Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2019 | Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Herfurth, N.; Wu, C.; Beyreuther, A.; Nakamura, T.; Wolf, I. de; Simon-Najasek, M.; Altmann, F.; Croes, K.; Boit, C. | Journal Article |
| 2017 | 3D Localization of liner breakdown's within Cu filled TSV's by backside LIT and PEM defocusing series
Altmann, F.; Grosse, C.; Wolf, I. de; Brand, S. | Conference Paper |
| 2015 | Failure and stress analysis of Cu TSVs using GHz-scanning acoustic microscopy and scanning infrared polariscopy
Wolf, I. de; Khaled, A.; Herms, M.; Wagner, M.; Djuric, T.; Czurratis, P.; Brand, S. | Conference Paper |
| 2014 | Defect detection in through silicon vias by GHz scanning acoustic microscopy: Key ultrasonic characteristics
Phommahaxay, A.; Wolf, I. de; Djuric, T.; Hoffrogge, P.; Brand, S.; Czurratis, P.; Philipsen, H.; Beyer, G.; Struyf, H.; Beyne, E. | Conference Paper |
| 2013 | High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in through silicon vias
Phommahaxay, A.; Wolf, I. de; Hoffrogge, P.; Brand, S.; Czurratis, P.; Philipsen, H.; Civale, Y.; Vandersmissen, K.; Halder, S.; Beyer, G.; Swinnen, B.; Miller, A.; Beyne, E. | Conference Paper |