samokrutov, Andrey; Alekhin, Sergey; Alver, Ninel
Conference Paper
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Conference Paper
20133D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Parthenopoulos, M.; Goerner, L.; Boettcher, M.; Grafe, J.; Wolf, J.M.
Conference Paper
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Conference Paper
2011Processing of ultrathin 300 mm wafers with carrierless technology
Spiller, S.; Molina, F.; Wolf, J.M.; Grafe, J.; Schenke, A.; Toennies, D.; Hennemeyer, M.; Tabuchi, T.; Auer, H.
Conference Paper
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Journal Article
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
2010Silicon-interposer with high density Cu-filled TSVs
Wieland, R.; Zoschke, K.; Jürgensen, N.; Merkel, R.; Nebrich, L.; Wolf, J.
Conference Paper
20093-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H.
Conference Paper
20093D image sensor SiP with TSV silicon interposer
Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.
Conference Paper
2009Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.
Patent
2009Functional Unit and Method aor the Production thereof
Wolf, J.; Zoschke, K.; Fischer, T.; Topper, M.; Reichl, H.
Patent
2009Innovations Based on Hetero System Integration
Reichl, H.; Wolf, J.; Lang, K.-D.
Journal Article
2009Verbindungsstruktur und Verfahren zur Herstellung einer Verbindungsstruktur
Reichl, H.; Wolf, J.
Patent
2009Wireless activity monitor using 3D integration
Doremalen, R. van; Engen, P. van; Jochems, W.; Rommers, A.; Maas, G.; Cheng, S.; Rydberg, A.; Fritzsch, T.; Wolf, J.; Raedt, W. de; Jansen, R.; Müller, P.; Alarcon, E.; Sanduleanu, M.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.
Patent
2008Profile of the wafer level ECD gold bumps under variable parameters
Jing, X.M.; Engelmann, G.; Chen, D.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2008Verfahren zum Herstellen einer halbleiterbasierten Schaltung und halbleiterbasierte Schaltung mit dreidimensionaler Schaltungstopologie
Reichl, H.; Wolf, J.; Wieland, R.; Zoschke, K.
Patent
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.
Conference Paper
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Lotdepottraeger
Wolf, J.; Chmiel, G.
Patent
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007Smart System Integration - Grundlage zukünftiger Anwendungen im Maschinenbau
Pötter, H.; Großer, V.; Lang, K.-D.; Reichl, H.; Schmitz, S.; Wolf, J.
Journal Article
2007UBM-PAD, Loetkontakt und Verfahren zur Herstellung einer Loetverbindung
Jurenka, C.; Wolf, J.; Engelmann, G.; Reichl, H.
Patent
2007Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
Oppermann, H.; Wolf, J.; Jordan, R.; Schmidt, R.; Engelmann, G.
Patent
2007Verfahren zum Herstellen einer nanoporoesen Schicht
Oppermann, H.; Dietrich, L.; Engelmann, G.; Wolf, J.
Patent
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006Multiple flip-chip assembly for hybrid compact optoelectroi modules using electroplated AuSn solder Bumps
Chu, K.-M.; Lee, J.-S.; Oppermann, H.; Engelmamr, G.; Wolf, J.; Reichl, H.; Jeon, D.Y.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2005Einfluß polymerer Flockungshilfsmittel auf das spezifische Desintegrationsverhalten von kommunalen Überschussschlamm und ihre Wirkung auf die anaerobe Abbaubarkeit
Wolf, J.
Thesis
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Hetero system integration technologies
Wolf, J.; Reichl, H.
Conference Paper
2005Industrially compatible PCB stacking technology for miniaturized sensor systems
Lang, K.D.; Großer, V.; Amiri Jam, K.; Wolf, J.; Semionyk, P.; Schmitz, S.; Rochlitzer, R.; Prietzsch, D.; Reichl, H.
Conference Paper
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2004Trends in RF & Wireless Packaging
Bock, K.; Wolf, J.; Reichl, H.
Conference Paper
20033D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.
Conference Paper
2003CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Schreiber, T.; Reichl, H.; Paik, K.W.
Journal Article
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Packaging for MEMS devices - Stumbling block or enabling solution?
Jung, E.; Wiemer, M.; Grosser, V.; Bock, K.; Wolf, J.
Journal Article, Conference Paper
2002Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Reichl, H.; Paik, K.W.
Journal Article
2002Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Reichl, H.; Paik, K.W.
Journal Article
2002Under bump metallurgy study for Pb-free bumping
Jang, S.Y.; Wolf, J.; Paik, K.W.
Journal Article
2001The advantage of thin film technique in the application of spiral inductors and couplers
Wolf, J.; Schmuckle, F.J.; Petter, D.; Kasap, T.; Heinrich, W.; Reichl, H.
Conference Paper
2001System integration for mobile communications
Reichl, H.; Wolf, J.
Journal Article
2000Characteristics of fritting contacts utilized for micromachined wafer probe cards
Itoh, T.; Suga, T.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J.
Journal Article
2000High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.
Conference Paper
2000Manufacturing CSP's at waferlevel or flip chip without underfill
Simon, J.; Wolf, J.; Kallmayer, C.
Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Journal Article
1999A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J.
Journal Article
1999A MCM-D-type module for the ATLAS pixel detector
Becks, K.-H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Truzzi, C.; Wolf, J.
Conference Paper
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1998A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.
Conference Paper
1998Packaging-Trends. High Tech im Kleinstformat
Reichl, H.; Wolf, J.; Lang, K.-D.
Journal Article
1997BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K.
Conference Paper
1997Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Materials science and engineering. A major topic in the future of microelectronic packaging
Reichl, H.; Wolf, J.
Conference Paper
1997Multichip-modules for high frequency applications
Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H.
Conference Paper
1997System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Alternative solder deposition using transfer technique
Töpper, M.; Wolf, J.; Reichl, H.
Conference Paper
1996Electronic Packaging und Multichip Module
Reichl, H.; Wolf, J.
Book Article
1996Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H.
Conference Paper
1996MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O.
Book Article
1996Sub-threshold operated lead-salt lasers for calibration of IR-astronomy detectors
Lambrecht, A.; Tschirschwitz, M.; Grisar, R.; Schießl, U.; Wolf, J.; Lemke, D.
Journal Article
1995Electronic packaging and multichip modules
Reichl, H.; Wolf, J.
Conference Paper
1995Planare Multichip-Einbettung bei Dünnfilm-Hybriden auf keramischen Substraten
Buschik, K.; Chmiel, G.; Ehrmann, O.; Glaw, V.; Paredes, A.; Wolf, J.
Book Article
1995Verfahren und Vorrichtung zur Herstellung von Lothoeckern
Krabe, D.; Reichl, H.; Wolf, J.
Patent
1993Lead/Tin (95/5 wt%) solder bumps for flip chip applications based on Ti:W(N)/Au/Cu underbump metallization
Wolf, J.; Chmiel, G.; Reichl, H.
Conference Paper
1991Annealing of far infrared photoconductors with infrared diode lasers.
Wolf, J.; Lemke, D.; Schießl, U.; Tacke, M.; Schiessl, U.
Book Article